EPF10K50EFC484-3

The EPF10K50EFC484-3 is a FLEX-10KE family FPGA from Intel, delivered in a 484-ball BGA package intended for surface-mount applications. It combines a high-density logic array with embedded memory resources to support system-level integration and configurable hardware functions.

Targeted at designers needing on-chip memory and flexible logic for embedded systems and peripheral interfaces, the device supports in-circuit reconfigurability and provides the I/O and power characteristics required for commercial electronic designs.

Key Features

• Logic Capacity — 2,880 logic elements and approximately 199,000 gates, enabling implementation of moderate-complexity digital functions.
• Embedded Memory — Approximately 40,960 bits of on-chip RAM for buffer, LUT, or state-storage requirements.
• I/O — 220 user I/O pins for external peripheral and bus interfacing.
• Architecture — Family-level FLEX 10K features such as embedded arrays for megafunctions, dedicated carry and cascade chains, and FastTrack interconnect for predictable routing behavior.
• Reconfigurability & Test — Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry for board-level test and configuration.
• Power & Supply — Operates from a 2.3 V to 2.7 V supply range, suitable for power-constrained commercial designs.
• Package & Mounting — 484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount footprint to maximize board space efficiency.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Compliance — RoHS compliant, supporting environmental and lead-free assembly requirements.

Typical Applications

• System Integration — Implement System-on-a-Programmable-Chip (SOPC) style integration using on-chip logic and embedded arrays for memory and specialized functions.
• Peripheral and Bus Interfaces — Use the device’s I/O count and family-level PCI support to implement peripheral logic and local-bus interfacing in commercial equipment.
• Embedded Control and Glue Logic — Deploy as configurable control logic, state machines, or protocol converters in embedded systems.
• Memory-Intensive Functions — Leverage the on-chip RAM for small buffers, FIFOs, and other embedded-memory megafunctions.

Unique Advantages

• High-density configurable logic: 2,880 logic elements and ~199,000 gates provide the capacity to consolidate multiple discrete components into a single programmable device.
• Integrated embedded memory: ~40,960 bits of on-chip RAM reduce external memory requirements and simplify board design for data buffering and state storage.
• Generous I/O count: 220 user I/Os support broad peripheral connectivity without additional interface chips.
• Flexible configuration and testability: In-circuit reconfigurability and JTAG boundary-scan support streamline development, deployment, and board-level testing.
• Compact BGA footprint: 484-ball FBGA package enables higher routing density and space-efficient board layouts for compact commercial products.
• Commercial temperature and RoHS compliant: Designed for standard commercial environments and compliant with RoHS assembly practices.

Why Choose EPF10K50EFC484-3?

The EPF10K50EFC484-3 offers a balanced combination of logic density, embedded memory, and I/O resources in a compact surface-mount BGA package, making it suitable for designers consolidating logic, memory, and interface functions in commercial electronic products. Its support for in-circuit reconfiguration and JTAG boundary-scan helps accelerate development and yields a more maintainable board-level test strategy.

This device is appropriate for teams building embedded systems, peripheral controllers, and memory-assisted logic functions that require a configurable hardware foundation with commercial-grade temperature and RoHS compliance.

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