EPF10K50EQC208-3N

The EPF10K50EQC208-3N from Intel is a FLEX-10KE family field programmable gate array tailored for medium-density embedded designs. It combines 2,880 logic elements with approximately 40,960 bits of on-chip RAM and 147 user I/Os in a 208-pin BFQFP surface-mount package. Typical use cases include custom logic implementation, embedded memory megafunctions, I/O interfacing and system-level glue logic for commercial-grade applications.

Key Features

• Logic Capacity  2,880 logic elements for implementing combinational and sequential digital logic.
• Embedded Memory  Approximately 40,960 bits of on-chip RAM to support buffers, FIFOs and other memory-intensive functions.
• I/O Count & Flexibility  147 user I/O pins to support broad peripheral and bus interfacing requirements.
• Supply & Operating Range  Operates from 2.3 V to 2.7 V with a commercial operating temperature range of 0 °C to 70 °C.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for board-level assembly.
• System & Test Features  Family-level features include JTAG boundary-scan (IEEE Std. 1149.1) for in-circuit test and configuration options for in-system reconfigurability.
• Family Capabilities  FLEX 10K series architecture supports embedded array blocks and dedicated routing resources for arithmetic and high-fan-in logic functions as described in the FLEX 10K family documentation.
• Environmental Compliance  RoHS compliant; packaged and graded for commercial use.

Typical Applications

• Custom Digital Control  Implements application-specific control logic for commercial equipment and embedded controllers using on-chip logic and memory.
• Interface & Glue Logic  Handles protocol bridging, bus interfacing and I/O buffering where 147 I/Os enable flexible peripheral connections.
• Prototyping & Development  Medium-density designs and proof-of-concept systems benefit from the combination of logic elements and embedded RAM for rapid iteration.
• Memory-Intensive Functions  On-chip RAM supports FIFOs, buffers and small data storage requirements within embedded designs.

Unique Advantages

• Balanced Integration:  2,880 logic elements paired with ~40,960 bits of embedded RAM provide a practical blend of logic and memory for medium-complexity designs.
• Generous I/O Count:  147 user I/Os accommodate multiple peripherals and interface buses without external expander components.
• Commercial Temperature & RoHS Compliance:  Designed for commercial environments (0 °C to 70 °C) and RoHS compliant for regulatory compatibility.
• Surface-Mount 208-BFQFP Package:  Compact 208-pin PQFP package supports standard surface-mount assembly and board layout practices.
• In-System Test & Configuration:  JTAG boundary-scan support facilitates board-level test and in-circuit configuration workflows.
• Family-Level Architecture:  Leverages FLEX 10K family features such as embedded array blocks and dedicated carry/cascade resources for efficient implementation of arithmetic and high-fan-in logic.

Why Choose EPF10K50EQC208-3N?

The EPF10K50EQC208-3N positions itself as a practical medium-density FPGA option for commercial embedded designs that require a balance of logic, on-chip memory and a high I/O count in a surface-mount 208-pin package. Its specification set—2,880 logic elements, ~40,960 bits of RAM, 147 I/Os, 2.3–2.7 V supply and 0 °C to 70 °C rating—makes it suitable for system integration tasks such as protocol bridging, custom control logic and memory-backed user functions.

Choosing this FLEX-10KE device brings family-level architectural benefits (embedded array blocks, dedicated routing and test/configuration support) enabling efficient resource use and straightforward board-level integration for commercial deployments.

If you would like pricing, lead-time information or to request a quote for EPF10K50EQC208-3N, please submit a quote request or contact the sales team through your preferred procurement channel.