EPF10K50EQI240-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP |
|---|---|
| Quantity | 1,043 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50EQI240-2 – FLEX-10KE Field Programmable Gate Array (FPGA) IC, 189 I/O, 40,960-bit RAM, 2,880 Logic Elements, 240-BFQFP
The EPF10K50EQI240-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel, offering a balance of logic capacity, embedded memory, and I/O density for industrial designs. It combines an embedded programmable logic architecture with on-chip RAM and flexible I/O to support system-level integration and interface-driven applications.
Designed for surface-mount deployment in a 240-BFQFP package, this device targets industrial applications that require moderate gate density, substantial on-chip RAM, and broad I/O counts while operating across a wide temperature and voltage range.
Key Features
- Logic Capacity 2,880 logic elements and approximately 199,000 gates provide the programmable fabric for implementing custom digital logic and control functions.
- Embedded Memory 40,960 total RAM bits of on-chip memory for data buffering, state storage, and implementing memory-based megafunctions.
- I/O Density 189 user I/O pins to support multiple interfaces, sensor connections, and peripheral control on a single device.
- Power Supply Operates from a 2.3 V to 2.7 V supply, allowing integration into systems using that voltage domain.
- Package & Mounting Surface-mount 240-BFQFP (supplier device package: 240-PQFP, 32×32) for board-level integration with established assembly processes.
- Industry Grade & Temperature Range Industrial grade device specified for operation from −40°C to 85°C.
- Built-in Test & Configuration Includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1, enabling in-system test and configuration without consuming device logic.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Implement motor control logic, supervisory state machines, and deterministic I/O handling using the device's logic elements and wide temperature rating.
- Communications & Protocol Bridging Use the high I/O count and embedded memory to implement protocol conversion, buffering, and interface bridging between subsystems.
- Embedded System Integration (SOPC) Leverage on-chip RAM and programmable logic to integrate specialized functions and small memory blocks for compact system-on-a-programmable-chip designs.
- Peripheral and Sensor Interfaces Drive multiple sensor lines, control buses, and peripheral devices with available user I/Os and configurable I/O options.
Unique Advantages
- High-density programmable fabric: 2,880 logic elements with ~199,000 gates provide the capacity to implement complex control and signal-processing logic.
- Significant on-chip RAM: 40,960 bits of embedded memory reduce external RAM requirements for many buffering and lookup tasks.
- Broad I/O availability: 189 user I/Os enable direct interfacing to multiple peripherals and sensors without additional I/O expanders.
- Industrial-ready thermal range: Specified −40°C to 85°C for reliable operation in industrial environments.
- Board-friendly package: 240-BFQFP surface-mount package simplifies assembly and is suited to space-constrained PCB layouts.
- Built-in boundary-scan testing: IEEE 1149.1 JTAG support facilitates in-system test and configuration workflows.
Why Choose EPF10K50EQI240-2?
The EPF10K50EQI240-2 delivers a balanced combination of logic elements, embedded RAM, and robust I/O count in a surface-mount 240-BFQFP package, positioned for industrial applications that need programmable integration without excessive external components. Its operating range of 2.3 V–2.7 V and certified RoHS compliance make it suitable for modern industrial electronics assemblies.
This device is a practical choice for engineers developing mid-density FPGA-based controllers, interface bridges, and embedded logic solutions who require industrial temperature performance, on-chip memory, and extensive I/O in a proven FLEX-10KE architecture from Intel.
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