EPF10K50EFI256-2

The EPF10K50EFI256-2 is an Intel FLEX-10KE family field programmable gate array (FPGA) offered in a 256-ball BGA package. It combines a logic array and embedded memory resources to support system-on-programmable-chip (SOPC) integration and megafunction implementation for industrial applications.

Targeted uses include embedded control, custom logic integration and systems requiring configurable I/O and on-chip RAM. The device is specified for industrial temperature range and RoHS-compliant manufacturing.

Key Features

• Logic Capacity Approximately 2,880 logic elements organized across 360 logic array blocks, enabling mid-range programmable logic implementations.
• Embedded Memory Approximately 40,960 bits of on-chip RAM to implement buffers, FIFOs and specialized memory-based functions without reducing logic capacity.
• I/O and Gate Count 191 user I/O pins and approximately 199,000 gates for flexible peripheral interfacing and substantial system logic.
• Configurable I/O and System Features Family-level features include in-circuit reconfigurability via external configuration device or JTAG, multiple global clock signals, dedicated carry and cascade chains, and programmable I/O options.
• Power and Supply Device supply specified for 2.3 V to 2.7 V operation to match target system voltage domains.
• Package and Mounting Surface-mount 256-ball FBGA (17 × 17) package for compact board-level integration and high pin density.
• Industrial Temperature Range Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
• Standards and Compliance RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control Implement custom control logic, motor drive sequencing and industrial communication preprocessing using on-chip logic and embedded RAM.
• Embedded Systems and SOPC Integrate processors, memory buffers and peripheral logic in a single programmable device for compact embedded solutions.
• Communications and Interface Bridging Use configurable I/O and on-chip memory to implement protocol bridging, data buffering and custom interface logic.
• Prototyping and Proof-of-Concept Evaluate and iterate digital designs quickly with in-circuit reconfigurability and substantial logic plus RAM resources.

Unique Advantages

• Integrated Logic and Memory: Combines approximately 2,880 logic elements with roughly 40,960 bits of embedded RAM, reducing the need for external memory in many designs.
• Rich I/O Count: 191 user I/Os provide board-level flexibility for connecting peripherals, sensors and interfaces without immediate GPIO expansion.
• Compact Package: 256-FBGA (17 × 17) surface-mount packaging offers a high-density solution for space-constrained circuit boards.
• Industrial Qualification: Specified for −40 °C to 85 °C operation to meet typical industrial deployment requirements.
• Reconfigurability: Family-level support for in-circuit reprogramming and JTAG boundary-scan enables iterative development and field updates.
• RoHS-Compliant: Manufactured to RoHS requirements for regulatory and supply-chain compatibility.

Why Choose EPF10K50EFI256-2?

The EPF10K50EFI256-2 positions itself as a mid-range FLEX-10KE family FPGA that balances logic capacity, embedded memory and I/O density in a compact 256-FBGA package. Its combination of approximately 2,880 logic elements, around 40,960 bits of embedded RAM and 191 I/Os makes it well suited to industrial embedded control, interface bridging and SOPC-style integration where on-chip memory and configurable logic reduce external BOM complexity.

For design teams seeking a reprogrammable, RoHS-compliant device rated for industrial temperatures and packaged for high-density board layouts, the EPF10K50EFI256-2 offers a stable foundation with family-level features such as in-circuit reconfigurability and dedicated arithmetic/cascade resources to support common digital functions.

Request a quote or submit a product inquiry to receive pricing and availability information for the EPF10K50EFI256-2.