EPF10K50SQC208-3N

The EPF10K50SQC208-3N is a FLEX-10KS family Field Programmable Gate Array (FPGA) in a 208-pin BFQFP package designed for system-level programmable logic integration. It combines on-chip logic, embedded memory, and flexible I/O to support SOPC-style designs, in-circuit reconfigurability, and a variety of interface and control functions.

Targeted at commercial applications, this device provides a balance of logic capacity, embedded RAM, and I/O density for developers building custom digital subsystems, interface bridging, and embedded control functions.

Key Features

• Core Logic  Contains 2,880 logic elements (LEs) and 360 logic array blocks (LABs) to implement custom logic and control functions.
• On-chip Memory  Approximately 40,960 bits of embedded RAM for data buffering, small lookup tables, and local storage without sacrificing logic capacity.
• Gate Capacity  Nominally 199,000 gates providing a defined logic resource metric for system partitioning and capacity planning.
• I/O and Package  147 user I/O pins in a 208-BFQFP surface-mount package (supplier package: 208-PQFP, 28×28) to support multiple external interfaces and board-level integration.
• Power Supply  Operates with a supply voltage range of 2.375 V to 2.625 V for core/regulator planning.
• Operating Range  Commercial operating temperature range of 0 °C to 70 °C suitable for standard commercial applications.
• Family Capabilities  As part of the FLEX 10K family, supports series features such as in-circuit reconfigurability, JTAG boundary-scan test circuitry, dedicated carry and cascade chains, and family-level interconnect optimizations.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Embedded Control  Implement custom finite-state machines, protocol handlers, and control logic where moderate logic density and on-chip RAM improve system integration.
• Interface Bridging  Bridge between parallel and serial buses or adapt legacy peripherals using the device’s flexible I/O and programmable logic.
• Prototyping and Development  Use the device for proof-of-concept and early-stage system prototypes that require reprogrammable logic and embedded memory.
• Peripheral and I/O Glue Logic  Consolidate multiple discrete functions into a single programmable device to reduce BOM and simplify PCB routing.

Unique Advantages

• Balanced Logic and Memory:  Provides 2,880 LEs and approximately 40,960 bits of embedded RAM to implement both control logic and local data storage on-chip.
• Significant I/O in a Compact Package:  147 I/O pins in a 208-BFQFP package enable dense connectivity while keeping package size and board routing manageable.
• Family-Level Design Support:  Benefits from FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfigurability for easier testing and field updates.
• Commercial Temperature Suitability:  Rated for 0 °C to 70 °C operation, aligning with a wide range of commercial electronics applications.
• Regulatory and Assembly Ready:  Surface-mount 208-pin package and RoHS compliance facilitate modern SMT assembly and environmental requirements.

Why Choose EPF10K50SQC208-3N?

The EPF10K50SQC208-3N delivers a practical combination of logic elements, embedded memory, and I/O density in a commercial-grade, surface-mount package suitable for system integrators and embedded designers. Its placement within the FLEX 10K family brings family-level architectural advantages—such as in-circuit reconfiguration, JTAG support, and dedicated arithmetic/cascade resources—that streamline implementation of medium-complexity digital subsystems.

This device is appropriate for development teams and procurement groups seeking a programmable, RoHS-compliant component that balances capacity and board-level integration while leveraging established FLEX 10K design tool support and methodologies.

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