EPF10K50EQC240-1
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP |
|---|---|
| Quantity | 1,756 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 6 (Time on Label) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EQC240-1 – FLEX-10KE FPGA, 240-BFQFP
The EPF10K50EQC240-1 is a FLEX 10K family field-programmable gate array (FPGA) in a 240-pin BFQFP surface-mount package. It combines a dedicated logic array with embedded memory resources to enable system-level integration and on-chip implementation of specialized functions.
Designed for commercial-grade embedded applications, this device targets designs that require moderate logic density, significant I/O capability, and reconfigurable on-board memory for functions such as glue logic, protocol interfaces, and small on-chip buffering.
Key Features
- Core Logic Contains 2,880 logic elements and 360 logic array blocks (LABs), delivering approximately 199,000 gates of combinational and registered logic for implementing custom digital functions.
- Embedded Memory Provides approximately 40,960 bits of on-chip RAM to support FIFOs, small buffers, and other memory-intensive logic without consuming additional logic elements.
- I/O Density Up to 189 user I/O pins enable extensive external interfacing for sensors, peripherals, and bus-level connections in space-constrained designs.
- Package & Mounting Supplied in a 240-BFQFP (240-PQFP, 32×32) surface-mount package suitable for standard PCB assembly workflows.
- Power Supply Operates from a 2.3 V to 2.7 V supply range to match system power rails specified for this part.
- Operating Range & Grade Commercial-grade device rated for 0 °C to 70 °C operation and RoHS compliant.
- Family-Level System Features Series-level capabilities include in-circuit reconfigurability via external configuration devices or JTAG, built-in IEEE 1149.1-compliant boundary-scan (JTAG) circuitry, and fast, structured interconnect for predictable routing delays.
Typical Applications
- Commercial Embedded Systems Implement control logic, protocol handling and interface glue for compact commercial electronics requiring reconfigurable logic.
- I/O-Intensive Interfaces Use the 189 user I/Os to aggregate signals, buffer peripherals, or bridge buses in systems with multiple external devices.
- Memory-Assisted Logic Leverage the on-chip RAM for small FIFOs, packet buffering or temporary data storage inside custom logic blocks.
- Prototype and Development Platforms Suitable for developers building and validating system-on-programmable-chip integration thanks to reconfigurability and family-level tool support.
Unique Advantages
- Moderate-density integration: 2,880 logic elements and roughly 199,000 gates provide the capacity to consolidate multiple discrete functions into a single programmable device, reducing BOM complexity.
- On-chip RAM reduces external components: Approximately 40,960 bits of embedded memory allow small buffering and state retention without additional external memory devices.
- High I/O count for flexible interfacing: 189 I/Os support diverse peripheral connectivity and simplify board-level routing for multi-signal designs.
- Reconfigurability and test support: Built-in JTAG boundary-scan and in-circuit reprogramming options ease development, validation, and field updates.
- Commercial-grade, RoHS compliant: Rated for 0 °C to 70 °C operation and compliant with RoHS environmental requirements for mainstream commercial products.
- Standard surface-mount packaging: 240-BFQFP package supports conventional PCB manufacturing and assembly processes.
Why Choose EPF10K50EQC240-1?
The EPF10K50EQC240-1 positions itself as a flexible, reprogrammable solution for commercial embedded designs that need a balance of logic capacity, embedded RAM, and a high number of I/Os in a compact package. Its combination of 2,880 logic elements, approximately 40,960 bits of on-chip RAM, and 189 user I/Os enables consolidation of glue logic, interface functions, and small memory tasks onto a single device.
This device is well suited to engineers building mid-range programmable systems who require on-board reconfigurability, boundary-scan testability, and a standardized surface-mount package. Family-level tool support and structured interconnect capabilities help streamline design, debugging, and integration activities across product iterations.
Request a quote or submit an inquiry to obtain pricing and availability details for the EPF10K50EQC240-1. Our team can provide lead-time and ordering information to support your design schedule.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018