EPF10K50EQC208-3
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP |
|---|---|
| Quantity | 467 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EQC208-3 – FLEX-10KE Field Programmable Gate Array (FPGA) IC, 147 I/O, 40960 RAM bits, 2880 Logic Elements, 208-BFQFP
The EPF10K50EQC208-3 is a FLEX-10KE family field programmable gate array (FPGA) supplied in a 208-pin BFQFP surface-mount package. This commercial-grade device provides mid-range programmable logic capacity with 2,880 logic elements, approximately 40,960 bits of on-chip RAM, and 147 user I/Os—making it suited for a range of embedded and system integration tasks.
Built on the FLEX 10K family architecture, the device is intended for applications that require flexible, reprogrammable logic, embedded memory, and configurable I/O. The part operates from a 2.3 V to 2.7 V supply and is rated for commercial temperature operation from 0 °C to 70 °C. It is RoHS compliant and designed for surface-mount board assembly.
Key Features
- Core Logic 2,880 logic elements provide mid-density programmable logic capacity suitable for glue logic, protocol interfaces, and control functions.
- Embedded Memory Approximately 40,960 bits of on-chip RAM to implement FIFOs, small buffers, and other memory-intensive megafunctions.
- I/O Capacity 147 user I/Os for flexible interfacing to peripherals, sensors, buses, and custom connectors on board-level systems.
- Package & Mounting 208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for standard PCB assembly and compact board layouts.
- Power & Temperature Voltage supply 2.3 V to 2.7 V and commercial operating range of 0 °C to 70 °C for typical embedded and consumer applications.
- Compliance RoHS compliant, supporting environmental and assembly requirements for modern electronics production.
- Series-Level Capabilities (FLEX 10K family) Family features include embedded array support for megafunctions, in-circuit reconfigurability options, JTAG boundary-scan, FastTrack interconnect for predictable routing, and dedicated carry/cascade chains for arithmetic and high-fan-in logic (series-level feature set documented in the FLEX 10K family datasheet).
Typical Applications
- Embedded Control Implement custom control logic, state machines, and I/O aggregation for consumer and industrial control modules.
- Protocol Bridging & Interface Bridge multiple peripheral interfaces or translate signals between subsystems using available I/Os and on-chip memory.
- Prototyping & Development Rapid hardware prototyping where reprogrammable logic and embedded memory accelerate iterative development cycles.
- Custom Acceleration Offload deterministic, low-to-mid complexity tasks from a host MCU/processor to dedicated programmable logic blocks.
Unique Advantages
- Mid-range Logic Integration: 2,880 logic elements deliver a balanced mix of capacity and cost for designs that need more than simple PLDs but do not require high-density FPGAs.
- Significant On-Chip RAM: Approximately 40,960 bits of embedded memory reduce external SRAM/DRAM requirements for buffering and small data structures.
- Generous I/O Count: 147 user I/Os enable multiple peripheral connections and flexible signal routing without sacrificing board space.
- Surface-Mount 208-BFQFP Package: Compact, industry-standard package suitable for automated SMT assembly and moderate-density PCB layouts.
- Commercial-Grade Fit: Rated for 0 °C to 70 °C operation and RoHS compliant—appropriate for consumer, commercial, and many professional electronics applications.
- FLEX 10K Family Capabilities: Family-level features such as JTAG boundary-scan, in-circuit reconfigurability, and dedicated routing/carry resources provide design flexibility and testability.
Why Choose EPF10K50EQC208-3?
The EPF10K50EQC208-3 positions itself as a flexible, mid-density FPGA option for designs that demand reprogrammable logic, on-chip RAM, and a substantial number of I/Os in a compact surface-mount package. Its FLEX 10K family heritage brings system-level features—such as reconfigurability and boundary-scan—that help streamline development, testing, and field updates.
This part is well suited for engineers and procurement teams working on embedded control modules, interface bridging, prototyping platforms, and custom hardware accelerators where moderate logic density, embedded memory, and a high pin count are key selection criteria. The commercial-grade temperature rating and RoHS compliance make it appropriate for a broad set of consumer and commercial products.
Request a quote or submit an inquiry to get pricing, availability, and additional technical support for the EPF10K50EQC208-3.

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