EPF10K50SQC240-1N

The EPF10K50SQC240-1N is a FLEX-10KS family FPGA IC from Intel designed for programmable system integration. It combines a logic array and embedded memory resources to implement custom logic, megafunctions and system-level glue logic.

Targeted at commercial designs, this device delivers substantial on-chip resources and flexible I/O in a 240-pin BFQFP surface-mount package, making it suitable for SOPC-style integration, custom peripheral control, and applications that require moderate logic density with embedded memory.

Key Features

• Core Capacity — 2,880 logic elements and 360 logic array blocks (LABs) providing programmable logic density for a wide range of glue-logic and custom processing tasks. The part is specified with 199,000 gates.
• Embedded Memory — 40,960 total RAM bits of on-chip memory for FIFOs, buffers, and small data stores.
• I/O Density — Up to 189 user I/O pins to interface with peripherals, buses, and external devices.
• Package & Mounting — 240-BFQFP (240-PQFP, 32×32) surface-mount package suitable for PCB assembly processes that accept fine-pitch QFP footprints.
• Power — Specified operating supply range of 2.375 V to 2.625 V for the device core power domain.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
• Family-Level System Features — FLEX 10K family capabilities include embedded arrays for megafunctions, MultiVolt I/O interface support, JTAG boundary-scan, in-circuit reconfigurability, dedicated carry and cascade chains, and low-skew clock distribution (family features documented in the FLEX 10K datasheet).
• Configuration & Test — Supports in-circuit reconfigurability and includes IEEE 1149.1 JTAG boundary-scan circuitry (family-level feature).

Typical Applications

• System-on-a-Programmable-Chip (SOPC) integration — Use the device’s programmable logic and embedded memory to implement custom subsystems and glue logic within larger electronic systems.
• Interface bridging and protocol translation — 189 I/O pins enable bridging between multiple peripheral interfaces or translating signals between subsystems.
• Embedded buffering and small-data storage — On-chip RAM (40,960 bits) is well suited for FIFOs, small buffers and temporary data storage in data-path designs.
• Prototyping and custom control logic — The combination of LABs and logic elements supports rapid iteration of control logic, state machines, and peripheral controllers.

Unique Advantages

• High integration in a compact package: 2,880 logic elements and 40,960 bits of embedded RAM in a 240-pin BFQFP reduce external component count and PCB area.
• Flexible I/O connectivity: Up to 189 user I/O pins provide breadth for complex board-level interfacing without immediate need for external multiplexers or GPIO expanders.
• Reconfigurable system capability: Family-level support for in-circuit reconfigurability and JTAG boundary-scan streamlines development, test and field updates.
• Design predictability: Dedicated carry and cascade chains (family features) simplify implementation of arithmetic and high-fan-in logic, improving design efficiency and performance predictability.
• Commercial temperature grading and RoHS compliance: Specified 0 °C to 70 °C operating range and RoHS status make the device appropriate for mainstream commercial electronics.

Why Choose EPF10K50SQC240-1N?

The EPF10K50SQC240-1N provides a balanced combination of logic density, embedded memory and I/O capacity in a proven FLEX 10K family architecture. It is well suited for teams that need an FPGA-based solution for system integration, interface logic, and embedded buffering in commercial-temperature applications.

With on-chip RAM, plentiful I/O and family-level features such as JTAG boundary-scan and in-circuit reconfigurability, this device supports iterative development and deployment for mid-density programmable logic designs while maintaining compliance with RoHS requirements.

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