EPF10K50EQC208-2

The EPF10K50EQC208-2 is a FLEX-10KE family field programmable gate array (FPGA) device from Intel. Built on the FLEX 10K embedded programmable logic architecture, this device combines a logic array and embedded memory resources to support System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as on-chip memory and specialized logic.

Its combination of 2,880 logic elements, 40,960 bits of embedded RAM and 147 I/O pins makes it suitable for reconfigurable embedded designs where on-chip memory, dense logic and flexible I/O are required within a 208-pin BFQFP package.

Key Features

• Logic Capacity — 2,880 logic elements and 199,000 gates provide on-chip programmable logic for implementing control, glue logic or custom processing blocks.
• Embedded Memory — 40,960 bits of on-chip RAM support lookup tables, FIFOs, packet buffers and other memory-intensive megafunctions directly inside the device.
• I/O and Packaging — 147 user I/O pins in a surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for broad board-level connectivity and system integration.
• Power and Temperature — Operates from a 2.3 V to 2.7 V supply and is specified for commercial operating temperatures of 0 °C to 70 °C.
• Series-Level System Features — Built on the FLEX 10K family architecture, includes series-supported capabilities such as in-circuit reconfigurability, built-in JTAG boundary-scan (IEEE 1149.1) and clock-management options like ClockLock and ClockBoost.
• Mounting and Compliance — Surface-mount device with RoHS compliance for modern PCB assembly and environmental requirements.

Typical Applications

• Embedded Systems — Implement custom control logic, protocol bridges or hardware accelerators using the device’s on-chip logic and embedded RAM.
• Board-Level Prototyping — Rapidly iterate hardware designs and validate system integration with reprogrammable logic and JTAG boundary-scan support.
• Data buffering and processing — Use the device’s embedded RAM for packet buffering, FIFOs or small lookup tables in communication or control subsystems.
• User Interface and Glue Logic — Consolidate multiple discrete functions into a single FPGA for I/O management, signal conditioning and interface logic.

Unique Advantages

• Balanced logic and memory resources: 2,880 logic elements combined with 40,960 bits of on-chip RAM enable compact implementation of mixed compute-and-buffer functions on a single device.
• Flexible I/O in a compact package: 147 user I/Os in a 208-BFQFP package provide dense connectivity while keeping board footprint predictable for surface-mount assembly.
• Reconfigurability and testability: In-circuit reconfigurability and built-in JTAG boundary-scan simplify development, debugging and field updates without consuming user logic.
• Commercial-grade operating range: Designed for 0 °C to 70 °C operation and a 2.3 V–2.7 V supply, aligning with typical commercial embedded system requirements.
• RoHS-compliant manufacturing: Supports modern environmental and assembly standards for regulatory and supply-chain compatibility.

Why Choose EPF10K50EQC208-2?

The EPF10K50EQC208-2 provides a practical blend of programmable logic, embedded RAM and I/O density in a surface-mount 208-BFQFP package. It is suited to engineers looking to consolidate discrete logic and small memory functions into a single reconfigurable device while retaining board-level flexibility and in-circuit programmability.

Backed by the FLEX 10K family architecture and on-chip testability features, this device is a good fit for commercial embedded designs that require on-board reprogrammability, rapid prototyping and compact system integration.

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