EPF10K50EQC240-1N

The EPF10K50EQC240-1N is a FLEX-10KE family field programmable gate array offering on-chip programmable logic and embedded resources for system-level integration. It provides 2,880 logic elements across 360 LABs, approximately 40,960 bits of embedded RAM, and 189 user I/O pins in a 240-BFQFP surface-mount package.

Designed for commercial applications, this device supports in-circuit reconfigurability and family-level system features such as JTAG boundary-scan and embedded array blocks for implementing megafunctions. The device operates from a 2.3 V to 2.7 V supply and is specified for 0 °C to 70 °C operation.

Key Features

• Core Logic  2,880 logic elements organized into 360 LABs provide the programmable fabric for implementing custom digital functions and state machines.
• On‑Chip Memory  Approximately 40,960 bits of embedded RAM suitable for buffering, small lookup tables, and local storage inside the FPGA fabric.
• I/O Capacity  189 user I/O pins support a wide range of external interfaces and signal routing in the 240-pin package.
• Package & Mounting  240-BFQFP (supplier package: 240-PQFP 32×32) in a surface-mount form factor for board-level integration where a compact PQFP is required.
• Power Supply  Operates from a 2.3 V to 2.7 V supply, allowing designs targeting this supply range to integrate the device directly into existing power architectures.
• Operating Range & Grade  Commercial temperature grade with an operating range of 0 °C to 70 °C and RoHS compliance for environmental requirements.
• System Integration & Test  Family-level features include JTAG boundary-scan for board testability and embedded array blocks for implementing megafunctions without consuming core logic.
• Interconnect & Arithmetic Support  Family architecture provides dedicated carry and cascade chains and flexible interconnect structures to support arithmetic and high-fan-in logic functions.
• Reconfiguration & Clocking  Supports in-circuit reconfigurability via external configuration or JTAG and family-level clock features such as ClockLock/ClockBoost for clock management.

Typical Applications

• System Integration / SOPC  Implement custom system-on-a-programmable-chip functions where embedded arrays and on-chip RAM reduce external component count.
• Interface Bridging  Use the device’s 189 I/O pins and programmable logic to implement protocol adaptation, bus bridging, or glue logic between subsystems.
• Memory Buffering & Control  Leverage approximately 40,960 bits of embedded RAM for small buffering tasks, FIFOs, and local data storage within control logic.
• Prototyping & Low‑Volume Production  Reconfigurability and the surface-mount 240-pin package make this part suitable for rapid prototyping and production runs requiring programmable logic.

Unique Advantages

• Highly integrated logic and memory: 2,880 logic elements with roughly 40,960 bits of embedded RAM reduce the need for external glue logic and memory.
• Substantial I/O count: 189 user I/O pins provide flexibility for multi‑interface designs and high pin‑count signal routing.
• Commercial-grade and RoHS compliant: Designed for 0 °C to 70 °C operation and compliant with RoHS environmental requirements.
• Surface-mount 240‑pin packaging: 240-BFQFP (240-PQFP 32×32) offers a compact, manufacturable footprint for PCB integration.
• Built-in test and reconfiguration: JTAG boundary-scan and in-circuit reconfigurability simplify board-level testing and design iteration.
• Dedicated arithmetic and routing support: Family-level carry/cascade chains and flexible interconnect accelerate implementation of arithmetic and high‑fan‑in logic.

Why Choose EPF10K50EQC240-1N?

The EPF10K50EQC240-1N positions itself as a flexible, commercial-grade FPGA for designs that require a balanced mix of programmable logic, embedded memory, and plentiful I/O in a 240-pin surface-mount package. Its combination of 2,880 logic elements, embedded RAM, and family-level integration features supports system-level functions while reducing external component count.

This device is suited for engineering teams building prototypes, custom peripherals, interface bridges, or moderate-density programmable logic solutions where in-circuit reconfigurability, JTAG testability, and RoHS compliance are important selection criteria.

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