EPF10K50EFC484-1

IC FPGA 220 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

Quantity 697 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O220Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EFC484-1 – FLEX-10KE Field Programmable Gate Array, 2,880 Logic Elements, 40,960 RAM bits, 220 I/O, 484-BBGA

The EPF10K50EFC484-1 is an Intel FLEX 10KE family embedded programmable logic device (FPGA/PLD) in a 484-BBGA package. It combines a dedicated logic array and embedded memory resources to support System-on-a-Programmable-Chip (SOPC) integration for commercial embedded designs.

Targeted at applications requiring moderate logic density, substantial on-chip RAM and a large number of I/O, this device delivers integration and configurability while operating within a commercial temperature range and RoHS compliance.

Key Features

  • Logic Capacity  2,880 logic elements and 360 logic array blocks (LABs) provide the core programmable resources for custom digital logic and control functions.
  • Embedded Memory  40,960 total RAM bits (embedded array blocks) to implement data buffers, FIFOs, and other on-chip memory functions without reducing logic capacity.
  • I/O Density  220 user I/O pins to support rich peripheral interfacing and board-level connectivity.
  • Gate Count  Approximately 199,000 gates of device capacity for mixed logic and memory implementations.
  • Package Options  Packaged in a 484-BBGA case; supplier package listed as 484-FBGA (23×23) to maximize board space efficiency.
  • Power  Specified supply range of 2.3 V to 2.7 V for device operation.
  • Commercial Temperature Grade  Rated for 0 °C to 70 °C operation suitable for standard commercial embedded systems.
  • Family-Level System Features  FLEX 10K family capabilities (as provided in the datasheet) such as embedded arrays for megafunctions, in-circuit reconfigurability (ICR) and JTAG boundary-scan support for device configuration and testability.
  • I/O Flexibility  Family-level I/O features include individual tri-state control, open-drain options and programmable output slew-rate control to manage switching noise and interface behaviors.
  • Standards and Compliance  RoHS compliant, aligning with lead-free manufacturing requirements.

Typical Applications

  • Embedded System Integration  Implement SOPC-style integration where on-chip logic and memory combine to replace discrete glue logic and small peripheral components.
  • Interface Bridging and Glue Logic  Use the device’s 220 I/O pins and programmable logic to implement protocol bridging, bus interfacing and board-level signal management.
  • On-Chip Buffering and Data Handling  Leverage the 40,960 bits of embedded RAM for FIFOs, buffering and small data stores in communication or control paths.
  • Prototyping and Custom Control  Rapidly implement and iterate control logic, state machines and custom peripheral functions for commercial embedded prototypes and products.

Unique Advantages

  • Balanced Logic and Memory  The combination of 2,880 logic elements and 40,960 RAM bits enables both control logic and meaningful on-chip data storage without external memory in many designs.
  • High I/O Count  220 I/O pins reduce the need for external buffering and expanders when integrating multiple peripherals and interfaces.
  • Configurable System Integration  Family-level support for megafunctions and in-circuit reconfigurability helps streamline development of SOPC-style solutions and field updates.
  • Commercial-Grade Reliability  Rated for 0 °C to 70 °C operation and RoHS compliant for standard commercial embedded product lines.
  • Space-Efficient Packaging  484-BBGA / 484-FBGA (23×23) package formats provide a compact footprint for higher-density board layouts.

Why Choose EPF10K50EFC484-1?

The EPF10K50EFC484-1 positions itself as a practical programmable logic device for commercial embedded designs that require a balanced mix of configurable logic, substantial embedded memory, and a high number of I/O. Its FLEX 10K family capabilities—combined with a compact 484-BGA footprint and RoHS compliance—make it suited for products where integration, reconfigurability and board-level I/O density matter.

This device is well suited for engineering teams developing custom control logic, interface bridging, on-chip buffering and SOPC-style integration in commercial temperature environments. Its configuration and test features support iterative development and in-field updates, providing long-term flexibility as product requirements evolve.

Request a quote or submit an inquiry to get pricing, availability and delivery details for the EPF10K50EFC484-1.

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