EPF10K50SBC356-1
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 356-LBGA |
|---|---|
| Quantity | 1,838 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50SBC356-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 I/O, 40.96 kbit RAM, 2,880 Logic Elements, 356-LBGA
The EPF10K50SBC356-1 is a field programmable gate array (FPGA) from Altera, offered in a 356-LBGA package. It provides a mid-range programmable logic solution with 2,880 logic elements, approximately 40.96 kbits of on-chip RAM and 220 general-purpose I/O pins.
Designed for commercial-temperature applications, this surface-mount FPGA suits designs that need a configurable logic fabric with a moderate I/O footprint, defined power rails (2.375 V to 2.625 V), and a compact BGA package.
Key Features
- Logic Capacity Offers 2,880 logic elements, enabling moderate-density programmable logic implementations and custom digital functions.
- Embedded Memory Includes 40,960 bits of on-chip RAM (approximately 40.96 kbits) for small buffers, state machines, and local storage.
- I/O Resources Provides 220 I/O pins to support multiple peripheral connections and parallel interfaces within a single device.
- Gate Count Approximately 199,000 gates of logic capacity for combinational and sequential logic requirements.
- Package and Mounting 356-LBGA package (supplier device package: 356-BGA, 35×35) optimized for surface-mount assembly and compact board layouts.
- Power Operates from a defined core supply range of 2.375 V to 2.625 V to match system power rail requirements.
- Operating Range and Grade Commercial grade device rated for operation from 0 °C to 70 °C.
- Regulatory RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Embedded Control and Prototyping Use the device where moderate programmable logic and on-chip RAM are needed to implement control logic, glue logic, or prototype digital designs.
- I/O-Intensive Modules Suitable for subsystems that require a substantial number of general-purpose I/Os (220 pins) for parallel sensors, display interfaces, or peripheral aggregation.
- Custom Logic and Glue Functions Ideal for designs that require custom combinational/sequential logic, protocol bridging, or signal conditioning in a compact BGA footprint.
Unique Advantages
- Balanced Logic and Memory: 2,880 logic elements combined with ~40.96 kbits of embedded RAM provide a practical balance for medium-complexity functions without external memory.
- High I/O Count in Compact Package: 220 I/Os delivered in a 356-LBGA (35×35) package enable dense connectivity while conserving PCB area.
- Defined Power Envelope: Specified core voltage range (2.375 V–2.625 V) simplifies power-rail planning and integration into existing systems.
- Commercial-Grade Reliability: Rated for 0 °C to 70 °C operation, suitable for a wide range of commercial applications and environments.
- RoHS Compliant: Supports lead-free manufacturing processes and regulatory requirements for consumer and commercial products.
Why Choose EPF10K50SBC356-1?
The EPF10K50SBC356-1 positions itself as a mid-range FPGA option for designers needing a compact, surface-mount device with a substantial I/O count and modest embedded memory. Its combination of 2,880 logic elements, approximately 40.96 kbits of on-chip RAM, and roughly 199,000 gates makes it well suited for control logic, interface bridging, and configurable subsystems in commercial-temperature products.
Engineers and procurement teams will find value in the device’s clear electrical and thermal specs—2.375 V to 2.625 V core supply and 0 °C to 70 °C operating range—along with its RoHS compliance and BGA packaging for space-constrained designs.
Request a quote or submit an inquiry to get pricing and availability for the EPF10K50SBC356-1 and to discuss how it fits your next design.

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