EPF10K50SFC484-2X

The EPF10K50SFC484-2X is a FLEX 10K family field-programmable gate array designed for commercial embedded applications that require reconfigurable logic and on-chip memory. As a member of the FLEX 10K embedded programmable logic device family, it combines a logic array with embedded array blocks to implement megafunctions, efficient memory, and specialized logic functions.

This device delivers a mid-range logic capacity with integrated RAM and extensive I/O in a compact 484-BBGA package, making it suitable for designs that need flexible system-level integration, in-circuit reconfigurability, and boundary-scan testability.

Key Features

• Logic Capacity  360 LABs and 2,880 logic elements provide approximately 199,000 gates of logic to implement custom combinational and sequential functions.
• Embedded Memory  Total on-chip RAM of 40,960 bits (approximately 0.041 Mbits) for data buffering, FIFOs, and small on-chip storage.
• I/O and Package  220 user I/O pins in a 484-BBGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Power and Temperature  Specified operating supply range of 2.375 V to 2.625 V and a commercial operating temperature range of 0 °C to 70 °C.
• Family-Level System Features  FLEX 10K family capabilities include an embedded array for megafunctions, JTAG boundary-scan (IEEE Std. 1149.1) for test access, in-circuit reconfigurability via external configuration or JTAG, and clock distribution features such as ClockLock and ClockBoost.
• Regulatory and Mounting  RoHS compliant; surface-mount device in a fine-pitch BGA package for dense board layouts.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) integration  Use embedded arrays and logic to implement integrated megafunctions and small on-chip memory for consolidated system designs.
• PCI local-bus subsystems  FLEX 10K family devices are documented to support PCI Local Bus integration; the EPF10K50SFC484-2X is suitable for commercial designs that require PCI-related interfaces and glue logic.
• In-circuit reconfigurable prototypes and field updates  Support for in-circuit reconfigurability and JTAG boundary-scan enables flexible development, board bring-up, and firmware updates without hardware swaps.
• Commercial embedded control and glue logic  Mid-range logic density and on-chip RAM make this device appropriate for control, interfacing, and protocol adaptation in commercial embedded systems.

Unique Advantages

• Balanced logic and memory mix  With 2,880 logic elements and 40,960 bits of RAM, the device supports designs that need a combination of custom logic and embedded storage without external memory for small datasets.
• High I/O count in a compact package  220 user I/Os in a 484-BBGA package help reduce PCB area while providing broad external connectivity options.
• In-circuit reconfigurability and testability  JTAG boundary-scan and external configuration options speed development cycles and enable field reprogramming and diagnostics.
• Commercial temperature and low-voltage operation  Designed for commercial environments with a defined 0 °C to 70 °C range and a low-voltage supply window (2.375–2.625 V) for targeted power profiles.
• RoHS compliant  Environmentally compliant construction supports modern manufacturing and regulatory requirements.
• Scalable within the FLEX 10K family  Family-level features and package compatibility enable designers to scale designs across FLEX 10K devices where package pin-compatibility is required.

Why Choose EPF10K50SFC484-2X?

EPF10K50SFC484-2X provides a pragmatic blend of reconfigurable logic, embedded memory, and I/O density in a commercial-grade, surface-mount 484-BBGA package. It is suited for engineering teams building mid-range programmable solutions that benefit from in-circuit reconfiguration, JTAG testability, and family-level scalability.

Manufactured by Intel and built on the FLEX 10K embedded programmable logic device architecture, this part is intended for designers who need predictable logic resources, integrated RAM, and a compact footprint—supporting product development cycles that require flexibility and board-level integration efficiency.

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