EPF10K50RC240-3N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 219 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50RC240-3N – FLEX-10K FPGA, 2,880 logic elements, 20,480-bit RAM, 189 I/Os, 240-BFQFP

The EPF10K50RC240-3N is a member of the FLEX 10K embedded programmable logic device family. It combines a logic array and embedded array resources to enable System-on-a-Programmable-Chip (SOPC) integration for commercial embedded designs.

With 2,880 logic elements, approximately 20,480 bits of on-chip RAM and 189 user I/Os in a 240-pin BFQFP exposed‑pad package, this device targets commercial applications that require moderate logic capacity, integrated memory, and flexible I/O in a surface-mount form factor.

Key Features

  • Core Logic Capacity — 2,880 logic elements (LEs) and a typical gate estimate of 50,000, with maximum system gates listed as 116,000 for the family.
  • Embedded Memory — 20,480 total RAM bits provided by embedded array blocks, enabling local buffering and small on-chip data storage.
  • I/O and Interface — 189 user I/O pins to support a broad set of external peripherals and interfaces for commercial embedded systems.
  • Supply Voltage — Designed for 5.0-V systems with a specified voltage supply range of 4.75 V to 5.25 V.
  • Packaging & Mounting — 240‑BFQFP exposed pad package (supplier device package: 240‑RQFP 32×32), surface-mount mounting for compact board integration and thermal relief via exposed pad.
  • Operating Range & Grade — Commercial grade operation from 0 °C to 70 °C.
  • System Features — Family-level capabilities include in-circuit reconfigurability via external configuration device or JTAG, built-in IEEE 1149.1 JTAG boundary-scan, low-skew clock distribution, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and options such as ClockLock and ClockBoost.
  • RoHS Compliant — Device is RoHS compliant for lead-free assembly requirements.

Typical Applications

  • Embedded Control & SOPC Integration — Use the device to consolidate glue logic, peripheral control and small custom processors within commercial embedded products.
  • Interface Bridging & I/O Expansion — 189 user I/Os provide headroom for protocol translation, bus bridging and interfacing between components in commercial systems.
  • On‑board Memory and Buffering — Built-in RAM (20,480 bits) is suitable for small FIFOs, buffering and state storage without external memory in a range of commercial applications.
  • Development & Prototyping — The FLEX 10K family’s support for in-circuit reconfigurability and JTAG boundary-scan makes the device useful for prototype designs and iterative hardware development.

Unique Advantages

  • Balanced logic and memory — 2,880 logic elements with 20,480 bits of embedded RAM provide a balanced resource mix for control, glue logic and modest data buffering.
  • High I/O count in a compact package — 189 user I/Os in a 240-pin BFQFP exposed-pad package enable significant interface capability while preserving board space.
  • 5-V system compatibility — Specified 4.75 V to 5.25 V supply range aligns the device with legacy and commercial 5.0-V systems.
  • Design and test support — Built-in JTAG boundary-scan and family-level support for in-circuit reconfiguration simplify bring-up, debugging and production test.
  • Commercial temperature and RoHS compliance — Commercial operating range (0 °C to 70 °C) and RoHS compliance support standard commercial manufacturing and deployments.
  • Surface-mount integration with thermal pad — Exposed pad BFQFP package improves thermal performance and mechanical stability for dense board layouts.

Why Choose EPF10K50RC240-3N?

The EPF10K50RC240-3N delivers a practical combination of logic density, embedded memory and I/O capacity for commercial embedded designs that need SOPC-style integration and flexible interfacing. Its family-level features—such as in-circuit reconfigurability, JTAG boundary-scan and dedicated arithmetic/cascade chains—help shorten development cycles and simplify system integration.

This device is well suited to engineers and procurement teams designing commercial equipment, test systems, and prototypes that require moderate programmable logic, on-chip RAM and a robust I/O footprint in a surface-mount, RoHS-compliant package, with vendor-supported development toolflow for design entry and place-and-route.

Request a quote or submit an inquiry to receive pricing and availability information for the EPF10K50RC240-3N.

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