EPF10K50EQC240-1

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

Quantity 1,756 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EQC240-1 – FLEX-10KE FPGA, 240-BFQFP

The EPF10K50EQC240-1 is a FLEX 10K family field-programmable gate array (FPGA) in a 240-pin BFQFP surface-mount package. It combines a dedicated logic array with embedded memory resources to enable system-level integration and on-chip implementation of specialized functions.

Designed for commercial-grade embedded applications, this device targets designs that require moderate logic density, significant I/O capability, and reconfigurable on-board memory for functions such as glue logic, protocol interfaces, and small on-chip buffering.

Key Features

  • Core Logic  Contains 2,880 logic elements and 360 logic array blocks (LABs), delivering approximately 199,000 gates of combinational and registered logic for implementing custom digital functions.
  • Embedded Memory  Provides approximately 40,960 bits of on-chip RAM to support FIFOs, small buffers, and other memory-intensive logic without consuming additional logic elements.
  • I/O Density  Up to 189 user I/O pins enable extensive external interfacing for sensors, peripherals, and bus-level connections in space-constrained designs.
  • Package & Mounting  Supplied in a 240-BFQFP (240-PQFP, 32×32) surface-mount package suitable for standard PCB assembly workflows.
  • Power Supply  Operates from a 2.3 V to 2.7 V supply range to match system power rails specified for this part.
  • Operating Range & Grade  Commercial-grade device rated for 0 °C to 70 °C operation and RoHS compliant.
  • Family-Level System Features  Series-level capabilities include in-circuit reconfigurability via external configuration devices or JTAG, built-in IEEE 1149.1-compliant boundary-scan (JTAG) circuitry, and fast, structured interconnect for predictable routing delays.

Typical Applications

  • Commercial Embedded Systems  Implement control logic, protocol handling and interface glue for compact commercial electronics requiring reconfigurable logic.
  • I/O-Intensive Interfaces  Use the 189 user I/Os to aggregate signals, buffer peripherals, or bridge buses in systems with multiple external devices.
  • Memory-Assisted Logic  Leverage the on-chip RAM for small FIFOs, packet buffering or temporary data storage inside custom logic blocks.
  • Prototype and Development Platforms  Suitable for developers building and validating system-on-programmable-chip integration thanks to reconfigurability and family-level tool support.

Unique Advantages

  • Moderate-density integration:  2,880 logic elements and roughly 199,000 gates provide the capacity to consolidate multiple discrete functions into a single programmable device, reducing BOM complexity.
  • On-chip RAM reduces external components:  Approximately 40,960 bits of embedded memory allow small buffering and state retention without additional external memory devices.
  • High I/O count for flexible interfacing:  189 I/Os support diverse peripheral connectivity and simplify board-level routing for multi-signal designs.
  • Reconfigurability and test support:  Built-in JTAG boundary-scan and in-circuit reprogramming options ease development, validation, and field updates.
  • Commercial-grade, RoHS compliant:  Rated for 0 °C to 70 °C operation and compliant with RoHS environmental requirements for mainstream commercial products.
  • Standard surface-mount packaging:  240-BFQFP package supports conventional PCB manufacturing and assembly processes.

Why Choose EPF10K50EQC240-1?

The EPF10K50EQC240-1 positions itself as a flexible, reprogrammable solution for commercial embedded designs that need a balance of logic capacity, embedded RAM, and a high number of I/Os in a compact package. Its combination of 2,880 logic elements, approximately 40,960 bits of on-chip RAM, and 189 user I/Os enables consolidation of glue logic, interface functions, and small memory tasks onto a single device.

This device is well suited to engineers building mid-range programmable systems who require on-board reconfigurability, boundary-scan testability, and a standardized surface-mount package. Family-level tool support and structured interconnect capabilities help streamline design, debugging, and integration activities across product iterations.

Request a quote or submit an inquiry to obtain pricing and availability details for the EPF10K50EQC240-1. Our team can provide lead-time and ordering information to support your design schedule.

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