EPF10K50EQC240-2

The EPF10K50EQC240-2 is a FLEX 10K family embedded programmable logic device optimized for system-level integration and complex glue logic. It combines a dense logic array with significant on-chip RAM and a high I/O count to support memory-intensive megafunctions and multi‑signal interfacing in commercial-temperature designs.

As a surface-mount FPGA in a 240-pin BFQFP package, this device targets applications that require configurable logic, embedded memory resources, and flexible I/O while operating from a 2.3 V to 2.7 V supply.

Key Features

• Core Logic  Approximately 2,880 logic elements organized alongside 360 LABs for implementing combinational and sequential logic functions.
• Embedded Memory  40,960 bits of on-chip RAM to support memory-heavy functions and megafunction implementations.
• I/O Capacity  189 user I/O pins to accommodate multiple interfaces and parallel signal connectivity on a single device.
• Gate Density  Device gate-equivalent capacity of 199,000 gates for integrating substantial logic and control functions.
• Configuration and Test  Includes JTAG boundary-scan test capability (IEEE 1149.1) and supports in-circuit reconfigurability methods described for the FLEX 10K family.
• Package and Mounting  240-BFQFP package (supplier device package: 240-PQFP, 32×32) with surface-mount mounting for standard PCB assembly.
• Power  Operates from a 2.3 V to 2.7 V supply, enabling use in systems with lower-voltage logic domains.
• Temperature and Grade  Commercial grade device rated for 0 °C to 70 °C operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• System Integration / SOPC  Use as a system-on-a-programmable-chip element to consolidate glue logic, protocol adapters, and custom megafunctions with embedded RAM.
• Memory‑Intensive Logic  On-chip RAM capacity supports buffering, small on-chip storage structures, and custom memory-based functions without external RAM in some use cases.
• High‑I/O Interfacing  With 189 user I/Os, the device is suitable for designs that require multiple parallel or mixed-signal interfaces routed through a single programmable device.

Unique Advantages

• Balanced Logic and Memory:  Combines thousands of logic elements with 40,960 bits of embedded RAM to implement both control logic and data buffering on-chip.
• High I/O Count:  189 user pins reduce the need for external I/O expanders and simplify board-level connectivity for multi-interface designs.
• Flexible Packaging:  240-pin BFQFP surface-mount package provides a compact footprint compatible with standard PCB assembly processes.
• Design for Test:  Built-in JTAG boundary-scan simplifies board-level testing and in-field diagnostics without consuming user logic.
• Commercial Temperature Rating:  Rated 0 °C to 70 °C for mainstream commercial applications.
• RoHS Compliant:  Meets lead-free compliance requirements for modern assembly and environmental standards.

Why Choose EPF10K50EQC240-2?

EPF10K50EQC240-2 positions itself as a versatile FLEX 10K family device that balances logic density, embedded memory, and a high I/O count in a 240-pin BFQFP package. Its on-chip resources and JTAG support make it suitable for designers seeking to consolidate functions, implement megafunctions, or manage multiple interfaces within a commercial-temperature platform.

This device is appropriate for engineering teams that require a configurable, RoHS-compliant FPGA with substantial embedded RAM and broad I/O capacity, offering a predictable platform for prototyping and production where 2.3 V–2.7 V operation and 0 °C–70 °C environmental range are required.

Request a quote or submit a pricing and availability inquiry to evaluate EPF10K50EQC240-2 for your next design.