EPF10K50EFC256-2

The EPF10K50EFC256-2 is a FLEX-10KE® field programmable gate array (FPGA) in a 256-ball BGA package designed for surface-mount applications. It delivers a mid-density programmable logic fabric with on-chip RAM and a large I/O count suitable for embedded system integration and custom digital logic.

Built for commercial-grade designs, this device combines 2,880 logic elements and 40,960 bits of embedded RAM with 191 user I/Os and a compact 256-FBGA (17×17) footprint, providing a balance of integration, I/O capability, and board-space efficiency.

Key Features

• Logic Capacity 2,880 logic elements and 360 LABs provide flexible resources for implementing combinational and sequential logic.
• Embedded Memory 40,960 bits of on-chip RAM for FIFOs, buffers, and small storage blocks without external memory.
• I/O and Interface Density 191 user I/O pins support rich external connectivity and interface options.
• Gate Count Approximately 199,000 gates for mapping a wide range of digital functions.
• Power and Supply Operates from a supply voltage of 2.3 V to 2.7 V, enabling integration with systems using this voltage domain.
• Package and Mounting 256-FBGA (17×17) package in a surface-mount form factor delivers high pin density in a compact footprint.
• Commercial Grade Rated for 0 °C to 70 °C operation for general-purpose, commercial-environment deployments.
• Compliance RoHS compliant for reduced environmental impact in manufacturing.
• In-system Configuration and Test Supports in-circuit reconfigurability and includes JTAG boundary-scan test capability (IEEE Std. 1149.1) as part of the FLEX 10K family feature set.
• High-speed Routing and Arithmetic Support Family features include dedicated carry and cascade chains and a continuous routing structure to support arithmetic functions and predictable interconnect delays.

Typical Applications

• Embedded Systems: Integrate custom control logic, on-chip RAM buffers, and multiple I/Os for compact system designs.
• Interface Bridging: Implement protocol bridging and I/O expansion between multiple digital domains using available I/O pins and logic fabric.
• Control and Automation: Implement control logic, finite state machines, and timing-critical functions leveraging dedicated arithmetic chains and clock distribution.
• Prototyping and Development Rapidly iterate hardware designs with in-circuit reconfigurability and JTAG support for testing and debugging.

Unique Advantages

• Balanced Integration: Combines a moderate logic element count with substantial on-chip RAM and high I/O count to reduce external components and simplify PCB design.
• Compact, High-density Package: The 256-FBGA (17×17) package delivers many I/Os and logic in a small board footprint for space-constrained applications.
• Flexible Configuration and Test: In-circuit reconfigurability and JTAG boundary-scan support speed development cycles and ease board-level testing.
• Design Predictability: Dedicated carry and cascade chains plus family routing features support efficient implementation of arithmetic and high-fan-in logic functions.
• RoHS Compliance: Simplifies environmental compliance for product manufacturing and procurement.

Why Choose EPF10K50EFC256-2?

The EPF10K50EFC256-2 positions itself as a practical mid-density FPGA option for commercial embedded designs that need a balance of logic resources, embedded RAM, and a high number of I/Os in a compact package. Its feature set supports both control-oriented and interface-heavy applications where board-space efficiency and on-chip memory reduce BOM complexity.

This device is well suited to engineers and procurement teams seeking a commercially rated, RoHS-compliant FPGA with in-system configurability and standard test features for streamlined development and production validation.

Request a quote or submit a procurement inquiry to check availability and lead times for the EPF10K50EFC256-2.