EPF10K50ETI144-2

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 629 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50ETI144-2 – FLEX-10KE Field Programmable Gate Array, 102 I/Os, 40,960-bit RAM, 2880 LEs, 144-LQFP

The EPF10K50ETI144-2 is a FLEX-10KE family field programmable gate array (FPGA) offered in a 144-lead LQFP surface-mount package. It combines a logic array with embedded memory to support reconfigurable system designs that require moderate logic capacity, substantial on-chip RAM, and flexible I/O resources.

Designed for industrial-grade environments, this device is suited to embedded systems and control applications that benefit from in-circuit reconfigurability and hardware-level integration of custom logic and memory functions.

Key Features

  • Logic Capacity  2880 logic elements and 360 logic array blocks provide a programmable fabric for implementing custom combinational and sequential logic.
  • Embedded Memory  Approximately 0.04 Mbits of on-chip RAM (40,960 bits) for buffering, LUT-based storage, and megafunction implementations.
  • I/O and Gate Count  102 user I/O pins and 199,000 gates enable interface-rich designs and significant logic integration on a single device.
  • In-Circuit Reconfigurability & JTAG  Supports in-circuit reconfiguration via external configuration devices or JTAG; family datasheet documents IEEE 1149.1 boundary-scan support for board-level testability.
  • Clock and Interconnect Features  Family-level features include low-skew clock distribution and dedicated fast interconnect structures and carry/cascade chains to improve timing predictability for arithmetic and high-fan-in logic.
  • Power and Supply  Operates from a 2.3 V to 2.7 V supply range as specified for this part.
  • Package and Mounting  Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20) for standard PCB assembly and thermal profiles.
  • Industrial Temperature Range  Rated for operation from −40 °C to 85 °C to meet industrial-environment requirements.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Industrial Control  Custom control logic, I/O aggregation, and state-machine implementations taking advantage of the device’s industrial temperature rating and reconfigurability.
  • Embedded Systems  On-chip RAM and programmable logic for glue logic, protocol adaptation, and subsystem integration in embedded products.
  • Communications & Interfaces  Protocol bridging and custom interface logic using the 102 I/O pins and dedicated interconnect resources.
  • Prototyping and In-System Upgrades  In-circuit reconfigurability enables hardware updates and iterative design refinement without board-level replacements.

Unique Advantages

  • Balanced Logic and Memory  A combination of 2880 logic elements and 40,960 bits of embedded RAM supports designs that need both programmable logic and significant on-chip storage.
  • Test and Reconfiguration Support  JTAG boundary-scan and in-circuit reconfiguration simplify board bring-up, manufacturing test, and field updates.
  • Industrial-Grade Reliability  Specified operation from −40 °C to 85 °C and surface-mount packaging make the device suitable for industrial deployments.
  • Flexible I/O Count  102 user I/O pins enable broad connectivity for sensors, peripherals, and external logic without immediate need for additional I/O expanders.
  • Standard Surface-Mount Package  144-lead LQFP provides a compact footprint with established PCB assembly compatibility.
  • Environmental Compliance  RoHS compliance helps meet regulatory and customer environmental requirements.

Why Choose EPF10K50ETI144-2?

The EPF10K50ETI144-2 positions itself as a flexible, industrial-grade FPGA option for designers who need a mix of programmable logic, substantial on-chip RAM, and a practical I/O count in a standard LQFP footprint. Its combination of 2880 logic elements, 40,960 bits of embedded memory, and reconfigurability features supports integration of custom functions and iterative hardware upgrades while maintaining board-level testability.

This device is well suited to embedded and industrial applications where predictable timing, moderate gate capacity, and the ability to update hardware in-system deliver long-term design flexibility and reduced system bill-of-materials.

Request a quote or contact sales to check availability, lead times, and pricing for the EPF10K50ETI144-2.

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