EPF10K50EQC208-1N

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

Quantity 1,289 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EQC208-1N – FLEX-10KE Field Programmable Gate Array (FPGA)

The EPF10K50EQC208-1N is a FLEX-10KE series FPGA offered in a 208-BFQFP surface-mount package. Built for commercial embedded designs, it provides a mix of general-purpose logic, on-chip RAM, and flexible I/O suitable for control, interface, and system-integration tasks.

As a member of the FLEX 10K family, this device targets applications that require programmable logic with embedded memory and a comprehensive I/O set, delivering integration that helps simplify board-level design and reduce component count.

Key Features

  • Logic Capacity — 2,880 logic elements and approximately 199,000 gates to implement combinational and sequential logic functions.
  • Logic Array Blocks (LABs) — 360 LABs for structured logic organization and predictable placement.
  • Embedded RAM — Approximately 0.04 Mbits (40,960 bits) of on-chip RAM for local storage and buffering.
  • I/O and Interfacing — 147 user I/O pins to support a wide range of peripherals and interface requirements.
  • Package & Mounting — 208-BFQFP (Supplier package: 208-PQFP, 28×28) in a surface-mount form factor for through-board density and standard assembly flow.
  • Power — 2.3 V to 2.7 V operating supply range suitable for targeted commercial system rails.
  • Operating Temperature — Commercial grade operation from 0 °C to 70 °C for typical embedded and consumer environments.
  • Standards & Compliance — RoHS compliant.
  • FLEX 10K Family Capabilities — Family-level features include in-circuit reconfigurability options (external configuration device, intelligent controller, or JTAG), built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990, and architecture-level support for dedicated carry and cascade chains for arithmetic and high-fan-in logic (family feature set).

Typical Applications

  • Embedded Control — Implement custom control logic, state machines, and protocol bridges for industrial or commercial embedded systems.
  • User Interfaces — Drive and manage display controllers, button/key scan, and custom input/output handling using the device’s abundant I/O.
  • Peripheral Interfacing — Bridge multiple peripheral buses and implement glue logic between processors and specialized devices leveraging on-chip RAM for buffering.
  • Signal Aggregation & Preprocessing — Aggregate, reorder, or pre-process digital signals before handing off to a host MCU or processor.

Unique Advantages

  • Balanced Logic and Memory: Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to support both control logic and local data buffering on a single device.
  • Flexible I/O Count: 147 user I/O pins provide connectivity options for multiple peripherals without external multiplexers.
  • Commercial Temperature Suitability: Specified for 0 °C to 70 °C operation, matching typical commercial product requirements.
  • Standard Package and Assembly: 208-pin BFQFP surface-mount package (28×28 PQFP form factor) simplifies PCB layout and standard SMT assembly.
  • RoHS Compliance: Meets RoHS requirements to simplify regulatory considerations for commercial products.
  • Family-Level Development Benefits: Leverages FLEX 10K family features—such as JTAG boundary-scan, in-circuit reconfigurability options, and dedicated arithmetic/cascade chains—for faster development and predictable performance (family-level advantages).

Why Choose EPF10K50EQC208-1N?

The EPF10K50EQC208-1N delivers a pragmatic combination of programmable logic density, embedded memory, and a substantial I/O complement in a commercial-grade package. It is suited to designers who need to consolidate glue logic, protocol handling, and local data buffering into a single programmable device while keeping to standard board-level assembly practices.

With FLEX 10K family features available for system-level flexibility—such as JTAG boundary-scan and reconfiguration options—this part is a good fit for product teams focused on mid-density programmable logic implementations that require reliable vendor-backed architecture and predictable integration into existing workflows.

Request a quote or submit your sourcing inquiry to obtain pricing, availability, and support for EPF10K50EQC208-1N.

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