EPF10K50SFC484-2XB

IC FPGA 220 I/O 484FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 220 40960 2880 484-BBGA

Quantity 825 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O220Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SFC484-2XB – FLEX-10KS Field Programmable Gate Array (FPGA), 2,880 logic elements, 40,960-bit RAM, 220 I/O, 484-BBGA

The EPF10K50SFC484-2XB is an Intel FLEX 10KE-series embedded programmable logic device designed for system-level integration and custom logic implementations. It combines a dedicated logic array, embedded array blocks (EABs) and flexible I/O to support memory-rich and interface-intensive designs in a compact 484-ball BGA package.

Targeted at commercial applications, this device delivers a balance of logic capacity, on-chip RAM and I/O connectivity for SOPC integration, bus-interface logic and custom peripheral control at standard commercial temperature ranges.

Key Features

  • Logic Capacity — 2,880 logic elements providing programmable logic for combinational and sequential functions; device architecture supports up to approximately 199,000 maximum system gates.
  • Embedded Memory — Approximately 40,960 bits of on-chip RAM implemented across EABs; EABs support dual-port operation with up to 16-bit width per block for efficient on-chip data storage and buffering.
  • I/O and Interface — 220 user I/O pins support MultiVolt I/O signaling options as described in the FLEX 10KE family, enabling mixed-voltage interfacing in heterogeneous systems.
  • Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact board-level integration.
  • Supply and Temperature — Device internal supply range specified at 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
  • On-chip System Features — Built-in IEEE 1149.1 JTAG boundary-scan test circuitry for in-circuit test and configuration without consuming additional device logic; options such as ClockLock™ and ClockBoost™ and low-skew clock distribution are available in the FLEX 10KE family.
  • High-density Architecture — Family-level features include dedicated carry and cascade chains and FastTrack® continuous routing to support arithmetic, high-fan-in logic and predictable interconnect delays.
  • Test and Configuration — In-circuit reconfigurability via external configuration devices, intelligent controller or JTAG port; device-level functional testing is provided.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate custom logic and embedded memory blocks to implement SOPC functions, offloading control tasks from a host processor.
  • Interface and Bus Logic — Implement bus bridge logic, protocol adaptation and glue logic for systems that require high I/O counts and mixed-voltage interfacing.
  • On-chip Memory Buffers — Use the dual-port EABs for packet buffering, FIFOs or small embedded memories where low-latency on-chip storage is required.
  • Test and Development Platforms — JTAG boundary-scan and in-circuit reconfiguration support rapid prototyping, debug and production test scenarios.

Unique Advantages

  • Balanced Logic and Memory — 2,880 logic elements combined with approximately 40,960 bits of embedded RAM enable designs that require both configurable logic and local storage without external memory.
  • Flexible I/O Count — 220 user I/O pins provide abundant connectivity for multi-signal interfaces and peripheral control while supporting multi-voltage I/O options defined by the FLEX 10KE family.
  • Compact BGA Packaging — 484-ball BGA (23×23) package allows high pin density in a small board footprint for space-constrained applications.
  • Design and Test Support — Built-in IEEE 1149.1 JTAG boundary-scan and family-level tooling support simplify board bring-up, in-system programming and production test integration.
  • Architecture for Performance — Dedicated carry and cascade chains and low-skew clock distribution features reduce implementation complexity for arithmetic and high-fan-in functions.

Why Choose EPF10K50SFC484-2XB?

The EPF10K50SFC484-2XB is positioned for commercial designs that require a reliable mix of programmable logic, on-chip RAM and substantial I/O in a compact BGA package. Its FLEX 10KE-series architecture provides architectural primitives—such as dual-port EABs, dedicated carry/cascade chains and JTAG—useful for integrating custom logic, buffering and interface functions on a single device.

This device is well suited to engineers and procurement teams building prototypes or production systems that need a commercially graded, mid-density FPGA with clear supply and temperature specifications and proven family-level capabilities.

If you would like pricing, availability or a quotation for EPF10K50SFC484-2XB, request a quote or submit a quotation request through your preferred procurement channel.

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