EPF10K50SFC484-1
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA |
|---|---|
| Quantity | 1,029 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 220 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EPF10K50SFC484-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA
The EPF10K50SFC484-1 is a FLEX 10K family field programmable gate array (FPGA) IC designed for embedded, reconfigurable logic applications. It combines a dense logic fabric with on-chip RAM and flexible I/O to support system-on-a-programmable-chip (SOPC) integration and custom peripheral implementations.
With 2,880 logic elements, approximately 40,960 bits of embedded memory, and 220 user I/O pins in a 484-BBGA surface-mount package, this commercial-grade device targets embedded systems and hardware-accelerated functions that require moderate logic density, significant on-chip RAM, and wide I/O capability.
Key Features
- Logic Capacity 2,880 logic elements and a reported equivalent of approximately 199,000 gates provide the programmable resources for mid-range custom logic and glue-logic implementations.
- Embedded Memory Approximately 40,960 bits of on-chip RAM support storage for buffers, FIFOs, and small lookup tables without external memory.
- Rich I/O 220 user I/O pins enable broad interfacing to peripherals, sensors, and bus fabrics within systems.
- Package & Mounting 484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for high-density board integration and compact system layouts.
- Power Supply Specified core/operating voltage range of 2.375 V to 2.625 V to match target board power architectures.
- Operating Range & Grade Commercial operating temperature range of 0 °C to 70 °C; RoHS compliant.
- Configuration & Test Family-level support for in-circuit reconfigurability and JTAG boundary-scan (IEEE Std. 1149.1) enable external configuration and board-level test without consuming device logic.
- Family-Level Architecture FLEX 10K series features such as dedicated carry and cascade chains, low-skew clock distribution, and megafunction-capable embedded arrays (as documented for the FLEX 10K family) support arithmetic functions and efficient implementation of specialized logic and memory functions.
Typical Applications
- Embedded System Integration Implement SOPC elements, glue logic, and custom peripheral controllers where integrated logic and on-chip RAM simplify board-level design.
- Memory-Intensive Functions Use the device’s embedded RAM for FIFOs, buffers, and small data storage tasks inside data-paths and communication endpoints.
- I/O Aggregation and Protocol Bridging Leverage 220 user I/Os to consolidate multiple peripheral interfaces or to act as protocol translators and bus bridges.
- Prototype and Custom Logic Deploy as a reconfigurable platform for hardware prototyping, iterative logic refinement, and feature upgrades via in-circuit reconfiguration and JTAG access.
Unique Advantages
- Balanced Logic and Memory Mix Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to implement control logic and local data storage on a single device, reducing external component count.
- High I/O Density 220 I/O pins provide designers flexibility to connect multiple peripherals or parallel data lines without additional I/O expanders.
- Compact, Board-Friendly Package 484-BBGA surface-mount footprint (484-FBGA, 23×23) enables space-efficient PCB layouts in compact systems.
- Reconfigurability & Testability Support for in-circuit reconfiguration and JTAG boundary-scan simplifies field updates and board-level testing while preserving on-chip logic resources.
- Commercial Temperature Suitability Rated for 0 °C to 70 °C operation, appropriate for a wide range of commercial embedded and industrial-adjacent applications.
Why Choose EPF10K50SFC484-1?
The EPF10K50SFC484-1 positions itself as a versatile mid-density FPGA option within the FLEX 10K family, offering a practical combination of logic elements, embedded memory, and extensive I/O in a compact BGA package. It is well suited to designers who need on-chip RAM alongside reconfigurable logic for SOPC integration, protocol bridging, or consolidating peripheral functions.
Specified for a 2.375 V to 2.625 V supply and commercial temperature operation, the device delivers a predictable, verifiable platform for development and production environments where RoHS compliance and board-level reconfigurability are required.
Request a quote or submit an inquiry to get pricing, availability, and sample information for EPF10K50SFC484-1.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018