EPF10K50SQC240-3N

IC FPGA 189 I/O 240QFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 189 40960 2880 240-BFQFP

Quantity 1,202 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O189Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K50SQC240-3N – FLEX-10KS Field Programmable Gate Array, 240-BFQFP

The EPF10K50SQC240-3N is a FLEX 10K family field-programmable gate array offering medium-density programmable logic with embedded memory and a broad I/O complement. Built for System-on-a-Programmable-Chip (SOPC) integration, the device combines logic array resources and embedded RAM to implement custom logic, glue functions, and on-chip megafunctions.

This surface-mount, commercial-grade FPGA combines 2,880 logic elements across 360 logic array blocks with approximately 40,960 bits of embedded RAM and 189 user I/O pins, delivering a balanced platform for moderate-complexity designs that require in-field reconfigurability and flexible I/O.

Key Features

  • Core Capacity  2,880 logic elements across 360 logic array blocks provide the programmable logic resources needed for medium-complexity digital designs; the device is specified with 199,000 gates.
  • Embedded Memory  Approximately 40,960 bits of on-chip RAM support embedded functions and megafunctions without sacrificing logic capacity.
  • I/O Resources  189 user I/O pins suitable for interfacing to peripherals and external devices; series-level I/O capabilities include individual tri-state control and programmable output options referenced in the FLEX 10K family documentation.
  • Reconfigurability & Test  Supports in-circuit reconfigurability and includes JTAG boundary-scan (IEEE Std. 1149.1) for device test and programming as described in the FLEX 10K family materials.
  • Interconnect & Arithmetic Support  Family features such as the FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution are available for implementing high-speed arithmetic and predictable routing.
  • Power & Grade  Specified operating supply range: 2.375 V to 2.625 V. Commercial-grade device with an operating temperature range of 0 °C to 70 °C.
  • Package & Mounting  240-pin BFQFP (supplier device package: 240-PQFP, 32×32) in a surface-mount format for standard PCB assembly processes.
  • Family Design Support  Part of the FLEX 10K family; the datasheet references development-system support and family-level megafunctions for design entry, place-and-route, and simulation.

Typical Applications

  • SOPC Integration  Implement system-level functions and glue logic where embedded memory and programmable logic are used to integrate peripheral functions on a single programmable device.
  • Interface Bridging  Use the device’s moderate I/O count and programmable logic to implement protocol translation, bus interfacing, and custom peripheral interfaces.
  • Prototyping & Development  Suitable for prototyping medium-complexity designs that require iterative firmware and hardware changes, leveraging in-circuit reconfigurability and JTAG support.

Unique Advantages

  • Balanced Logic and Memory  Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM to implement both control logic and local storage without external memory for many designs.
  • Flexible I/O  A 189-pin I/O complement enables multiple peripheral connections and board-level integration while supporting family-level I/O configurability options.
  • Reconfigurable System Integration  In-circuit reconfigurability and JTAG boundary-scan simplify updates, testing, and field-level reprogramming during development and deployment.
  • Predictable Performance Building Blocks  FastTrack routing, dedicated carry/cascade chains, and low-skew clock distribution (as described for the FLEX 10K family) help implement arithmetic, counting, and high-fan-in logic efficiently.
  • Commercial-Grade Reliability  Designed for commercial-temperature systems (0 °C to 70 °C) with surface-mount packaging for standard production assembly.

Why Choose EPF10K50SQC240-3N?

The EPF10K50SQC240-3N delivers a commercially graded, medium-density FPGA platform well suited to designers who need a balance of logic, embedded RAM, and I/O in a compact 240-pin surface-mount package. Its FLEX 10K family features—such as in-circuit reconfigurability, JTAG boundary-scan, dedicated arithmetic chains, and predictable interconnect—help accelerate development of SOPC-style integrations and interface logic without adding external glue components.

This device is appropriate for engineering teams building prototypes or production systems that require reprogrammable logic, moderate on-chip memory, and a sizable I/O footprint while operating within a commercial temperature range. Refer to the FLEX 10K family documentation for development tool support and family-level megafunctions that complement the device.

Request a quote or submit an inquiry to get pricing and availability for the EPF10K50SQC240-3N. Our team can provide lead-time and ordering information to help move your design forward.

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