EPF10K50SFC484-1X
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA |
|---|---|
| Quantity | 1,438 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50SFC484-1X – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA
The EPF10K50SFC484-1X is a FLEX-10KS family FPGA from Intel, delivered in a 484-ball BGA (484-FBGA, 23×23) surface-mount package. It combines a logic array and embedded memory resources to support system-level integration and programmable logic functions for commercial embedded designs.
This device targets designs that require a balance of logic capacity, embedded RAM and flexible I/O in a compact BGA package, with in-circuit reconfigurability and standard boundary-scan support for test and configuration workflows.
Key Features
- Logic Capacity — Contains 2,880 logic elements and 360 logic array blocks (LABs), providing substantial programmable logic resources for mid-range applications.
- On-chip Memory — Approximately 40,960 bits of embedded RAM to implement data buffering, FIFOs and memory-based megafunctions without reducing logic capacity.
- I/O and Interfaces — 220 user I/O pins with individual tri-state output-enable control, open-drain option and programmable output slew-rate to adapt to a variety of board-level signaling needs.
- System Integration — Embedded array architecture supports megafunctions and System-on-a-Programmable-Chip (SOPC) integration; in-circuit reconfigurability via external configuration device, intelligent controller or JTAG.
- Clocking and Timing — Built-in low-skew clock distribution trees, support for multiple global clock signals and global clear signals, and peripheral registers for fast setup and clock-to-output delay control.
- Dedicated Arithmetic and Logic Chains — Dedicated carry and cascade chains accelerate implementation of adders, counters and high-fan-in logic functions.
- Package & Mounting — 484-ball fine-pitch BGA (484-FBGA, 23×23) for space-efficient board integration; surface-mount construction.
- Power & Operating Conditions — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
- Standards & Test — Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1 for device test and configuration. RoHS compliant.
Typical Applications
- System Integration / SOPC — Embed memory and specialized logic to implement megafunctions and glue logic in compact system designs.
- Peripheral and Interface Logic — Implement custom protocol bridging, I/O expansion and peripheral controllers using the device’s flexible I/O and logic resources.
- Prototyping and Development — Evaluate mid-range programmable logic functions and verify timing-critical designs using in-circuit reconfiguration and JTAG support.
- Embedded Control — Use logic elements and on-chip RAM for real-time control, data buffering and signal conditioning in commercial embedded products.
Unique Advantages
- Balanced Logic and Memory Mix: 2,880 logic elements combined with approximately 40,960 bits of embedded RAM enable implementation of both control logic and local data storage on a single device.
- High I/O Count in a Compact Package: 220 user I/O pins in a 484-BBGA package provide dense connectivity without compromising board area.
- Flexible Configuration and Test: In-circuit reconfigurability plus IEEE 1149.1 JTAG boundary-scan simplify programming, debugging and production test flows.
- Deterministic Timing Features: Low-skew clock trees, multiple global clocks and peripheral registers help meet timing requirements for synchronous designs.
- Designed for Commercial Embedded Use: Commercial grade operating range (0 °C to 70 °C) and RoHS compliance align the device with standard electronics manufacturing and environmental requirements.
Why Choose EPF10K50SFC484-1X?
The EPF10K50SFC484-1X delivers a pragmatic combination of programmable logic density, embedded RAM and a high I/O count in a compact 484-BBGA surface-mount package. Its family-level features—such as embedded arrays for megafunctions, in-circuit reconfiguration paths and JTAG boundary-scan—make it well suited for commercial embedded systems that require on-device memory and flexible interfacing.
This device is appropriate for engineers designing mid-range programmable solutions who need predictable timing structures, dedicated arithmetic/cascade resources and standard test/configuration support. Its commercial grade ratings and RoHS compliance contribute to consistent manufacturing and environmental conformance.
Request a quote or submit your design requirements to receive pricing and availability information for the EPF10K50SFC484-1X.

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