EPF10K50SQC208-1X

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

Quantity 1,175 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SQC208-1X – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

The EPF10K50SQC208-1X is a FLEX-10KS family field programmable gate array manufactured by Intel, delivering a combination of on-chip memory and reprogrammable logic in a 208‑pin BFQFP package. It integrates 2,880 logic elements across 360 LABs and provides 40,960 bits of embedded RAM alongside 147 user I/O pins, making it suitable for commercial embedded designs that require moderate logic density and significant on-chip memory.

Designed for system-level integration, the device supports in-circuit reconfigurability and family-level features such as embedded arrays for megafunction implementation and dedicated interconnect and arithmetic chains, enabling efficient implementation of memory-intensive and specialized logic functions in surface-mount designs.

Key Features

  • Core logic — 2,880 logic elements implemented across 360 LABs, providing a fixed, verifiable logic capacity for medium-complexity FPGA designs.
  • Embedded memory — 40,960 total RAM bits of on-chip memory for implementing buffers, FIFOs, and other memory-intensive megafunctions without consuming logic element capacity.
  • I/O density — 147 user I/O pins to support a broad range of external interfaces and signal routing in I/O‑heavy applications.
  • System-level programmability — In-circuit reconfigurability via external configuration device or JTAG port and built-in JTAG boundary-scan test circuitry for board-level test and reconfiguration.
  • Dedicated arithmetic and routing — Family-level features include dedicated carry chains and cascade chains plus the FastTrack interconnect structure for predictable routing and efficient implementation of adders, counters, and high-fan-in logic.
  • Package & mounting — Supplied in a 208‑BFQFP (208‑PQFP 28×28) surface-mount package for standard PCB assembly.
  • Power and temperature — Voltage supply range 2.375 V to 2.625 V and operating temperature range 0 °C to 70 °C, targeted for commercial-grade applications.
  • Compliance — RoHS compliant.

Typical Applications

  • System-on-a-programmable-chip (SOPC) integration — Use the device’s embedded arrays and reprogrammable logic to integrate memory and specialized logic functions in compact SOPC designs.
  • Memory‑intensive logic — The 40,960 bits of on-chip RAM are well suited for data buffering, FIFOs, and packet-handling functions in communications and embedded systems.
  • I/O control and interface bridging — With 147 I/O pins, the device can consolidate multiple peripheral interfaces and handle complex signal routing for custom control panels or protocol converters.
  • Prototyping and product development — Reconfigurability and built-in JTAG support enable iterative hardware development, testing, and boundary-scan verification during product bring-up.

Unique Advantages

  • Significant on-chip RAM: 40,960 bits of embedded memory reduce external memory requirements and simplify board-level BOM for memory-centric functions.
  • Balanced logic and I/O: 2,880 logic elements paired with 147 I/Os provide a practical balance for designs that need both logic capacity and moderate peripheral connectivity.
  • Reconfigurable design flow: In-circuit reconfigurability and JTAG boundary-scan support speed up development cycles and enable field updates without board replacement.
  • Efficient arithmetic and routing: Dedicated carry and cascade chains plus FastTrack interconnect help implement arithmetic-heavy and high-fan-in logic efficiently.
  • Commercial-grade readiness: Surface-mount 208‑BFQFP packaging, defined supply and temperature ranges, and RoHS compliance align the device to commercial embedded product requirements.

Why Choose EPF10K50SQC208-1X?

The EPF10K50SQC208-1X positions itself as a practical, reprogrammable solution where on-chip memory and moderate logic density are priorities. Its combination of 2,880 logic elements, 40,960 bits of embedded RAM, and 147 I/Os supports embedded applications that require memory-intensive megafunctions, interface consolidation, and iterative development through in-circuit reconfiguration and JTAG testing.

This device is suited for commercial embedded designs and development projects that benefit from integrated memory, predictable routing resources, and standard surface-mount packaging. Its family-level features offer engineering teams a clear pathway to implement specialized logic and system-level functions with reduced external components and streamlined board-level testing.

Request a quote or submit an inquiry to receive pricing and availability information for the EPF10K50SQC208-1X and to discuss how this FLEX-10KS device can fit your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up