EPF10K50SFC256-2

The EPF10K50SFC256-2 is a FLEX 10K family embedded programmable logic device optimized for system-level integration and memory‑aware logic functions. It combines a logic array and embedded memory resources in a compact 256‑FBGA (17×17) package to serve commercial embedded designs that require mid‑density logic, significant on‑chip RAM, and a high pin count.

Designed for system‑on‑a‑programmable‑chip (SOPC) integration, this device targets applications that need flexible I/O, dedicated on‑chip memory, and predictable clock and routing structures for reliable embedded control and interface tasks.

Key Features

• Logic Capacity — 2,880 logic elements and 360 logic array blocks (LABs) to implement mid‑density combinational and sequential logic.
• Embedded Memory — 40,960 total RAM bits of on‑chip embedded memory for buffering, lookup tables, and memory‑intensive functions.
• I/O and System Connectivity — 191 user I/O pins to support a broad set of external peripherals and interfaces.
• Gate Count — 199,000 gates reported for integration planning and system partitioning.
• Package — 256‑FBGA (17×17) surface‑mount package for compact board integration and high‑density routing.
• Power — Core supply range specified at 2.375 V to 2.625 V to match system power domains.
• Operating Grade — Commercial grade device rated for 0 °C to 70 °C operation.
• Manufacturing and Compliance — RoHS‑compliant supply status for regulatory and assembly considerations.
• Series Capabilities (from FLEX 10K family) — Embedded array support for megafunctions, in‑circuit reconfigurability options, dedicated carry and cascade chains, low‑skew clock distribution, and JTAG boundary‑scan test support for system testability and predictable timing.

Typical Applications

• Embedded Control — Implement machine control, protocol handling, and glue logic where a mix of logic and embedded RAM simplifies board design and reduces external components.
• Interface and Peripheral Bridging — Use the device’s 191 I/O pins and on‑chip memory to buffer and translate between subsystems or peripherals in commercial electronics.
• Memory‑Intensive Functions — Leverage 40,960 bits of embedded RAM for packet buffering, lookup tables, and state storage in mid‑range designs.

Unique Advantages

• Balanced Mid‑Density Integration: 2,880 logic elements and substantial embedded RAM deliver a balance of logic and memory for compact system implementations.
• High I/O Count in a Compact Package: 191 user I/Os in a 256‑FBGA package supports dense interfacing without a large PCB footprint.
• Predictable Timing and System Features: Family features such as low‑skew clock distribution, dedicated carry/cascade chains, and JTAG boundary‑scan improve timing predictability and testability.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 70 °C operation and RoHS compliant to align with commercial product and assembly requirements.
• Flexible Configuration Options: Supports in‑circuit reconfigurability and embedded array usage for implementing megafunctions and reducing external component count.

Why Choose EPF10K50SFC256-2?

The EPF10K50SFC256-2 positions itself as a practical choice for commercial embedded systems that require a mid‑density programmable logic device with significant on‑chip RAM and a high I/O count. Its combination of 2,880 logic elements, 40,960 bits of embedded memory, and 191 I/Os in a 256‑FBGA package supports compact, integrated designs where board space and system-level consolidation matter.

For engineers designing SOPC‑style solutions, interface bridges, and memory‑aware control logic, this FLEX 10K family device offers the integration and system features needed to simplify BOMs, enable in‑circuit reconfiguration, and support testability and timing control throughout product development and production.

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