EPF10K50SQC208-1

The EPF10K50SQC208-1 is a FLEX 10K family FPGA from Intel designed for embedded programmable logic applications. It combines a dedicated logic array with embedded memory blocks and flexible I/O to support system-level integration, custom peripherals, and mid-density logic implementations. Typical use cases include embedded systems, interface and glue logic, and applications requiring a mix of on-chip memory and programmable logic within a commercial temperature range.

Key Features

• Core Logic  2,880 logic elements provide the programmable fabric for implementing custom logic functions and control circuitry.
• Embedded Memory  Approximately 40,960 bits of on-chip RAM available for FIFOs, buffers, and state storage.
• Logic Array Blocks  360 logic array blocks deliver structured resources for efficient placement of logic functions.
• I/O Capacity  147 user I/O pins support multiple external interfaces and board-level connectivity options.
• Gate Capacity  Device reported with 199,000 gates for planning integration of combined logic and memory resources.
• Power and Supply  Operates from a supply range of 2.375 V to 2.625 V to match system power rails.
• Package and Mounting  208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for standard PCB assembly.
• Temperature Grade  Commercial grade operation from 0 °C to 70 °C for general-purpose embedded applications.
• Standards and Testability  Family-level features include JTAG boundary-scan test circuitry for board-level testability and in-circuit configuration options.
• Compliance  RoHS-compliant construction for lead-free manufacturing processes.

Typical Applications

• Embedded Systems  Implement control logic, custom peripherals, and system glue logic where integrated memory and programmable logic enable compact designs.
• Interface and Protocol Bridges  Use the device’s abundant I/O and programmable fabric to build protocol converters, bus interfaces, and I/O expansion modules.
• Data Buffering and FIFO Functions  Leverage approximately 40,960 bits of on-chip RAM for buffering, temporary storage, and small packet handling.
• Prototyping and Evaluation  Suitable for development platforms and prototypes where reprogrammability and moderate logic density are required.

Unique Advantages

• Balanced Logic and Memory:  With 2,880 logic elements and approximately 40,960 bits of embedded RAM, the device supports mixed logic-plus-memory functions without external RAM for many mid-density designs.
• Substantial I/O Count:  147 user I/Os enable multiple peripheral connections and flexible board-level interfacing.
• Surface-Mount BFQFP Package:  The 208-BFQFP (28×28) package offers a compact, board-friendly form factor for commercial embedded assemblies.
• Design-for-Test and Reconfiguration:  Family-level JTAG support and in-circuit reconfigurability options simplify testing and iterative development workflows.
• RoHS Compliant:  Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose EPF10K50SQC208-1?

The EPF10K50SQC208-1 positions itself as a commercially graded, mid-density FPGA option within the FLEX 10K family, delivering a practical mix of logic elements, embedded RAM, and a generous I/O complement in a 208-pin BFQFP package. It is well suited to engineering teams building embedded controllers, interface logic, or prototypes that require on-chip memory and reprogrammable logic without moving to higher-density platforms.

Choose this device when your design requires a combination of programmable logic, embedded RAM, and flexible I/O in a surface-mount BFQFP package with RoHS compliance and standard commercial operating temperature support.

Request a quote or submit a product inquiry to get pricing and availability for EPF10K50SQC208-1.