EPF10K50RC240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 663 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50RC240-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 2,880 logic elements, 20,480 RAM bits, 189 I/O, 240-BFQFP

The EPF10K50RC240-4N is a FLEX 10K family embedded programmable logic device designed for system-level integration of custom logic and memory-intensive functions. Built around a logic array plus embedded array blocks, this device targets applications requiring reconfigurable logic, on-chip embedded RAM, and flexible I/O in a compact 240-pin exposed-pad BFQFP package.

Key value propositions include ample on-chip embedded memory (approximately 20,480 bits), a substantial logic fabric (2,880 logic elements and 360 LABs), and broad I/O capability (189 user I/O pins) while operating from a 4.75 V to 5.25 V supply and standard commercial temperature range.

Key Features

  • Logic Capacity  2,880 logic elements and 360 logic array blocks (LABs) provide the core programmable fabric for custom logic implementations.
  • Gate Density  Typical device logic and RAM capacity documented for the FLEX 10K family and specified system gates for this part indicate up to 116,000 system gates and a typical gate count in the family tables for comparable devices.
  • Embedded Memory  Approximately 20,480 bits of on-chip RAM across embedded array blocks for implementing buffers, FIFOs, or other memory-backed megafunctions.
  • I/O and Interfaces  189 user I/O pins with per-pin control options provided by the FLEX 10K architecture for flexible interface design and signal management.
  • Reconfiguration and Test  Supports in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan test circuitry as documented for the FLEX 10K family.
  • Clocking and High-Speed Logic  Family features include low-skew clock distribution, ClockLock/ClockBoost options, dedicated carry and cascade chains for arithmetic and high-fan-in functions, and global clock/clear signals.
  • Power and Temperature  Operates from a 4.75 V to 5.25 V supply and specified for commercial operating temperature range of 0 °C to 70 °C.
  • Package and Mounting  240-BFQFP with exposed pad (supplier package: 240-RQFP 32×32) in a surface-mount form factor for PCB assembly; RoHS compliant.

Typical Applications

  • Embedded system integration  Configurable logic and embedded RAM enable integration of custom glue logic, peripheral interfaces, and small on-chip memories for system-on-a-programmable-chip designs.
  • Memory-backed logic functions  On-chip RAM blocks are suitable for implementing buffers, FIFOs, and other memory-backed megafunctions within control and data-path designs.
  • Peripheral and interface bridging  Large I/O count and per-pin control support bridging between digital peripherals, custom bus interfaces, and board-level glue logic.
  • Prototyping and evaluation  Programmable fabric and JTAG support make the device suitable for hardware prototyping and in-circuit reconfiguration workflows.

Unique Advantages

  • Balanced logic and memory resources  Combines 2,880 logic elements with approximately 20,480 bits of embedded RAM to handle mixed logic-and-memory requirements without external SRAM for many designs.
  • High I/O density  189 user I/O pins facilitate multi-interface designs and simplify PCB routing for complex peripheral and sensor connectivity.
  • Flexible packaging  240-pin BFQFP exposed pad in a surface-mount format provides a compact footprint with thermal pad support for improved board-level thermal handling.
  • Reconfigurability and testability  Supports in-circuit reconfiguration and includes JTAG boundary-scan test capability as part of the FLEX 10K family feature set, aiding development and manufacturing test.
  • Commercial-grade deployment  Specified for a commercial temperature range (0 °C to 70 °C) and RoHS compliance for mainstream embedded and commercial applications.

Why Choose EPF10K50RC240-4N?

The EPF10K50RC240-4N delivers a measured combination of programmable logic density, embedded RAM, and high I/O count in a 240-pin exposed-pad package, making it well suited to designs that require on-chip memory alongside configurable logic. As a member of the FLEX 10K family, it benefits from documented architecture features—such as dedicated arithmetic chains, low-skew clocking, and JTAG testability—that streamline implementation of common digital functions and support established development flows.

This device is appropriate for engineering teams and procurement seeking a commercial-grade, reconfigurable solution for system integration, interface bridging, and prototyping where a 5 V supply domain and standard commercial operating temperatures are required.

If you would like pricing, availability, or to request a quote for EPF10K50RC240-4N, please submit a quote request or contact sales to initiate an order or obtain further commercial details.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up