EPF10K50EQI240-2N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

Quantity 790 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EQI240-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

The EPF10K50EQI240-2N is a FLEX 10K family field programmable gate array (FPGA) offered in a 240‑pin BFQFP package. It combines a logic array and embedded memory to deliver reconfigurable hardware suitable for industrial embedded systems and custom digital functions.

With 2,880 logic elements, 40,960 bits of on-chip RAM and 189 user I/O pins, this industrial‑grade device targets applications that require moderate logic density, substantial embedded memory and flexible I/O in a surface‑mount PQFP footprint.

Key Features

  • Core logic — 2,880 logic elements and 199,000 gates for implementing custom combinational and sequential logic functions.
  • Embedded memory — 40,960 total RAM bits of on‑chip memory to support buffers, FIFOs and state storage without external RAM.
  • I/O density — 189 user I/O pins to handle multiple interfaces, parallel buses or mixed‑signal board-level connectivity.
  • Reconfigurability and test — In‑circuit reconfigurability via external configuration device or JTAG, and built‑in JTAG boundary‑scan (IEEE 1149.1) for board test and debug.
  • Power supply — Specified supply range of 2.3 V to 2.7 V for system power planning.
  • Package and mounting — 240‑BFQFP (supplier package: 240‑PQFP 32×32), surface‑mount device for PCB assembly.
  • Industrial temperature range — Rated for operation from −40 °C to 85 °C for industrial applications.
  • Compliance — RoHS compliant.
  • FLEX 10K family capabilities — Benefits from family features such as embedded arrays for megafunctions, dedicated carry and cascade chains, low‑skew clock distribution, and software design support for automated place‑and‑route.

Typical Applications

  • Industrial automation — Implement custom control logic, I/O aggregation and protocol handling within industrial controllers using the device’s logic and I/O resources.
  • Communications and networking — Use on‑chip RAM and programmable logic for packet buffering, protocol translation or custom framing functions.
  • Test and measurement — Integrate data capture, preprocessing and custom timing logic; JTAG boundary‑scan aids board validation and debug.
  • Embedded system prototyping — Rapidly iterate hardware functions and offload specialized logic from software with a reconfigurable FPGA platform.

Unique Advantages

  • Reconfigurable integration: Combines logic and 40,960 bits of embedded RAM to consolidate functions that would otherwise require multiple components.
  • High I/O capacity: 189 user I/O pins simplify board‑level interfacing and reduce external bus glue logic.
  • Industrial readiness: Rated for −40 °C to 85 °C and supplied in a surface‑mount 240‑pin PQFP package suitable for industrial deployments.
  • Built‑in testability: IEEE‑compliant JTAG boundary‑scan and in‑circuit reconfiguration streamline production test and field updates.
  • FLEX 10K ecosystem: Access to family features such as dedicated carry/cascade chains and automated place‑and‑route support to accelerate development.

Why Choose EPF10K50EQI240-2N?

The EPF10K50EQI240-2N provides a balanced combination of programmable logic, embedded memory and high I/O count in an industrial‑grade, RoHS‑compliant package. It is well suited to designs that require moderate logic capacity, substantial on‑chip RAM and flexible interfacing in a surface‑mount PQFP footprint.

Engineers developing industrial control, communications or test equipment can leverage the FLEX 10K family features and on‑chip resources to reduce board complexity, streamline testing and support in‑field reconfiguration.

Request a quote or submit an inquiry to check pricing, availability and lead time for EPF10K50EQI240-2N.

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