EPF10K50ETC144-2N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP |
|---|---|
| Quantity | 315 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50ETC144-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP
The EPF10K50ETC144-2N is a FLEX-10KE family embedded programmable logic device from Intel, delivered in a 144-LQFP package. It combines 2,880 logic elements with approximately 40,960 bits of embedded RAM and a maximum system gate count of 199,000 to support mid-density, reconfigurable digital logic.
Targeted at commercial embedded designs, the device provides on-chip memory, dedicated arithmetic and cascade resources, and 102 user I/O pins in a surface-mount 144-pin footprint, operating from a 2.3 V to 2.7 V supply and rated for 0 °C to 70 °C.
Key Features
- Logic Capacity 2,880 logic elements and a maximum system gate count of 199,000 provide mid-range programmable logic density for custom control and data-path functions.
- Embedded Memory Approximately 40,960 bits of on-chip RAM across embedded array blocks (EABs), supporting dual-port operation and up to 16-bit widths for efficient local storage and buffering.
- I/O and Voltage 102 user I/O pins with a device supply range of 2.3 V to 2.7 V, enabling integration with 2.5 V systems and common peripheral voltage domains.
- Dedicated Arithmetic and Cascade Resources Built-in carry and cascade chains accelerate adders, counters, comparators, and high-fan-in logic without consuming additional general logic elements.
- Configuration and Test In-circuit reconfigurability and JTAG boundary-scan support are provided at the device/family level for programming and test access.
- Package and Mounting Surface-mount 144-LQFP package (supplier designation: 144-TQFP, 20×20) for compact PCB integration and standard assembly flows.
- Commercial Grade Device is specified for commercial operating temperatures from 0 °C to 70 °C and is RoHS compliant.
Typical Applications
- System Integration / SOPC Use as a system-on-a-programmable-chip component for integrating custom control logic, peripheral glue, and local memory in commercial embedded systems.
- Interface and Glue Logic Implement protocol adapters, bus arbitration, and custom I/O timing adjustments using the device’s programmable logic and I/O resources.
- Memory and Buffering Leverage dual-port embedded RAM blocks for small FIFO buffers, lookup tables, and temporary storage in data-path applications.
- Prototyping and Proof-of-Concept Ideal for mid-density FPGA prototyping where 2,880 logic elements and on-chip RAM deliver a balance of capacity and board-level simplicity.
Unique Advantages
- Balanced Logic and Memory: Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM, reducing the need for external memory in many designs.
- Compact, Standard Package: 144-LQFP (surface-mount) footprint simplifies PCB layout and supports common assembly processes while keeping pin count practical for mid-density designs.
- Dedicated Hardware Paths: Built-in carry and cascade chains accelerate arithmetic and high-fan-in logic, improving performance for counters, adders, and complex combinatorial functions.
- Configurable and Testable: In-circuit reconfigurability and JTAG boundary-scan enable iterative development, field updates, and board-level testability.
- Commercial Readiness: Rated for 0 °C to 70 °C operation with RoHS compliance, suitable for a wide range of commercial embedded products.
Why Choose EPF10K50ETC144-2N?
The EPF10K50ETC144-2N positions itself as a flexible mid-density FPGA solution for commercial embedded designs that require a combination of programmable logic, local RAM, and practical I/O in a compact package. Its balance of 2,880 logic elements, embedded memory, and dedicated hardware chains supports efficient implementation of control logic, buffering, and arithmetic functions without excessive board-level complexity.
This device is well suited for engineers and procurement teams building commercial-scale systems where board space, reconfigurability, and standard surface-mount packaging are priorities. The FLEX-10KE family-level features and support for in-circuit reconfiguration make it a practical choice for iterative design cycles and moderate-volume production runs.
Request a quote or submit a pricing and availability request to receive lead-time and purchasing information for the EPF10K50ETC144-2N.

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