EPF10K50SFC484-1

IC FPGA 220 I/O 484FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

Quantity 1,029 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O220Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SFC484-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

The EPF10K50SFC484-1 is a FLEX 10K family field programmable gate array (FPGA) IC designed for embedded, reconfigurable logic applications. It combines a dense logic fabric with on-chip RAM and flexible I/O to support system-on-a-programmable-chip (SOPC) integration and custom peripheral implementations.

With 2,880 logic elements, approximately 40,960 bits of embedded memory, and 220 user I/O pins in a 484-BBGA surface-mount package, this commercial-grade device targets embedded systems and hardware-accelerated functions that require moderate logic density, significant on-chip RAM, and wide I/O capability.

Key Features

  • Logic Capacity  2,880 logic elements and a reported equivalent of approximately 199,000 gates provide the programmable resources for mid-range custom logic and glue-logic implementations.
  • Embedded Memory  Approximately 40,960 bits of on-chip RAM support storage for buffers, FIFOs, and small lookup tables without external memory.
  • Rich I/O  220 user I/O pins enable broad interfacing to peripherals, sensors, and bus fabrics within systems.
  • Package & Mounting  484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for high-density board integration and compact system layouts.
  • Power Supply  Specified core/operating voltage range of 2.375 V to 2.625 V to match target board power architectures.
  • Operating Range & Grade  Commercial operating temperature range of 0 °C to 70 °C; RoHS compliant.
  • Configuration & Test  Family-level support for in-circuit reconfigurability and JTAG boundary-scan (IEEE Std. 1149.1) enable external configuration and board-level test without consuming device logic.
  • Family-Level Architecture  FLEX 10K series features such as dedicated carry and cascade chains, low-skew clock distribution, and megafunction-capable embedded arrays (as documented for the FLEX 10K family) support arithmetic functions and efficient implementation of specialized logic and memory functions.

Typical Applications

  • Embedded System Integration  Implement SOPC elements, glue logic, and custom peripheral controllers where integrated logic and on-chip RAM simplify board-level design.
  • Memory-Intensive Functions  Use the device’s embedded RAM for FIFOs, buffers, and small data storage tasks inside data-paths and communication endpoints.
  • I/O Aggregation and Protocol Bridging  Leverage 220 user I/Os to consolidate multiple peripheral interfaces or to act as protocol translators and bus bridges.
  • Prototype and Custom Logic  Deploy as a reconfigurable platform for hardware prototyping, iterative logic refinement, and feature upgrades via in-circuit reconfiguration and JTAG access.

Unique Advantages

  • Balanced Logic and Memory Mix  Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to implement control logic and local data storage on a single device, reducing external component count.
  • High I/O Density  220 I/O pins provide designers flexibility to connect multiple peripherals or parallel data lines without additional I/O expanders.
  • Compact, Board-Friendly Package  484-BBGA surface-mount footprint (484-FBGA, 23×23) enables space-efficient PCB layouts in compact systems.
  • Reconfigurability & Testability  Support for in-circuit reconfiguration and JTAG boundary-scan simplifies field updates and board-level testing while preserving on-chip logic resources.
  • Commercial Temperature Suitability  Rated for 0 °C to 70 °C operation, appropriate for a wide range of commercial embedded and industrial-adjacent applications.

Why Choose EPF10K50SFC484-1?

The EPF10K50SFC484-1 positions itself as a versatile mid-density FPGA option within the FLEX 10K family, offering a practical combination of logic elements, embedded memory, and extensive I/O in a compact BGA package. It is well suited to designers who need on-chip RAM alongside reconfigurable logic for SOPC integration, protocol bridging, or consolidating peripheral functions.

Specified for a 2.375 V to 2.625 V supply and commercial temperature operation, the device delivers a predictable, verifiable platform for development and production environments where RoHS compliance and board-level reconfigurability are required.

Request a quote or submit an inquiry to get pricing, availability, and sample information for EPF10K50SFC484-1.

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