EPF10K50ETC144-2N

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 315 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50ETC144-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

The EPF10K50ETC144-2N is a FLEX-10KE family embedded programmable logic device from Intel, delivered in a 144-LQFP package. It combines 2,880 logic elements with approximately 40,960 bits of embedded RAM and a maximum system gate count of 199,000 to support mid-density, reconfigurable digital logic.

Targeted at commercial embedded designs, the device provides on-chip memory, dedicated arithmetic and cascade resources, and 102 user I/O pins in a surface-mount 144-pin footprint, operating from a 2.3 V to 2.7 V supply and rated for 0 °C to 70 °C.

Key Features

  • Logic Capacity  2,880 logic elements and a maximum system gate count of 199,000 provide mid-range programmable logic density for custom control and data-path functions.
  • Embedded Memory  Approximately 40,960 bits of on-chip RAM across embedded array blocks (EABs), supporting dual-port operation and up to 16-bit widths for efficient local storage and buffering.
  • I/O and Voltage  102 user I/O pins with a device supply range of 2.3 V to 2.7 V, enabling integration with 2.5 V systems and common peripheral voltage domains.
  • Dedicated Arithmetic and Cascade Resources  Built-in carry and cascade chains accelerate adders, counters, comparators, and high-fan-in logic without consuming additional general logic elements.
  • Configuration and Test  In-circuit reconfigurability and JTAG boundary-scan support are provided at the device/family level for programming and test access.
  • Package and Mounting  Surface-mount 144-LQFP package (supplier designation: 144-TQFP, 20×20) for compact PCB integration and standard assembly flows.
  • Commercial Grade  Device is specified for commercial operating temperatures from 0 °C to 70 °C and is RoHS compliant.

Typical Applications

  • System Integration / SOPC  Use as a system-on-a-programmable-chip component for integrating custom control logic, peripheral glue, and local memory in commercial embedded systems.
  • Interface and Glue Logic  Implement protocol adapters, bus arbitration, and custom I/O timing adjustments using the device’s programmable logic and I/O resources.
  • Memory and Buffering  Leverage dual-port embedded RAM blocks for small FIFO buffers, lookup tables, and temporary storage in data-path applications.
  • Prototyping and Proof-of-Concept  Ideal for mid-density FPGA prototyping where 2,880 logic elements and on-chip RAM deliver a balance of capacity and board-level simplicity.

Unique Advantages

  • Balanced Logic and Memory:  Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM, reducing the need for external memory in many designs.
  • Compact, Standard Package:  144-LQFP (surface-mount) footprint simplifies PCB layout and supports common assembly processes while keeping pin count practical for mid-density designs.
  • Dedicated Hardware Paths:  Built-in carry and cascade chains accelerate arithmetic and high-fan-in logic, improving performance for counters, adders, and complex combinatorial functions.
  • Configurable and Testable:  In-circuit reconfigurability and JTAG boundary-scan enable iterative development, field updates, and board-level testability.
  • Commercial Readiness:  Rated for 0 °C to 70 °C operation with RoHS compliance, suitable for a wide range of commercial embedded products.

Why Choose EPF10K50ETC144-2N?

The EPF10K50ETC144-2N positions itself as a flexible mid-density FPGA solution for commercial embedded designs that require a combination of programmable logic, local RAM, and practical I/O in a compact package. Its balance of 2,880 logic elements, embedded memory, and dedicated hardware chains supports efficient implementation of control logic, buffering, and arithmetic functions without excessive board-level complexity.

This device is well suited for engineers and procurement teams building commercial-scale systems where board space, reconfigurability, and standard surface-mount packaging are priorities. The FLEX-10KE family-level features and support for in-circuit reconfiguration make it a practical choice for iterative design cycles and moderate-volume production runs.

Request a quote or submit a pricing and availability request to receive lead-time and purchasing information for the EPF10K50ETC144-2N.

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