EPF10K50EFC256-2N

The EPF10K50EFC256-2N is a FLEX-10KE family FPGA from Intel designed for commercial embedded logic applications. It integrates 2,880 logic elements and on-chip memory to support complex combinational and sequential logic, enabling system-level functions and megafunction implementation.

This surface-mount FPGA is optimized for compact board designs with a 256-ball BGA package and 191 user I/O pins, making it suitable for commercial embedded systems, interface bridging, and logic acceleration tasks where reconfigurability and dense integration are required.

Key Features

• Logic Capacity — 2,880 logic elements and 199,000 gates provide substantial programmable logic resources for mid-density designs.
• Embedded Memory — 40,960 total RAM bits of embedded memory enable storage for FIFOs, buffers, and small on-chip data structures.
• I/O and Connectivity — 191 user I/O pins support a wide range of external interfaces and signal routing in a compact footprint.
• Power Supply — Designed for operation from 2.3 V to 2.7 V, providing defined supply requirements for system power design.
• Packaging — 256-BGA / 256-FBGA (17×17) package for high-density board integration and reliable solder mounting.
• Commercial Temperature Grade — Rated for operation from 0 °C to 70 °C for commercial applications.
• Board-Level Test and Reconfiguration — Supports JTAG boundary-scan (IEEE Std. 1149.1) and in-circuit reconfigurability via external configuration devices or intelligent controllers, aiding manufacturing test and field updates.
• Clock and Routing Features — Family-level features include low-skew clock distribution and clock management options for predictable timing and reduced clock skew.
• Surface Mount — Component is specified for surface-mount assembly to support modern PCB manufacturing processes.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Embedded Control and Logic — Implement custom state machines, protocol handlers, and control logic using available logic elements and on-chip memory.
• Interface Bridging — Act as a programmable interface between subsystems where 191 I/O pins enable flexible signal routing and protocol adaptation.
• System Integration (SOPC) — Integrate specialized logic and memory megafunctions for compact system-on-programmable-chip solutions.
• Prototyping and Development — Use the reprogrammable nature and JTAG support for iterative design validation and in-circuit updates.

Unique Advantages

• Mid-density integration: 2,880 logic elements and 199,000 gates provide a balance of logic capacity without the footprint of larger devices.
• Embedded memory resources: 40,960 bits of on-chip RAM reduce dependence on external memory for many control and buffering tasks.
• Flexible I/O count: 191 user I/O pins give designers broad signal access for mixed-signal and multi-protocol designs.
• Testability and field serviceability: JTAG boundary-scan and in-circuit reconfiguration streamline manufacturing test and enable updates after deployment.
• Compact package: 256-FBGA (17×17) packaging supports high-density PCB layouts while maintaining robust solderability.
• Commercial-grade reliability: Rated for 0 °C to 70 °C operation and RoHS compliance for mainstream commercial applications.

Why Choose EPF10K50EFC256-2N?

The EPF10K50EFC256-2N positions itself as a flexible, mid-density FPGA option within Intel’s FLEX 10K family, combining programmable logic, embedded memory, and comprehensive I/O in a compact BGA package. Its mix of logic elements, on-chip RAM, and board-level test capabilities make it well suited for commercial embedded systems that require reconfigurability and modest capacity.

This device is appropriate for designers seeking a commercially rated programmable device with on-chip resources and established family-level features for clocking, routing, and JTAG-based test and configuration.

Request a quote or submit a procurement inquiry to begin evaluating EPF10K50EFC256-2N for your next embedded design project.