EPF10K50ETC144-1

The EPF10K50ETC144-1 is a FLEX-10KE family FPGA from Intel, delivered in a 144-lead LQFP surface-mount package. It combines programmable logic resources and on-chip embedded memory to implement custom digital functions for commercial embedded designs.

With 2,880 logic elements and 40,960 bits of on-chip RAM, this device is suited for system-on-a-programmable-chip (SOPC) integration, memory-intensive logic, and general-purpose programmable logic tasks in commercial-temperature applications.

Key Features

• Core Logic  2,880 logic elements provide flexible programmable logic capacity for glue logic, state machines, and custom datapaths.
• Embedded Memory  Total on-chip RAM of 40,960 bits supports buffer, FIFO, and small memory-mapped functions without external memory.
• I/O Count  102 user I/O pins enable a wide range of peripheral interfacing and board-level connectivity.
• Gate Capacity  Approximately 199,000 gates of logic for integrating multiple functions into a single device.
• Power and Voltage  Device supply operates from 2.3 V to 2.7 V, enabling compatibility with mid-voltage system rails.
• Package and Mounting  144-LQFP surface-mount package (supplier package listed as 144-TQFP, 20×20 mm) for standard PCB assembly workflows.
• Operating Temperature  Commercial-grade temperature range: 0 °C to 70 °C for typical commercial applications.
• Compliance and Test  RoHS-compliant device; the FLEX 10K family also includes built-in JTAG boundary-scan test circuitry (series feature) for board-level testability.
• FLEX 10K Family Features  Series-level capabilities include embedded array blocks for megafunctions, low-power standby modes, and family support for system-level integration and tooling (as described in the FLEX 10K family datasheet).

Typical Applications

• System-on-a-Programmable-Chip (SOPC)  Integrate custom logic, glue logic, and embedded memory blocks to consolidate multiple board functions into a single programmable device.
• Embedded Control  Implement control logic, state machines, and interface handling for commercial embedded products operating within the 0 °C to 70 °C range.
• Memory-Intensive Functions  On-chip RAM supports buffering, FIFOs, and small data stores for peripherals and streaming interfaces without immediate need for external memory.
• Custom I/O and Interface Bridging  Use the device’s 102 I/O pins to adapt and aggregate signals between subsystems on commercial PCBs.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements paired with 40,960 bits of embedded RAM allows mixed logic-and-memory designs in a single device, reducing external component count.
• Compact, Standard Package:  144-LQFP package provides a compact footprint compatible with common surface-mount assembly processes.
• Commercial-Grade Reliability:  Specified for 0 °C to 70 °C operation and RoHS compliance for mainstream commercial product deployments.
• Flexible Supply Range:  2.3 V to 2.7 V supply operation supports integration with mid-voltage system rails.
• Built-in Testability:  FLEX 10K family support for JTAG boundary-scan simplifies board-level validation and manufacturing test (series feature).

Why Choose EPF10K50ETC144-1?

The EPF10K50ETC144-1 delivers a practical balance of programmable logic capacity and on-chip memory in a compact 144-LQFP package, tailored for commercial embedded applications. Its combination of 2,880 logic elements, 40,960 bits of RAM, and 102 I/O pins lets designers consolidate functions, reduce BOM count, and implement SOPC-style integrations on standard PCBs.

This device is a fit for engineering teams building commercial electronics that need flexible, field-programmable logic with moderate memory and I/O resources, alongside manufacturing-friendly packaging and RoHS compliance. Family-level tool and test capabilities described in the FLEX 10K documentation further support integration and production workflows.

Request a quote or submit a component inquiry to obtain pricing and availability for EPF10K50ETC144-1.