EPF10K50ETI144-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP |
|---|---|
| Quantity | 629 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50ETI144-2 – FLEX-10KE Field Programmable Gate Array, 102 I/Os, 40,960-bit RAM, 2880 LEs, 144-LQFP
The EPF10K50ETI144-2 is a FLEX-10KE family field programmable gate array (FPGA) offered in a 144-lead LQFP surface-mount package. It combines a logic array with embedded memory to support reconfigurable system designs that require moderate logic capacity, substantial on-chip RAM, and flexible I/O resources.
Designed for industrial-grade environments, this device is suited to embedded systems and control applications that benefit from in-circuit reconfigurability and hardware-level integration of custom logic and memory functions.
Key Features
- Logic Capacity 2880 logic elements and 360 logic array blocks provide a programmable fabric for implementing custom combinational and sequential logic.
- Embedded Memory Approximately 0.04 Mbits of on-chip RAM (40,960 bits) for buffering, LUT-based storage, and megafunction implementations.
- I/O and Gate Count 102 user I/O pins and 199,000 gates enable interface-rich designs and significant logic integration on a single device.
- In-Circuit Reconfigurability & JTAG Supports in-circuit reconfiguration via external configuration devices or JTAG; family datasheet documents IEEE 1149.1 boundary-scan support for board-level testability.
- Clock and Interconnect Features Family-level features include low-skew clock distribution and dedicated fast interconnect structures and carry/cascade chains to improve timing predictability for arithmetic and high-fan-in logic.
- Power and Supply Operates from a 2.3 V to 2.7 V supply range as specified for this part.
- Package and Mounting Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20) for standard PCB assembly and thermal profiles.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C to meet industrial-environment requirements.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Industrial Control Custom control logic, I/O aggregation, and state-machine implementations taking advantage of the device’s industrial temperature rating and reconfigurability.
- Embedded Systems On-chip RAM and programmable logic for glue logic, protocol adaptation, and subsystem integration in embedded products.
- Communications & Interfaces Protocol bridging and custom interface logic using the 102 I/O pins and dedicated interconnect resources.
- Prototyping and In-System Upgrades In-circuit reconfigurability enables hardware updates and iterative design refinement without board-level replacements.
Unique Advantages
- Balanced Logic and Memory A combination of 2880 logic elements and 40,960 bits of embedded RAM supports designs that need both programmable logic and significant on-chip storage.
- Test and Reconfiguration Support JTAG boundary-scan and in-circuit reconfiguration simplify board bring-up, manufacturing test, and field updates.
- Industrial-Grade Reliability Specified operation from −40 °C to 85 °C and surface-mount packaging make the device suitable for industrial deployments.
- Flexible I/O Count 102 user I/O pins enable broad connectivity for sensors, peripherals, and external logic without immediate need for additional I/O expanders.
- Standard Surface-Mount Package 144-lead LQFP provides a compact footprint with established PCB assembly compatibility.
- Environmental Compliance RoHS compliance helps meet regulatory and customer environmental requirements.
Why Choose EPF10K50ETI144-2?
The EPF10K50ETI144-2 positions itself as a flexible, industrial-grade FPGA option for designers who need a mix of programmable logic, substantial on-chip RAM, and a practical I/O count in a standard LQFP footprint. Its combination of 2880 logic elements, 40,960 bits of embedded memory, and reconfigurability features supports integration of custom functions and iterative hardware upgrades while maintaining board-level testability.
This device is well suited to embedded and industrial applications where predictable timing, moderate gate capacity, and the ability to update hardware in-system deliver long-term design flexibility and reduced system bill-of-materials.
Request a quote or contact sales to check availability, lead times, and pricing for the EPF10K50ETI144-2.

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