EPF10K50ETI144-3

The EPF10K50ETI144-3 is a FLEX-10KE family embedded programmable logic device designed for reconfigurable system integration. It combines a logic array with embedded array blocks (EABs) to support memory-intensive functions and general-purpose logic in a single surface-mount package.

Targeted at industrial and embedded applications, this device delivers a balance of logic capacity, on-chip RAM, and I/O density while operating from a 2.3 V to 2.7 V supply and an industrial temperature range of −40 °C to 85 °C.

Key Features

• Logic Capacity  Provides 2,880 logic elements and up to 199,000 maximum system gates, enabling mid-density programmable logic designs.
• Embedded Memory  Includes 10 embedded array blocks (EABs) and a total of 40,960 RAM bits (approximately 0.041 Mbits) for dual-port memory and buffering tasks.
• I/O and Interface  102 user I/O pins support flexible interfacing to peripherals, sensors, and external devices in a single-chip solution.
• Clocking and Arithmetic Support  Built-in low-skew clock distribution, up to six global clocks, dedicated carry and cascade chains for high-speed arithmetic and wide fan‑in logic.
• Configuration and Test  In-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE Std. 1149.1 JTAG boundary-scan for board-level test access.
• Power and Voltage  Fabricated to operate with a 2.5 V internal supply; device I/O powered from a 2.3 V to 2.7 V supply for system-level power planning.
• Package and Mounting  144-LQFP (supplier package 144-TQFP 20×20), surface-mount construction for compact PCB implementation.
• Environmental and Grade  Industrial-grade device with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

• Industrial Control  Use the FPGA for real-time control logic, sensor aggregation, and interface translation thanks to its reconfigurability and industrial temperature rating.
• Embedded System Integration  Integrate custom peripherals, glue logic, and on-chip dual-port memory functions to reduce external components and simplify board design.
• Communications and I/O Bridging  Leverage the 102 user I/O pins and internal memory blocks to implement protocol bridges, buffering, and intermediate processing stages.
• Prototyping and Custom Logic  Ideal for mid-density logic development where iterative in-circuit reconfiguration and boundary-scan testability accelerate development cycles.

Unique Advantages

• Integrated Memory and Logic:  Approximately 40,960 bits of embedded RAM combined with 2,880 logic elements lets you implement memory-heavy megafunctions without sacrificing logic capacity.
• Reconfigurable System-on-Chip:  Embedded array blocks and flexible interconnect enable system-level integration—reducing BOM and board complexity.
• Robust Industrial Operation:  Industrial temperature rating (−40 °C to 85 °C) and surface-mount 144-LQFP package support deployment in demanding environments.
• Built-in Test and Configuration:  JTAG boundary-scan and in-circuit reconfigurability simplify production test and field updates.
• Deterministic Clocking and Arithmetic:  Low-skew clock trees, multiple global clocks, and dedicated carry/cascade chains accelerate implementation of high-speed arithmetic and timing-critical logic.

Why Choose EPF10K50ETI144-3?

The EPF10K50ETI144-3 offers a balanced combination of mid-range logic capacity, dedicated on-chip memory, and flexible I/O in a compact 144-LQFP package suited for industrial and embedded designs. Its family-level features—such as low-skew clocking, dedicated arithmetic chains, and JTAG-based testability—help reduce board-level complexity while enabling reconfigurable designs.

This device is well suited for engineers and design teams requiring a dependable, reprogrammable platform for integrating custom logic, buffering, and I/O interfacing, with the long-term benefits of series-level tooling and ecosystem support documented for the FLEX-10KE family.

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