EPF10K50SFC256-2X

The EPF10K50SFC256-2X is a FLEX 10K family FPGA optimized for embedded logic and on-chip memory integration. It pairs a mid-range logic fabric with a substantial embedded RAM complement and a high I/O count for flexible system interfacing.

Designed for commercial applications, this surface-mount 256‑BGA device offers reconfigurable logic resources, 191 user I/O pins, and operation across a 2.375 V to 2.625 V supply range and 0 °C to 70 °C ambient temperature, making it suitable for a wide range of SOPC-style embedded designs.

Key Features

• Logic Fabric 2,880 logic elements organized across 360 LABs provide the programmable logic capacity needed for glue logic, state machines, and custom datapaths.
• Embedded Memory Approximately 40,960 bits of on-chip RAM for implementing buffers, FIFOs, and small data stores without external memory.
• I/O Capacity 191 user I/O pins support dense peripheral and interface connectivity in a single device footprint.
• Power and Supply Specified supply voltage range of 2.375 V to 2.625 V to match system power-rail requirements.
• Package & Mounting 256‑FBGA (17 × 17) package in a surface-mount form factor for compact board-level integration.
• System-Level Features Family-level capabilities include embedded array blocks for megafunctions and JTAG boundary-scan for in-system test and configuration.
• Commercial Grade & Temperature Commercial grade device rated for operation from 0 °C to 70 °C.

Typical Applications

• Embedded Systems / SOPC Integration Use the device to consolidate logic, small memory functions, and glue logic into a single programmable component for compact embedded designs.
• I/O-Intensive Interface Bridging The 191 available I/O pins make this FPGA suited for bridging multiple peripherals, sensors, or bus interfaces on a single board.
• On-board Memory and Buffering Approximately 40,960 bits of embedded RAM enable local buffering, small FIFOs, and temporary data storage without adding external memory components.
• Prototyping and Custom Logic Mid-range logic capacity and reprogrammability support rapid prototyping of custom hardware functions and algorithm acceleration.

Unique Advantages

• Balanced Logic and Memory: Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to implement both control logic and local data storage on-chip.
• High I/O Count in a Compact Package: 191 user I/Os in a 256‑FBGA (17×17) package reduce the need for external I/O expanders, simplifying board designs.
• Surface-Mount, Board-Level Efficiency: The 256‑BGA surface-mount package supports compact PCB layouts and high-density system integration.
• Design and Test Integration: Built-in family features such as JTAG boundary-scan and embedded array blocks facilitate in-system configuration, testing, and implementation of megafunctions.
• Commercial-Focused Specification: Specified operating range (0 °C to 70 °C) and supply voltage window (2.375 V–2.625 V) align with common commercial embedded system environments.

Why Choose EPF10K50SFC256-2X?

The EPF10K50SFC256-2X provides a practical balance of programmable logic, embedded memory, and I/O resources for commercial embedded applications that benefit from on-chip integration and reconfigurability. Its 256‑FBGA package and surface-mount design enable dense board integration while the family-level system features support configuration and testing workflows.

This device is well suited to engineers and OEMs implementing SOPC-style architectures, I/O-rich interface bridging, or mid-range custom logic blocks that require both logic capacity and embedded RAM without expanding the bill of materials.

Request a quote or submit a purchase inquiry for EPF10K50SFC256-2X to check availability and pricing for your next design.