EPF10K50RI240-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 72 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50RI240-4 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad
The EPF10K50RI240-4 is an Intel FLEX 10K family FPGA—an embedded programmable logic device that combines a configurable logic array with embedded memory resources for system-level integration. It delivers 2,880 logic elements, 20,480 bits of on-chip RAM and up to 189 user I/Os in a 240-pin BFQFP package with exposed pad.
Designed for industrial applications, this device operates from a 4.5 V to 5.5 V supply and across an operating range of −40 °C to 85 °C, offering a robust platform for control, interface and embedded processing tasks where reconfigurability and I/O density are required.
Key Features
- Core logic 2,880 logic elements provide the programmable fabric for implementing custom logic and control functions.
- Embedded memory 20,480 bits of on-chip RAM support buffering, small FIFOs and megafunctions without reducing logic capacity.
- I/O density and flexibility Up to 189 user I/O pins enable extensive peripheral interfacing and system connectivity.
- System-level integration Family-level features include embedded arrays for megafunctions and support for System-on-a-Programmable-Chip (SOPC) integration.
- Reconfiguration and test In-circuit reconfigurability via external configuration devices and built-in JTAG boundary-scan test (IEEE 1149.1) simplify development and board-level testing.
- Clock and arithmetic support Dedicated carry and cascade chains plus low-skew global clock resources help implement fast arithmetic and high-fan-in logic efficiently.
- Power and I/O tolerance Device-level support for 5.0-V operation (part-specified supply 4.5–5.5 V) enables integration into legacy 5-V systems.
- Package and thermal 240-BFQFP exposed pad (supplier package 240-RQFP 32×32) for surface-mount assembly; industrial-grade operating temperature −40 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded system integration Use as a configurable SOPC element to consolidate logic, interface glue and small embedded functions into a single device.
- Industrial control and automation Industrial-grade temperature range and high I/O count make it suitable for motor control, sensor interfaces and PLC-style control logic.
- Legacy 5-V platform interfacing 4.5–5.5 V supply tolerance supports integration with older 5-V peripherals and board designs.
- Data buffering and peripheral bridging On-chip RAM and plentiful I/O allow implementation of small buffers, protocol adapters and interface translators.
Unique Advantages
- Configurable, system-level device: Embedded memory and programmable logic enable megafunctions and SOPC-style integration, reducing external component count.
- High I/O count for flexible interfacing: 189 user I/Os let you connect multiple peripherals and buses without immediate need for external expanders.
- Industrial-capable thermal range: Rated −40 °C to 85 °C to meet many industrial application temperature requirements.
- In-circuit reconfigurability and JTAG support: Simplifies firmware updates, field configuration and boundary-scan testing during development and production.
- Vendor pedigree: Part of the FLEX 10K family from Intel, providing series-level features such as carry/cascade chains and low-skew clock distribution.
Why Choose EPF10K50RI240-4?
The EPF10K50RI240-4 positions itself as a versatile, industrial-grade FPGA suited for designs that require moderate logic capacity, significant I/O density and on-chip memory for buffering or small embedded functions. Its family-level features—reconfigurability, JTAG boundary-scan and dedicated arithmetic chains—support rapid development and board-level testability.
This device is appropriate for engineers building embedded controllers, industrial interfaces and legacy 5-V compatible systems who need a reliable, reprogrammable platform with clear, verifiable specifications for logic elements, RAM, I/O and environmental limits.
Request a quote or submit an inquiry to learn more about availability, pricing and lead times for the EPF10K50RI240-4.

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