EPF10K50EQC240-3

The EPF10K50EQC240-3 is a FLEX-10KE family field programmable gate array (FPGA) offered in a 240-pin BFQFP package. It combines a general-purpose logic array with embedded memory resources to implement custom logic, buffering, and interface functions for commercial embedded designs.

Designed for surface-mount assembly and commercial-temperature applications, this device targets designers who need a reprogrammable logic element with substantial I/O and on-chip RAM capacity for system integration and prototype-through-production flexibility.

Key Features

• Core logic — 2,880 logic elements provide programmable combinational and sequential logic capacity for glue logic, state machines, and custom functions.
• Embedded memory — Approximately 40,960 bits of on-chip RAM enable local buffering and storage without reducing logic capacity.
• I/O density — 189 user I/O pins support wide parallel interfaces and multiple peripheral connections on a single device.
• Gate count — 199,000 gates available for combined logic and RAM implementations as specified for this part.
• Supply and temperature — Operates from 2.3 V to 2.7 V and is specified for commercial operating temperatures (0 °C to 70 °C).
• Package and mounting — Surface-mount 240-BFQFP (supplier package: 240-PQFP, 32×32 mm) provides a compact, board-ready footprint.
• Configuration and test — Supports in-circuit reconfigurability via external configuration device or JTAG port; includes built-in JTAG boundary-scan test circuitry.
• System features from FLEX 10K family — Embedded array for megafunctions, configurable clock distribution options, dedicated carry and cascade chains, and programmable I/O options are available within the FLEX 10K family architecture.
• Regulatory — RoHS-compliant.

Typical Applications

• Embedded control and glue logic — Implement device control, protocol bridging, and state machines where reprogrammability and integration reduce board complexity.
• Buffered data paths — Use on-chip RAM for temporary storage, FIFOs or data buffering between subsystems to simplify PCB routing and improve throughput.
• High-pin-count peripheral interfaces — 189 I/O pins support parallel buses, display interfaces, or multi-channel sensor connectivity in commercial equipment.
• Prototyping and development — Reprogrammable logic and JTAG configuration enable iterative development and in-system updates for prototype validation and product refinement.

Unique Advantages

• Balanced logic and memory — The combination of 2,880 logic elements and ~40,960 bits of RAM supports mixed logic-plus-buffering designs without sacrificing capacity.
• High I/O availability — 189 user I/Os allow consolidation of multiple peripheral connections onto a single device, reducing external components.
• Reconfigurability — In-circuit reprogramming via external configuration devices or JTAG enables field updates and rapid design iteration.
• Commercial temperature and surface-mount package — Suited to standard commercial products and assemblies with a 240-pin BFQFP surface-mount footprint for dense board designs.
• Testability — Built-in JTAG boundary-scan simplifies board-level test and integration verification during manufacturing.

Why Choose EPF10K50EQC240-3?

The EPF10K50EQC240-3 delivers a practical balance of programmable logic, embedded memory, and high I/O count in a surface-mount 240-BFQFP package for commercial embedded designs. Its FLEX-10K family capabilities—on-chip RAM, dedicated arithmetic/cascade structures, and JTAG configurability—make it suitable for designs that require in-system reconfiguration and significant local buffering.

This device is well suited to engineering teams building prototypes or production devices where reprogrammability, I/O density, and moderate logic capacity are priorities. The commercial-grade temperature range and RoHS compliance support mainstream product development and manufacturing workflows.

Request a quote or submit a sales inquiry to evaluate EPF10K50EQC240-3 for your next embedded design project.