EPF10K50EQC208-2N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP |
|---|---|
| Quantity | 447 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EQC208-2N – FLEX-10KE FPGA, 2,880 Logic Elements, 40,960‑bit Embedded RAM, 208‑BFQFP
The EPF10K50EQC208-2N is a FLEX-10KE family field programmable gate array (FPGA) supplied in a 208‑pin BFQFP package for surface-mount applications. It combines a medium-density logic array with a substantial on-chip embedded memory footprint and a large I/O count to address commercial embedded designs.
Designed for system-level integration, this device supports in-circuit reconfiguration and a variety of FPGA architecture features that simplify implementing memory-rich logic, glue logic, and complex interfacing functions in commercial products.
Key Features
- Logic Capacity — 2,880 logic elements (LEs) providing approximately 199,000 gates of combinational and sequential logic for mid-range designs.
- Embedded Memory — 40,960 total RAM bits of on-chip memory, enabling efficient implementation of FIFOs, buffers, and other memory-intensive functions.
- I/O and Connectivity — 147 user I/O pins to support broad peripheral and interface connectivity in a single device package.
- Package & Mounting — 208‑BFQFP (208‑PQFP 28×28) surface-mount package for through-board density and standard PCB assembly flows.
- Power Supply Range — Operates from 2.3 V to 2.7 V, allowing use in systems with lower-voltage power domains.
- Operating Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- System & Configuration Support — Supports in-circuit reconfigurability and JTAG boundary-scan per IEEE 1149.1 for device programming and test access (family-level feature).
- Clocking and Routing — Built-in low‑skew clock distribution, global clock signals, and dedicated carry/cascade chains to implement arithmetic and high‑fan‑in logic more efficiently (family-level architecture).
- Environmental Compliance — RoHS compliant for lead-free assembly and regulatory alignment.
Typical Applications
- Embedded Controllers — Implement control logic, protocol bridging, and peripheral interfacing where a combination of moderate logic and embedded RAM is required.
- Memory-Intensive Logic — On-chip RAM supports buffering, FIFOs, and small data stores for communications and streaming applications.
- Interface and Glue Logic — High I/O count and programmable I/O functions make the device suitable for consolidating interface functions and reducing component count on commercial PCBs.
- Prototyping and Evaluation — Reconfigurability and JTAG support facilitate iterative development and board-level testing during design bring-up.
Unique Advantages
- Balanced Integration: Combines 2,880 logic elements with 40,960 bits of embedded RAM to handle logic and memory tasks within a single FPGA, reducing external component needs.
- High I/O Density: 147 user I/O pins provide flexible connectivity for interfaces, sensors, and peripherals without additional I/O expanders.
- Compact, Standard Package: 208‑BFQFP surface-mount packaging delivers a compact footprint compatible with standard PCB assembly processes.
- Commercial Temperature Rating: Rated for 0 °C to 70 °C operation to match commercial product deployment and testing profiles.
- Reconfiguration & Testability: In-circuit reconfigurability and JTAG boundary-scan support streamline development, updates, and manufacturing test flows.
- Regulatory Readiness: RoHS compliance supports lead‑free assembly and simplifies regulatory considerations for commercial products.
Why Choose EPF10K50EQC208-2N?
The EPF10K50EQC208-2N positions itself as a mid-density FLEX-10KE FPGA option for commercial embedded designs that require a mix of logic and significant on-chip RAM. With 2,880 logic elements, 40,960 bits of embedded memory, and a 147-pin I/O complement in a 208‑pin BFQFP package, it is well suited to consolidate glue logic, implement buffering and data-path functions, and accelerate prototyping and product development.
Engineers designing commercial systems will find this device useful when they need a balance of integration, configurable I/O, and reconfigurability, backed by family-level architecture features such as dedicated carry/cascade chains and low-skew clocking to simplify implementation of arithmetic and timing-critical logic.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EPF10K50EQC208-2N.

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