EPF10K50RC240-4N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 663 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50RC240-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 2,880 logic elements, 20,480 RAM bits, 189 I/O, 240-BFQFP
The EPF10K50RC240-4N is a FLEX 10K family embedded programmable logic device designed for system-level integration of custom logic and memory-intensive functions. Built around a logic array plus embedded array blocks, this device targets applications requiring reconfigurable logic, on-chip embedded RAM, and flexible I/O in a compact 240-pin exposed-pad BFQFP package.
Key value propositions include ample on-chip embedded memory (approximately 20,480 bits), a substantial logic fabric (2,880 logic elements and 360 LABs), and broad I/O capability (189 user I/O pins) while operating from a 4.75 V to 5.25 V supply and standard commercial temperature range.
Key Features
- Logic Capacity 2,880 logic elements and 360 logic array blocks (LABs) provide the core programmable fabric for custom logic implementations.
- Gate Density Typical device logic and RAM capacity documented for the FLEX 10K family and specified system gates for this part indicate up to 116,000 system gates and a typical gate count in the family tables for comparable devices.
- Embedded Memory Approximately 20,480 bits of on-chip RAM across embedded array blocks for implementing buffers, FIFOs, or other memory-backed megafunctions.
- I/O and Interfaces 189 user I/O pins with per-pin control options provided by the FLEX 10K architecture for flexible interface design and signal management.
- Reconfiguration and Test Supports in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan test circuitry as documented for the FLEX 10K family.
- Clocking and High-Speed Logic Family features include low-skew clock distribution, ClockLock/ClockBoost options, dedicated carry and cascade chains for arithmetic and high-fan-in functions, and global clock/clear signals.
- Power and Temperature Operates from a 4.75 V to 5.25 V supply and specified for commercial operating temperature range of 0 °C to 70 °C.
- Package and Mounting 240-BFQFP with exposed pad (supplier package: 240-RQFP 32×32) in a surface-mount form factor for PCB assembly; RoHS compliant.
Typical Applications
- Embedded system integration Configurable logic and embedded RAM enable integration of custom glue logic, peripheral interfaces, and small on-chip memories for system-on-a-programmable-chip designs.
- Memory-backed logic functions On-chip RAM blocks are suitable for implementing buffers, FIFOs, and other memory-backed megafunctions within control and data-path designs.
- Peripheral and interface bridging Large I/O count and per-pin control support bridging between digital peripherals, custom bus interfaces, and board-level glue logic.
- Prototyping and evaluation Programmable fabric and JTAG support make the device suitable for hardware prototyping and in-circuit reconfiguration workflows.
Unique Advantages
- Balanced logic and memory resources Combines 2,880 logic elements with approximately 20,480 bits of embedded RAM to handle mixed logic-and-memory requirements without external SRAM for many designs.
- High I/O density 189 user I/O pins facilitate multi-interface designs and simplify PCB routing for complex peripheral and sensor connectivity.
- Flexible packaging 240-pin BFQFP exposed pad in a surface-mount format provides a compact footprint with thermal pad support for improved board-level thermal handling.
- Reconfigurability and testability Supports in-circuit reconfiguration and includes JTAG boundary-scan test capability as part of the FLEX 10K family feature set, aiding development and manufacturing test.
- Commercial-grade deployment Specified for a commercial temperature range (0 °C to 70 °C) and RoHS compliance for mainstream embedded and commercial applications.
Why Choose EPF10K50RC240-4N?
The EPF10K50RC240-4N delivers a measured combination of programmable logic density, embedded RAM, and high I/O count in a 240-pin exposed-pad package, making it well suited to designs that require on-chip memory alongside configurable logic. As a member of the FLEX 10K family, it benefits from documented architecture features—such as dedicated arithmetic chains, low-skew clocking, and JTAG testability—that streamline implementation of common digital functions and support established development flows.
This device is appropriate for engineering teams and procurement seeking a commercial-grade, reconfigurable solution for system integration, interface bridging, and prototyping where a 5 V supply domain and standard commercial operating temperatures are required.
If you would like pricing, availability, or to request a quote for EPF10K50RC240-4N, please submit a quote request or contact sales to initiate an order or obtain further commercial details.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018