EPF10K50ETC144-2

The EPF10K50ETC144-2 is an Intel FLEX-10KE field programmable gate array (FPGA) delivered in a 144-pin LQFP package. It combines a mid-range logic fabric with embedded memory and flexible I/O for commercial embedded designs requiring reconfigurable logic and on-chip RAM.

Designed for system integration and programmable logic functions, this device targets applications that need moderate gate density, embedded memory, and a compact surface-mount package while operating within a 2.3 V to 2.7 V supply range and a 0 °C to 70 °C commercial temperature window.

Key Features

• Logic Capacity — 2,880 logic elements provide the core programmable resources for implementing custom logic, state machines, and peripheral glue logic.
• Embedded Memory — Approximately 40,960 bits of on-chip RAM for data buffering, small lookup tables, and temporary storage.
• I/O and Connectivity — 102 user I/O pins in a compact 144-pin package give ample peripheral connectivity for sensors, buses, and control signals.
• Package and Mounting — Surface-mount 144-LQFP package; supplier device package listed as 144-TQFP (20×20) for PCB footprint planning.
• Power and Voltage — Operates from 2.3 V to 2.7 V, allowing integration into systems with lower-voltage core rails.
• Operating Range — Commercial-grade temperature range from 0 °C to 70 °C for standard ambient environments.
• System Features (FLEX 10K family) — Family-level capabilities include embedded array blocks for megafunctions, in-circuit reconfigurability via external configuration devices or JTAG, and JTAG boundary-scan test circuitry.
• Standards & Compliance — RoHS compliant for regulatory environmental requirements.

Typical Applications

• Embedded Control — Implement custom control logic, state machines, and peripheral interfaces for consumer and commercial electronics.
• Data Buffering & Processing — Use the on-chip RAM for small FIFOs, buffers, and lookup tables in signal processing or interface bridging.
• Interface Glue and Bus Bridging — Provide protocol adaptation, timing alignment, and bus arbitration between disparate peripherals and system controllers.
• Prototype and Development — Compact FPGA option for rapid prototyping of digital logic and system-on-programmable-chip concepts within commercial temperature ranges.

Unique Advantages

• Balanced Logic and Memory: A combination of 2,880 logic elements and ~40,960 bits of embedded RAM supports mixed logic-and-memory functions without external SRAM for many use cases.
• Compact, Surface-Mount Package: 144-LQFP (supplier 144-TQFP 20×20) lets you deploy reconfigurable logic in space-constrained PCB designs.
• Flexible I/O Count: 102 user I/O pins enable integration with a wide variety of peripherals and sensors while keeping the board-level BOM simple.
• Family-Level Integration Features: FLEX 10K family capabilities such as in-circuit reconfigurability and JTAG boundary-scan streamline development and field-upgrade workflows.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product builds and supply-chain requirements.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C operation to match typical commercial product environments.

Why Choose EPF10K50ETC144-2?

The EPF10K50ETC144-2 offers a practical balance of programmable logic resources, embedded memory, and I/O density in a compact surface-mount package from Intel’s FLEX-10KE family. It is suited to engineering teams that need reconfigurable logic for embedded control, interface bridging, or prototype systems within commercial temperature ranges and a 2.3 V–2.7 V supply domain.

Choosing this FPGA brings predictable integration: measurable logic capacity, explicit on-chip RAM, and family-level features like in-circuit reconfigurability and JTAG testability that simplify development cycles and product iterations.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability for the EPF10K50ETC144-2.