EPF10K50ETI144-2N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP |
|---|---|
| Quantity | 1,271 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50ETI144-2N – FLEX-10KE Field Programmable Gate Array (FPGA), 102 I/O, 144-LQFP
The EPF10K50ETI144-2N is an Intel FLEX-10KE series field programmable gate array supplied in a 144-LQFP package. It combines a logic array and embedded memory to support system-level programmable logic implementations for industrial applications.
Designed for surface-mount board integration, this industrial-grade FPGA provides a balance of logic density, on-chip RAM and I/O capacity suitable for embedded control, protocol bridging and custom logic functions within industrial temperature ranges.
Key Features
- Logic Capacity — 2,880 logic elements and 360 LABs provide programmable logic resources to implement custom combinational and sequential functions.
- On-chip Memory — 40,960 bits of embedded RAM for buffering, lookup tables and megafunction implementations.
- I/O and Gate Count — 102 user I/O pins and a device gate count of 199,000 for interfacing and system integration tasks.
- Voltage and Power — Operates from a 2.3 V to 2.7 V supply range to match target system power rails.
- Package and Mounting — 144-LQFP (supplier device package listed as 144-TQFP 20×20) in a surface-mount form factor for standard PCB assembly.
- Temperature and Grade — Industrial temperature range of −40 °C to 85 °C and industrial grade for deployment in commercial and industrial environments.
- Configuration and Test — Series-level capabilities include in-circuit reconfigurability via external configuration devices and built-in JTAG boundary-scan test circuitry for board-level testability.
- Series Architecture Features — The FLEX 10K family architecture offers features such as dedicated carry and cascade chains, global clock signals and flexible interconnect for implementing arithmetic, wide fan-in logic and predictable routing delays.
- Compliance — RoHS-compliant construction to meet environmental directive requirements.
Typical Applications
- Embedded Systems and SOPC Integration — Use the on-chip memory and logic array to implement system-on-a-programmable-chip (SOPC) functions and custom processing blocks.
- Industrial Control — Implement sensor interfacing, control logic and custom protocol handling within industrial temperature envelopes.
- Custom I/O and Glue Logic — Provide protocol bridging, timing adaptation and peripheral interfacing using available I/O and programmable logic.
Unique Advantages
- Balanced Logic and Memory Mix — 2,880 logic elements combined with 40,960 bits of embedded RAM enable compact implementations of control, buffering and lookup functions without external memory.
- Predictable Integration — 102 I/O pins and a 144-LQFP surface-mount package simplify board-level integration and PCB layout for mid-density designs.
- Industrial Reliability — Rated for −40 °C to 85 °C operation and designated industrial grade for deployments in commercial and industrial environments.
- Design-for-Test Support — Built-in JTAG boundary-scan circuitry supports board-level test and diagnostics without consuming device logic.
- Configurable System-Level Features — Series-level features such as dedicated carry/cascade chains and flexible interconnect help implement arithmetic and high-fan-in logic efficiently.
Why Choose EPF10K50ETI144-2N?
The EPF10K50ETI144-2N offers a practical combination of logic elements, embedded RAM and I/O in a compact 144-LQFP package designed for industrial applications. Its FLEX 10K family architecture and built-in test/configuration features provide a strong foundation for embedded control, custom interfacing and mid-density programmable logic tasks.
This device is well suited for engineering teams seeking a field-programmable solution with on-chip memory, industrial temperature capability and established series-level features to accelerate system integration and board-level testing.
Request a quote or submit an inquiry to receive pricing and availability details for the EPF10K50ETI144-2N.

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