EPF10K50EFC484-3N

The EPF10K50EFC484-3N is a FLEX 10K family FPGA packaged in a compact 484-BBGA (supplier package 484-FBGA 23×23) surface-mount device. It combines moderate logic capacity with substantial embedded memory and a high I/O count, making it suited for custom logic, memory-intensive functions, and I/O-dense embedded systems in commercial applications.

Designed for system integration, this device supports reconfigurable logic, on-chip RAM, and flexible I/O in a RoHS-compliant package while operating from a 2.3 V to 2.7 V supply and across a commercial temperature range of 0 °C to 70 °C.

Key Features

• Logic Capacity  Approximately 2,880 logic elements with 360 logic array blocks (LABs) and about 199,000 gates, providing a balanced resource set for mid-range logic designs.
• Embedded Memory  Total on-chip RAM of 40,960 bits — approximately 0.041 Mbits — for local buffering, small data structures, and state storage without external memory.
• I/O Density  220 user I/O pins to support multi-interface designs and dense peripheral connections.
• Power and Supply  Operates from a 2.3 V to 2.7 V supply, enabling integration into designs targeting that voltage domain.
• Package & Mounting  484-ball BGA in a 23×23 supplier footprint, surface-mount construction for compact board layouts and efficient PCB area usage.
• Operating Range & Compliance  Commercial grade operation from 0 °C to 70 °C and RoHS-compliant construction.
• Series-level System Features  FLEX 10K family capabilities include in-circuit reconfigurability, built-in JTAG boundary-scan, dedicated carry and cascade chains, low-skew clock distribution, and flexible interconnect architecture for predictable routing and timing.
• I/O Control and System Reliability  Per-pin output control and options such as programmable slew-rate and open-drain/emulation features (series-level), aiding signal integrity and interface flexibility.

Typical Applications

• Embedded Systems  Custom control and logic processing in compact embedded products that benefit from on-chip RAM and a high I/O count.
• Interface and Peripheral Bridging  Protocol adaptation and glue-logic between multiple peripherals where 220 I/Os and programmable logic simplify board-level interfacing.
• Memory-Buffered Logic  Small buffering, FIFOs, and state machines that leverage approximately 40,960 bits of embedded RAM to reduce external memory needs.

Unique Advantages

• Balanced On-Chip Resources: Combines 2,880 logic elements with substantial embedded memory, enabling compact implementations of mid-complexity designs without added external components.
• High I/O Count: 220 user I/Os offer flexibility for multi-peripheral systems and dense connector requirements.
• Compact BGA Packaging: 484-ball BGA (23×23) provides a space-efficient footprint suitable for area-constrained PCBs.
• Series-Level Reconfigurability: FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfiguration simplify development, testing, and field updates.
• Commercial Temperature and RoHS Compliance: Commercial-grade operation (0 °C to 70 °C) combined with RoHS compliance supports mainstream electronics manufacturing and assembly practices.

Why Choose EPF10K50EFC484-3N?

The EPF10K50EFC484-3N delivers a practical combination of logic, embedded memory, and I/O in a compact BGA package for commercial embedded designs. Its resource balance and FLEX 10K series system features make it a good fit for engineers needing reconfigurable logic with integrated memory and robust I/O capabilities.

For projects that require moderate gate capacity, substantial on-chip RAM, and a high pin count in a surface-mount BGA, this device offers a straightforward, RoHS-compliant option with series-level support for in-circuit reconfiguration and boundary-scan testability.

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