EPF10K50SQC240-2

The EPF10K50SQC240-2 is a FLEX 10K family field programmable gate array (FPGA) offered in a 240-BFQFP package. It combines a dedicated logic array and embedded memory blocks to enable System-on-a-Programmable-Chip (SOPC) integration for mid-density embedded designs.

Designed for commercial applications, this device provides a balance of logic capacity, on-chip RAM, and flexible I/O to support custom peripherals, protocol glue logic, and system integration tasks where board-level consolidation and reconfigurability are required.

Key Features

• Logic Capacity — 2,880 logic elements and 360 logic array blocks (LABs) to implement complex combinational and sequential logic.
• On‑Chip Memory — 40,960 bits of embedded RAM for buffering, state storage, and megafunction implementation.
• Gate Count — 199,000 gates of logic density to support medium-complexity system logic and integration tasks.
• Flexible I/O — 189 user I/O pins to interface with external devices, sensors, and parallel/serial peripherals.
• Power Supply — Operates from a 2.375 V to 2.625 V supply as specified for this device.
• Package & Mounting — Surface-mount 240-BFQFP (supplier package: 240-PQFP, 32×32) for PCB assembly in space-constrained designs.
• Commercial Temperature Range — Specified for 0 °C to 70 °C operation to match commercial-grade system requirements.
• Built‑in Test & Configuration — Family documentation notes built-in IEEE 1149.1 JTAG boundary-scan circuitry and support for in-circuit reconfigurability.
• Compliance — RoHS compliant for modern electronics manufacturing requirements.

Typical Applications

• Embedded System Integration — Combine custom logic, peripheral interfaces, and on-chip memory to consolidate functions into a single programmable device.
• Interface & Protocol Bridging — Use the device’s 189 I/Os and programmable logic to implement protocol converters, glue logic, and custom bus interfaces.
• Custom Peripherals — Implement specialized logic blocks and buffering with embedded RAM for sensor aggregation, data formatting, and local preprocessing.
• Prototype & Development Platforms — Reconfigurable logic and JTAG support make the device suitable for hardware prototyping and iterative design validation.

Unique Advantages

• Balanced Mid-Density Integration: Provides 2,880 logic elements and approximately 40,960 bits of embedded memory to integrate multiple system functions without excess board-level components.
• Generous I/O Count: 189 user I/Os enable flexible external interfacing for mixed-signal front ends, parallel buses, or multiple serial links.
• Commercial-Grade Availability: Specified for 0 °C to 70 °C operation and delivered in a standard surface-mount BFQFP package for ease of assembly and deployment.
• Onboard Testability & Reconfiguration: Built-in IEEE 1149.1 JTAG boundary-scan and in-circuit reconfigurability support debug, production testing, and field updates.
• Regulatory-Friendly: RoHS compliance supports lead‑free manufacturing flows and modern environmental requirements.
• Proven Family Ecosystem: Part of the FLEX 10K family with documented support for megafunctions and system-level integration approaches noted in the family datasheet.

Why Choose EPF10K50SQC240-2?

The EPF10K50SQC240-2 offers a practical combination of logic, embedded RAM, and I/O capability in a compact 240-BFQFP package for designers who need reconfigurable mid-density integration. Its commercial-grade temperature rating and surface-mount packaging make it suitable for a wide range of embedded and consumer applications where consolidation and flexibility are priorities.

Engineers building prototypes, custom peripheral controllers, or SOPC-style subsystems will find the device’s on-chip memory, plentiful I/O, and family-level support useful for reducing board complexity and accelerating system integration.

Request a quote or submit a pricing and availability inquiry to evaluate the EPF10K50SQC240-2 for your next design.