EPF10K50RC240-3

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 879 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50RC240-3 – FLEX-10K® Field Programmable Gate Array (FPGA)

The EPF10K50RC240-3 is a FLEX 10K family embedded programmable logic device optimized for system-level integration. It combines a logic array and embedded memory blocks to implement a mix of general-purpose logic and specialized megafunctions.

Designed for commercial applications, this 5.0-V device delivers a balanced combination of density, I/O count and on-chip memory for functions such as protocol bridging, custom peripherals, and system-on-a-programmable-chip (SOPC) integration.

Key Features

  • Core and Density  2,880 logic elements and 360 logic array blocks, supporting up to 116,000 maximum system gates for complex logic implementations.
  • Embedded Memory  20,480 total RAM bits (approximately 0.02 Mbits) provided across embedded array blocks to support on-chip data buffering and megafunctions.
  • I/O and Interface Flexibility  189 user I/O pins with per-pin features such as individual tri-state control, open-drain option and programmable output slew-rate to manage signal integrity and interfacing.
  • Configuration and Test  In-circuit reconfigurability via external configuration device, intelligent controller or JTAG port. Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1 for board-level test support.
  • Clocking and Routing  FastTrack interconnect topology plus dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic. Support for multiple global clocks (up to six) and global clears (up to four) for synchronous system designs.
  • Power and Supply  Operates from a 4.75 V to 5.25 V supply. Commercial grade device with typical operating temperature range of 0 °C to 70 °C and RoHS compliance.
  • Package and Mounting  240-pin BFQFP with exposed pad (supplier package: 240-RQFP, 32×32), surface-mount mounting type for high-pin-count board integration.

Typical Applications

  • SOPC and System Integration  Implement custom system-on-a-programmable-chip functions combining logic and embedded memory for compact integration of peripherals and control logic.
  • Protocol Bridging and Interface Glue  Use the device’s abundant I/O and programmable logic to bridge buses, add protocol translation, or implement custom interface logic.
  • Embedded Memory and Buffering  Leverage the on-chip 20,480 bits of RAM for data buffering, small FIFOs or lookup tables within signal processing and control applications.
  • Board-level Test and In-circuit Reconfiguration  Take advantage of the IEEE-1149.1 JTAG support for boundary-scan testability and in-system reconfiguration workflows.

Unique Advantages

  • Balanced Logic and Memory Capacity  Combines 2,880 logic elements with 20,480 bits of embedded RAM to support mixed logic and memory requirements without external RAM for many functions.
  • High I/O Count  189 user I/O pins provide flexible connectivity for multi-peripheral designs and dense board-level interfaces.
  • Flexible Clocking and Fast Interconnect  FastTrack routing, dedicated carry/cascade paths and multiple global clocks simplify implementation of high-performance arithmetic and timing-critical logic.
  • Board Test and Reconfiguration Support  Built-in JTAG boundary-scan and in-circuit reconfigurability streamline production test and field updates.
  • Standard Commercial Footprint  240-pin BFQFP with exposed pad and surface-mount mounting simplifies placement on standard PCBs while providing thermal relief through the exposed pad.

Why Choose EPF10K50RC240-3?

The EPF10K50RC240-3 positions itself as a versatile, commercial-grade FLEX 10K device for designers who need a proven balance of logic density, embedded memory and high I/O count in a standard 240-pin package. Its in-system configuration options and JTAG support make it suitable for designs that require board-level testability and field reconfiguration.

This device is well suited to engineering teams building SOPC solutions, protocol bridges, and custom peripheral logic where 5.0-V operation, RoHS compliance and a compact BFQFP footprint are important selection criteria.

Request a quote or submit an inquiry to obtain pricing and availability for EPF10K50RC240-3.

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