EPF10K50EQI240-2

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

Quantity 1,043 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O189Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50EQI240-2 – FLEX-10KE Field Programmable Gate Array (FPGA) IC, 189 I/O, 40,960-bit RAM, 2,880 Logic Elements, 240-BFQFP

The EPF10K50EQI240-2 is a FLEX-10KE family field programmable gate array (FPGA) from Intel, offering a balance of logic capacity, embedded memory, and I/O density for industrial designs. It combines an embedded programmable logic architecture with on-chip RAM and flexible I/O to support system-level integration and interface-driven applications.

Designed for surface-mount deployment in a 240-BFQFP package, this device targets industrial applications that require moderate gate density, substantial on-chip RAM, and broad I/O counts while operating across a wide temperature and voltage range.

Key Features

  • Logic Capacity 2,880 logic elements and approximately 199,000 gates provide the programmable fabric for implementing custom digital logic and control functions.
  • Embedded Memory 40,960 total RAM bits of on-chip memory for data buffering, state storage, and implementing memory-based megafunctions.
  • I/O Density 189 user I/O pins to support multiple interfaces, sensor connections, and peripheral control on a single device.
  • Power Supply Operates from a 2.3 V to 2.7 V supply, allowing integration into systems using that voltage domain.
  • Package & Mounting Surface-mount 240-BFQFP (supplier device package: 240-PQFP, 32×32) for board-level integration with established assembly processes.
  • Industry Grade & Temperature Range Industrial grade device specified for operation from −40°C to 85°C.
  • Built-in Test & Configuration Includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1, enabling in-system test and configuration without consuming device logic.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control Implement motor control logic, supervisory state machines, and deterministic I/O handling using the device's logic elements and wide temperature rating.
  • Communications & Protocol Bridging Use the high I/O count and embedded memory to implement protocol conversion, buffering, and interface bridging between subsystems.
  • Embedded System Integration (SOPC) Leverage on-chip RAM and programmable logic to integrate specialized functions and small memory blocks for compact system-on-a-programmable-chip designs.
  • Peripheral and Sensor Interfaces Drive multiple sensor lines, control buses, and peripheral devices with available user I/Os and configurable I/O options.

Unique Advantages

  • High-density programmable fabric: 2,880 logic elements with ~199,000 gates provide the capacity to implement complex control and signal-processing logic.
  • Significant on-chip RAM: 40,960 bits of embedded memory reduce external RAM requirements for many buffering and lookup tasks.
  • Broad I/O availability: 189 user I/Os enable direct interfacing to multiple peripherals and sensors without additional I/O expanders.
  • Industrial-ready thermal range: Specified −40°C to 85°C for reliable operation in industrial environments.
  • Board-friendly package: 240-BFQFP surface-mount package simplifies assembly and is suited to space-constrained PCB layouts.
  • Built-in boundary-scan testing: IEEE 1149.1 JTAG support facilitates in-system test and configuration workflows.

Why Choose EPF10K50EQI240-2?

The EPF10K50EQI240-2 delivers a balanced combination of logic elements, embedded RAM, and robust I/O count in a surface-mount 240-BFQFP package, positioned for industrial applications that need programmable integration without excessive external components. Its operating range of 2.3 V–2.7 V and certified RoHS compliance make it suitable for modern industrial electronics assemblies.

This device is a practical choice for engineers developing mid-density FPGA-based controllers, interface bridges, and embedded logic solutions who require industrial temperature performance, on-chip memory, and extensive I/O in a proven FLEX-10KE architecture from Intel.

Request a quote or submit your parts inquiry to receive pricing and availability for the EPF10K50EQI240-2.

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