EPF10K50EQC208-2N

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

Quantity 447 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EQC208-2N – FLEX-10KE FPGA, 2,880 Logic Elements, 40,960‑bit Embedded RAM, 208‑BFQFP

The EPF10K50EQC208-2N is a FLEX-10KE family field programmable gate array (FPGA) supplied in a 208‑pin BFQFP package for surface-mount applications. It combines a medium-density logic array with a substantial on-chip embedded memory footprint and a large I/O count to address commercial embedded designs.

Designed for system-level integration, this device supports in-circuit reconfiguration and a variety of FPGA architecture features that simplify implementing memory-rich logic, glue logic, and complex interfacing functions in commercial products.

Key Features

  • Logic Capacity — 2,880 logic elements (LEs) providing approximately 199,000 gates of combinational and sequential logic for mid-range designs.
  • Embedded Memory — 40,960 total RAM bits of on-chip memory, enabling efficient implementation of FIFOs, buffers, and other memory-intensive functions.
  • I/O and Connectivity — 147 user I/O pins to support broad peripheral and interface connectivity in a single device package.
  • Package & Mounting — 208‑BFQFP (208‑PQFP 28×28) surface-mount package for through-board density and standard PCB assembly flows.
  • Power Supply Range — Operates from 2.3 V to 2.7 V, allowing use in systems with lower-voltage power domains.
  • Operating Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • System & Configuration Support — Supports in-circuit reconfigurability and JTAG boundary-scan per IEEE 1149.1 for device programming and test access (family-level feature).
  • Clocking and Routing — Built-in low‑skew clock distribution, global clock signals, and dedicated carry/cascade chains to implement arithmetic and high‑fan‑in logic more efficiently (family-level architecture).
  • Environmental Compliance — RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

  • Embedded Controllers — Implement control logic, protocol bridging, and peripheral interfacing where a combination of moderate logic and embedded RAM is required.
  • Memory-Intensive Logic — On-chip RAM supports buffering, FIFOs, and small data stores for communications and streaming applications.
  • Interface and Glue Logic — High I/O count and programmable I/O functions make the device suitable for consolidating interface functions and reducing component count on commercial PCBs.
  • Prototyping and Evaluation — Reconfigurability and JTAG support facilitate iterative development and board-level testing during design bring-up.

Unique Advantages

  • Balanced Integration: Combines 2,880 logic elements with 40,960 bits of embedded RAM to handle logic and memory tasks within a single FPGA, reducing external component needs.
  • High I/O Density: 147 user I/O pins provide flexible connectivity for interfaces, sensors, and peripherals without additional I/O expanders.
  • Compact, Standard Package: 208‑BFQFP surface-mount packaging delivers a compact footprint compatible with standard PCB assembly processes.
  • Commercial Temperature Rating: Rated for 0 °C to 70 °C operation to match commercial product deployment and testing profiles.
  • Reconfiguration & Testability: In-circuit reconfigurability and JTAG boundary-scan support streamline development, updates, and manufacturing test flows.
  • Regulatory Readiness: RoHS compliance supports lead‑free assembly and simplifies regulatory considerations for commercial products.

Why Choose EPF10K50EQC208-2N?

The EPF10K50EQC208-2N positions itself as a mid-density FLEX-10KE FPGA option for commercial embedded designs that require a mix of logic and significant on-chip RAM. With 2,880 logic elements, 40,960 bits of embedded memory, and a 147-pin I/O complement in a 208‑pin BFQFP package, it is well suited to consolidate glue logic, implement buffering and data-path functions, and accelerate prototyping and product development.

Engineers designing commercial systems will find this device useful when they need a balance of integration, configurable I/O, and reconfigurability, backed by family-level architecture features such as dedicated carry/cascade chains and low-skew clocking to simplify implementation of arithmetic and timing-critical logic.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EPF10K50EQC208-2N.

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