EPF10K50SFC484-2

The EPF10K50SFC484-2 is a FLEX 10K family field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial embedded logic applications. It combines a dedicated logic array with embedded memory and flexible I/O to support system-on-a-programmable-chip (SOPC) style integration, in-circuit reconfigurability, and a broad range of mid-density logic functions.

Key Features

• Logic Capacity — 2,880 logic elements that provide granular programmable logic resources for custom combinational and sequential functions.
• Embedded Memory — Approximately 40,960 bits of on-chip RAM to implement buffers, small tables, and megafunctions without using external memory.
• I/O Count and Flexibility — 220 user I/O pins for high-pin-count designs and versatile interfacing options.
• Gate Count — 199,000 gates reported for system-level resource planning and partitioning.
• Package and Mounting — 484-ball fine-pitch BGA (484-BBGA / 484-FBGA 23×23) in a surface-mount form factor for space-efficient board designs.
• Supply Voltage — Operates from 2.375 V to 2.625 V to match system power rails within that range.
• Operating Temperature — Commercial-grade operation from 0°C to 70°C for typical commercial environments.
• Family-Level System Features — FLEX 10K family architecture includes embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, low-skew clock distribution, in-circuit reconfigurability options, and JTAG boundary-scan support as part of the device family feature set.
• Regulatory — RoHS compliant.

Typical Applications

• SOPC Integration — Implement custom peripheral logic and system glue to consolidate discrete components into a programmable system-on-chip architecture.
• Embedded Memory Functions — Use the on-chip RAM for FIFOs, small buffers, and lookup tables within data-paths and control logic.
• High I/O Interface Designs — Host multiple external interfaces and glue logic with 220 available I/O pins to support complex peripheral connectivity.
• In-Circuit Reconfigurable Prototyping — Support iterative development and field updates using the family’s in-circuit reconfigurability and JTAG boundary-scan features.

Unique Advantages

• Balanced Logic and Memory — A mix of 2,880 logic elements and ~40,960 bits of embedded RAM enables compact implementations of control and storage within a single device.
• High I/O Density — 220 I/Os let you consolidate multiple interfaces and reduce board-level interconnect complexity.
• Compact BGA Package — The 484-ball FBGA (23×23) package provides a high-pin-count solution while conserving PCB area.
• Family-Level Integration Features — FLEX 10K family capabilities such as FastTrack interconnect, dedicated arithmetic chains, and low-skew clocks help simplify timing closure and high-speed logic implementation.
• Commercial-Focused Thermal Range — Designed for 0°C to 70°C operation to suit mainstream commercial applications and environments.
• RoHS Compliant — Meets common environmental and manufacturing compliance needs for many commercial products.

Why Choose EPF10K50SFC484-2?

The EPF10K50SFC484-2 positions itself as a mid-density FLEX 10K FPGA option for designers needing a balance of programmable logic, embedded RAM, and high I/O in a compact BGA package. Its combination of 2,880 logic elements, approximately 40,960 bits of on-chip RAM, and 220 I/Os makes it suitable for consolidating logic and memory functions, implementing SOPC architectures, and supporting iterative development workflows via in-circuit reconfiguration and JTAG.

This device is well suited to commercial embedded systems where board space, I/O count, and flexible integration are priorities. The FLEX 10K family features available to this device offer architectural building blocks that help reduce system component count and support scalable designs within the family.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the EPF10K50SFC484-2. Our team can assist with lead times and volume pricing to support your project schedule and BOM planning.