EPF10K50EQC240-3N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP |
|---|---|
| Quantity | 1,821 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EQC240-3N – FLEX-10KE® Field Programmable Gate Array, 240-BFQFP
The EPF10K50EQC240-3N is a commercial-grade FLEX 10K family FPGA offering high-density programmable logic and embedded memory in a 240-BFQFP surface-mount package. It combines 2,880 logic elements and 40,960 bits of on-chip RAM with 189 user I/O pins to support system-on-programmable-chip (SOPC) integration and complex logic functions in commercial embedded designs.
Designed for applications that require significant logic capacity, abundant I/O, and embedded RAM, this device delivers flexible interfacing and reconfigurability while meeting RoHS compliance for lead-free assembly processes.
Key Features
- Logic Capacity — 2,880 logic elements and approximately 199,000 gates provide substantial combinational and sequential logic resources for mid-density designs.
- Embedded Memory — 40,960 bits of on-chip RAM for data buffering, small FIFOs, and memory-backed megafunctions.
- Logic Array Blocks (LABs) — 360 logic array blocks (LABs) for organized placement of logic resources and predictable routing.
- User I/O — 189 programmable I/O pins to support diverse peripheral interfaces and board-level connectivity.
- Package & Mounting — 240-BFQFP package (supplier device package: 240-PQFP, 32×32) in a surface-mount form factor for standard PCB assembly.
- Power — Operates from a 2.3 V to 2.7 V supply range, suitable for systems using low-voltage logic rails.
- Operating Range — Commercial temperature rating with an operating range of 0 °C to 70 °C.
- Reconfigurability & Test — Supports in-circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG; includes JTAG boundary-scan capability as described for the FLEX 10K family.
- Compliance — RoHS compliant for lead-free design and manufacturing.
Typical Applications
- System-on-Programmable-Chip (SOPC) — Implement embedded megafunctions and combine memory and logic to consolidate peripheral functions and reduce board-level component count.
- High-Density Control Logic — Use the device’s logic elements and LAB architecture to implement complex state machines, control logic, and custom processing blocks.
- Interface and Peripheral Bridging — Leverage 189 I/O pins to bridge multiple peripherals, handle I/O-rich subsystems, or create protocol converters.
- Memory-Backed Functions — Take advantage of 40,960 bits of embedded RAM for buffering, FIFOs, or lookup tables within mid-range embedded designs.
Unique Advantages
- Balanced Logic and Memory: Combines 2,880 logic elements with 40,960 bits of RAM to support mixed logic-plus-memory designs without external SRAM for many use cases.
- Ample I/O Density: 189 user I/O pins enable flexible interfacing to sensors, peripherals, and board-level connectors, reducing the need for external I/O expanders.
- In-Circuit Reconfigurability: Supports reconfiguration via external configuration devices or JTAG, enabling field updates and iterative development workflows.
- Commercial Temperature and Surface-Mount Packaging: 240-BFQFP surface-mount package rated for 0 °C to 70 °C suits mainstream commercial and embedded products with standard assembly flows.
- Standards-Compatible Testability: Built-in JTAG boundary-scan support as part of the FLEX 10K family simplifies board-level test and debug without consuming device logic.
- RoHS Compliance: Lead-free, RoHS-compliant construction supports contemporary environmental and manufacturing requirements.
Why Choose EPF10K50EQC240-3N?
The EPF10K50EQC240-3N delivers a practical combination of mid-range logic density, substantial on-chip RAM, and abundant I/O in a commercial-grade surface-mount package. It is well suited for engineers building embedded systems that require consolidated logic and memory, flexible I/O, and the ability to reconfigure designs in-circuit.
For teams focused on reducing BOM complexity and accelerating development, this FLEX 10K family device provides the architectural building blocks—logic elements, LAB organization, embedded RAM, and JTAG reconfigurability—backed by RoHS compliance for standard production environments.
Request a quote or submit your requirements to receive pricing and availability for the EPF10K50EQC240-3N and to discuss how it fits your next commercial embedded design.

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