EPF10K50SBC356-1

IC FPGA 220 I/O 356BGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 356-LBGA

Quantity 1,838 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O220Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SBC356-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 I/O, 40.96 kbit RAM, 2,880 Logic Elements, 356-LBGA

The EPF10K50SBC356-1 is a field programmable gate array (FPGA) from Altera, offered in a 356-LBGA package. It provides a mid-range programmable logic solution with 2,880 logic elements, approximately 40.96 kbits of on-chip RAM and 220 general-purpose I/O pins.

Designed for commercial-temperature applications, this surface-mount FPGA suits designs that need a configurable logic fabric with a moderate I/O footprint, defined power rails (2.375 V to 2.625 V), and a compact BGA package.

Key Features

  • Logic Capacity  Offers 2,880 logic elements, enabling moderate-density programmable logic implementations and custom digital functions.
  • Embedded Memory  Includes 40,960 bits of on-chip RAM (approximately 40.96 kbits) for small buffers, state machines, and local storage.
  • I/O Resources  Provides 220 I/O pins to support multiple peripheral connections and parallel interfaces within a single device.
  • Gate Count  Approximately 199,000 gates of logic capacity for combinational and sequential logic requirements.
  • Package and Mounting  356-LBGA package (supplier device package: 356-BGA, 35×35) optimized for surface-mount assembly and compact board layouts.
  • Power  Operates from a defined core supply range of 2.375 V to 2.625 V to match system power rail requirements.
  • Operating Range and Grade  Commercial grade device rated for operation from 0 °C to 70 °C.
  • Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Embedded Control and Prototyping  Use the device where moderate programmable logic and on-chip RAM are needed to implement control logic, glue logic, or prototype digital designs.
  • I/O-Intensive Modules  Suitable for subsystems that require a substantial number of general-purpose I/Os (220 pins) for parallel sensors, display interfaces, or peripheral aggregation.
  • Custom Logic and Glue Functions  Ideal for designs that require custom combinational/sequential logic, protocol bridging, or signal conditioning in a compact BGA footprint.

Unique Advantages

  • Balanced Logic and Memory:  2,880 logic elements combined with ~40.96 kbits of embedded RAM provide a practical balance for medium-complexity functions without external memory.
  • High I/O Count in Compact Package:  220 I/Os delivered in a 356-LBGA (35×35) package enable dense connectivity while conserving PCB area.
  • Defined Power Envelope:  Specified core voltage range (2.375 V–2.625 V) simplifies power-rail planning and integration into existing systems.
  • Commercial-Grade Reliability:  Rated for 0 °C to 70 °C operation, suitable for a wide range of commercial applications and environments.
  • RoHS Compliant:  Supports lead-free manufacturing processes and regulatory requirements for consumer and commercial products.

Why Choose EPF10K50SBC356-1?

The EPF10K50SBC356-1 positions itself as a mid-range FPGA option for designers needing a compact, surface-mount device with a substantial I/O count and modest embedded memory. Its combination of 2,880 logic elements, approximately 40.96 kbits of on-chip RAM, and roughly 199,000 gates makes it well suited for control logic, interface bridging, and configurable subsystems in commercial-temperature products.

Engineers and procurement teams will find value in the device’s clear electrical and thermal specs—2.375 V to 2.625 V core supply and 0 °C to 70 °C operating range—along with its RoHS compliance and BGA packaging for space-constrained designs.

Request a quote or submit an inquiry to get pricing and availability for the EPF10K50SBC356-1 and to discuss how it fits your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up