EPF10K50ETC144-3

The EPF10K50ETC144-3 is a FLEX-10KE family field programmable gate array (FPGA) IC from Intel, designed for commercial embedded logic applications. It combines a mid-range logic fabric with on-chip RAM and flexible I/O to support a wide range of system functions in compact surface-mount packages.

Targeted at designers building embedded control, communications, and general-purpose programmable logic solutions, this device delivers a balance of logic capacity, embedded memory, and package density for space-constrained boards.

Key Features

• Core Logic — 2,880 logic elements with 360 logic array blocks, providing substantial programmable logic resources for mid-range designs.
• On-chip Memory — 40,960 bits of embedded RAM to implement buffers, FIFOs, and small memory structures directly on-chip.
• Gate Count — 199,000 gates reported for system-level design planning and resource estimation.
• I/O Density — 102 user I/O pins to interface with peripherals, sensors, and external devices on your board.
• Power Supply — Operates from a 2.3 V to 2.7 V supply range, suitable for common commercial power rails.
• Commercial Temperature Range — Rated for 0 °C to 70 °C for standard commercial deployments.
• Package and Mounting — 144-pin LQFP surface-mount package (supplier package listed as 144-TQFP, 20 × 20 mm) for straightforward PCB assembly in dense layouts.
• Design and Test Support (Family Features) — Family-level functionality includes built-in JTAG boundary-scan for board test, in-circuit reconfigurability options, low-skew clock distribution, and dedicated carry/cascade chains for efficient arithmetic and high-fan-in logic (features described in the FLEX 10K family documentation).
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Embedded Control — Implement custom state machines, protocol bridges, and control logic with on-chip RAM and flexible I/O.
• Communications and Interfaces — Use the device to create interface adaptors, data packing/serializing logic, and peripheral glue for mid-range communications equipment.
• Test & Measurement — Deploy as user-configurable logic for signal conditioning, timing generation, and data buffering in test instruments.
• Consumer & Commercial Electronics — Integrate custom user interfaces, control logic, and peripheral management into compact product boards using the 144-LQFP package.

Unique Advantages

• Balanced Integration: 2,880 logic elements paired with 40,960 bits of embedded RAM reduce external memory needs and simplify board-level design.
• Flexible I/O Count: 102 available I/O pins give designers headroom to connect sensors, displays, and peripherals without immediate need for I/O expanders.
• Compact Packaging: The 144-pin LQFP/TQFP footprint provides a space-efficient mounting solution suitable for constrained PCBs while remaining easy to assemble.
• Commercial-Grade Reliability: Rated for 0 °C to 70 °C operation and RoHS compliant, making it suitable for mainstream commercial products and deployments.
• Family-Level Tooling and Features: FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfigurability (described in the family documentation) support prototyping, programming, and board-level test flows.

Why Choose EPF10K50ETC144-3?

The EPF10K50ETC144-3 offers a practical combination of logic capacity, on-chip memory, and I/O for commercial embedded designs requiring mid-range programmable logic. Its 144-pin surface-mount package and 2.3–2.7 V supply range make it straightforward to integrate into compact boards where on-chip RAM and programmable logic reduce BOM complexity.

Choose this device when you need a field-programmable approach to implement custom interfaces, control logic, or data handling functions while leveraging family-level features such as JTAG test support and reconfigurability for development and production workflows.

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