EPF10K50EFC484-1
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA |
|---|---|
| Quantity | 697 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EFC484-1 – FLEX-10KE Field Programmable Gate Array, 2,880 Logic Elements, 40,960 RAM bits, 220 I/O, 484-BBGA
The EPF10K50EFC484-1 is an Intel FLEX 10KE family embedded programmable logic device (FPGA/PLD) in a 484-BBGA package. It combines a dedicated logic array and embedded memory resources to support System-on-a-Programmable-Chip (SOPC) integration for commercial embedded designs.
Targeted at applications requiring moderate logic density, substantial on-chip RAM and a large number of I/O, this device delivers integration and configurability while operating within a commercial temperature range and RoHS compliance.
Key Features
- Logic Capacity 2,880 logic elements and 360 logic array blocks (LABs) provide the core programmable resources for custom digital logic and control functions.
- Embedded Memory 40,960 total RAM bits (embedded array blocks) to implement data buffers, FIFOs, and other on-chip memory functions without reducing logic capacity.
- I/O Density 220 user I/O pins to support rich peripheral interfacing and board-level connectivity.
- Gate Count Approximately 199,000 gates of device capacity for mixed logic and memory implementations.
- Package Options Packaged in a 484-BBGA case; supplier package listed as 484-FBGA (23×23) to maximize board space efficiency.
- Power Specified supply range of 2.3 V to 2.7 V for device operation.
- Commercial Temperature Grade Rated for 0 °C to 70 °C operation suitable for standard commercial embedded systems.
- Family-Level System Features FLEX 10K family capabilities (as provided in the datasheet) such as embedded arrays for megafunctions, in-circuit reconfigurability (ICR) and JTAG boundary-scan support for device configuration and testability.
- I/O Flexibility Family-level I/O features include individual tri-state control, open-drain options and programmable output slew-rate control to manage switching noise and interface behaviors.
- Standards and Compliance RoHS compliant, aligning with lead-free manufacturing requirements.
Typical Applications
- Embedded System Integration Implement SOPC-style integration where on-chip logic and memory combine to replace discrete glue logic and small peripheral components.
- Interface Bridging and Glue Logic Use the device’s 220 I/O pins and programmable logic to implement protocol bridging, bus interfacing and board-level signal management.
- On-Chip Buffering and Data Handling Leverage the 40,960 bits of embedded RAM for FIFOs, buffering and small data stores in communication or control paths.
- Prototyping and Custom Control Rapidly implement and iterate control logic, state machines and custom peripheral functions for commercial embedded prototypes and products.
Unique Advantages
- Balanced Logic and Memory The combination of 2,880 logic elements and 40,960 RAM bits enables both control logic and meaningful on-chip data storage without external memory in many designs.
- High I/O Count 220 I/O pins reduce the need for external buffering and expanders when integrating multiple peripherals and interfaces.
- Configurable System Integration Family-level support for megafunctions and in-circuit reconfigurability helps streamline development of SOPC-style solutions and field updates.
- Commercial-Grade Reliability Rated for 0 °C to 70 °C operation and RoHS compliant for standard commercial embedded product lines.
- Space-Efficient Packaging 484-BBGA / 484-FBGA (23×23) package formats provide a compact footprint for higher-density board layouts.
Why Choose EPF10K50EFC484-1?
The EPF10K50EFC484-1 positions itself as a practical programmable logic device for commercial embedded designs that require a balanced mix of configurable logic, substantial embedded memory, and a high number of I/O. Its FLEX 10K family capabilities—combined with a compact 484-BGA footprint and RoHS compliance—make it suited for products where integration, reconfigurability and board-level I/O density matter.
This device is well suited for engineering teams developing custom control logic, interface bridging, on-chip buffering and SOPC-style integration in commercial temperature environments. Its configuration and test features support iterative development and in-field updates, providing long-term flexibility as product requirements evolve.
Request a quote or submit an inquiry to get pricing, availability and delivery details for the EPF10K50EFC484-1.

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