EPF10K50RC240-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 879 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50RC240-3 – FLEX-10K® Field Programmable Gate Array (FPGA)
The EPF10K50RC240-3 is a FLEX 10K family embedded programmable logic device optimized for system-level integration. It combines a logic array and embedded memory blocks to implement a mix of general-purpose logic and specialized megafunctions.
Designed for commercial applications, this 5.0-V device delivers a balanced combination of density, I/O count and on-chip memory for functions such as protocol bridging, custom peripherals, and system-on-a-programmable-chip (SOPC) integration.
Key Features
- Core and Density 2,880 logic elements and 360 logic array blocks, supporting up to 116,000 maximum system gates for complex logic implementations.
- Embedded Memory 20,480 total RAM bits (approximately 0.02 Mbits) provided across embedded array blocks to support on-chip data buffering and megafunctions.
- I/O and Interface Flexibility 189 user I/O pins with per-pin features such as individual tri-state control, open-drain option and programmable output slew-rate to manage signal integrity and interfacing.
- Configuration and Test In-circuit reconfigurability via external configuration device, intelligent controller or JTAG port. Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1 for board-level test support.
- Clocking and Routing FastTrack interconnect topology plus dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic. Support for multiple global clocks (up to six) and global clears (up to four) for synchronous system designs.
- Power and Supply Operates from a 4.75 V to 5.25 V supply. Commercial grade device with typical operating temperature range of 0 °C to 70 °C and RoHS compliance.
- Package and Mounting 240-pin BFQFP with exposed pad (supplier package: 240-RQFP, 32×32), surface-mount mounting type for high-pin-count board integration.
Typical Applications
- SOPC and System Integration Implement custom system-on-a-programmable-chip functions combining logic and embedded memory for compact integration of peripherals and control logic.
- Protocol Bridging and Interface Glue Use the device’s abundant I/O and programmable logic to bridge buses, add protocol translation, or implement custom interface logic.
- Embedded Memory and Buffering Leverage the on-chip 20,480 bits of RAM for data buffering, small FIFOs or lookup tables within signal processing and control applications.
- Board-level Test and In-circuit Reconfiguration Take advantage of the IEEE-1149.1 JTAG support for boundary-scan testability and in-system reconfiguration workflows.
Unique Advantages
- Balanced Logic and Memory Capacity Combines 2,880 logic elements with 20,480 bits of embedded RAM to support mixed logic and memory requirements without external RAM for many functions.
- High I/O Count 189 user I/O pins provide flexible connectivity for multi-peripheral designs and dense board-level interfaces.
- Flexible Clocking and Fast Interconnect FastTrack routing, dedicated carry/cascade paths and multiple global clocks simplify implementation of high-performance arithmetic and timing-critical logic.
- Board Test and Reconfiguration Support Built-in JTAG boundary-scan and in-circuit reconfigurability streamline production test and field updates.
- Standard Commercial Footprint 240-pin BFQFP with exposed pad and surface-mount mounting simplifies placement on standard PCBs while providing thermal relief through the exposed pad.
Why Choose EPF10K50RC240-3?
The EPF10K50RC240-3 positions itself as a versatile, commercial-grade FLEX 10K device for designers who need a proven balance of logic density, embedded memory and high I/O count in a standard 240-pin package. Its in-system configuration options and JTAG support make it suitable for designs that require board-level testability and field reconfiguration.
This device is well suited to engineering teams building SOPC solutions, protocol bridges, and custom peripheral logic where 5.0-V operation, RoHS compliance and a compact BFQFP footprint are important selection criteria.
Request a quote or submit an inquiry to obtain pricing and availability for EPF10K50RC240-3.

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