EPF10K50ETC144-3N

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 906 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50ETC144-3N – FLEX-10KE® Field Programmable Gate Array, 144-LQFP

The EPF10K50ETC144-3N is a FLEX-10KE family field programmable gate array (FPGA) in a 144-pin LQFP package designed for commercial-grade embedded logic applications. It combines a general-purpose logic array with embedded memory resources to implement custom logic, on-chip storage, and system-level functions within a single, reconfigurable device.

With thousands of logic elements, tens of kilobits of embedded RAM and a substantial I/O count, this device targets applications that require flexible integration of combinational and memory-based functions while maintaining a compact surface-mount package and commercial temperature operation.

Key Features

  • Architecture – FLEX 10K family: Embedded programmable logic device family with an embedded array for implementing megafunctions and a logic array for general logic functions (series-level capability).
  • Logic capacity: 2,880 logic elements, enabling mid-range combinational and sequential logic integration.
  • On-chip memory: 40,960 total RAM bits for implementing FIFOs, small buffers, lookup tables or other memory-backed functions.
  • Gate count: 199,000 gates (device-specific specification) for estimating system-level resource usage.
  • I/O and interfaces: 102 user I/O pins supporting flexible external interfacing and peripheral connections.
  • Power supply: Single-supply operation from 2.3 V to 2.7 V as specified for this device.
  • Package and mounting: 144-LQFP (supplier package: 144-TQFP 20×20) in a surface-mount form factor for compact PCB designs.
  • Commercial temperature grade: Rated for 0 °C to 70 °C operating temperature.
  • Testability and configuration: Built-in JTAG boundary-scan test circuitry (IEEE Std. 1149.1) as described for the FLEX 10K family, available without consuming device logic.
  • RoHS compliant: Device meets RoHS environmental requirements.

Typical Applications

  • System logic integration: Implement glue logic, protocol conversion, and custom control functions where on-chip reconfigurable logic and embedded RAM reduce external components.
  • Embedded memory functions: Use on-chip RAM for small buffering, FIFOs, and lookup tables in communications or data-path designs.
  • Prototyping and development platforms: Mid-density programmable logic suitable for evaluating custom architectures and accelerating time-to-market for new designs.

Unique Advantages

  • Balanced mid-range capacity: 2,880 logic elements and 40,960 bits of RAM offer a balance of logic and memory for many embedded functions without large-footprint devices.
  • Compact, surface-mount package: 144-LQFP (20×20) keeps board area low while providing a solid I/O count for moderate connectivity needs.
  • Commercial-grade suitability: Specified for 0 °C to 70 °C operation and RoHS compliance, simplifying selection for commercial electronics designs.
  • Built-in test and configuration: JTAG boundary-scan support enables in-circuit testability and in-system configuration capabilities as part of the FLEX 10K family feature set.
  • Flexible I/O and integration: 102 user I/O pins allow direct interfacing to peripherals and external logic without excessive glue logic.

Why Choose EPF10K50ETC144-3N?

The EPF10K50ETC144-3N positions itself as a mid-density, commercially graded FPGA solution for designers needing a blend of logic elements, on-chip RAM and a moderate I/O count in a compact LQFP package. Its FLEX 10K family architecture and series-level capabilities (including built-in JTAG and embedded array support) make it suitable for designs that require reconfigurable integration of logic and memory without moving to larger FPGA families.

This device is appropriate for development and production designs in commercial electronics where board space, reconfigurability and component consolidation matter. Its specified voltage and temperature ranges, together with RoHS compliance, provide predictable integration into standard commercial product workflows.

Request a quote or submit an inquiry to receive pricing and availability information for EPF10K50ETC144-3N. Our team can assist with lead times and ordering details to support your design schedule.

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