EPF10K50STC144-2X

The EPF10K50STC144-2X from Intel is a FLEX-10KS family field programmable gate array (FPGA) device designed for embedded programmable logic and System-on-a-Programmable-Chip (SOPC) integration. It combines a high-density logic array with on-chip RAM and flexible I/O in a 144-pin LQFP package for commercial embedded applications.

Use cases include implementing megafunctions (efficient memory and specialized logic), general programmable logic, interface bridging, and system-level integration where on-chip RAM and configurable I/O are required. The device is RoHS compliant and offered in a surface-mount 144-LQFP package.

Key Features

• Logic Capacity  2,880 logic elements and approximately 199,000 gates provide substantial programmable logic resources for mid-density designs.
• Embedded Memory  Approximately 40,960 bits of on-chip RAM to support data buffering, small RAM-based functions, and megafunction implementations.
• I/O Resources  102 user I/O pins available in the 144-LQFP package to handle multiple external interfaces and peripheral connections.
• Power Supply  Operates from a 2.375 V to 2.625 V supply, enabling integration into systems with compatible power rails.
• Package and Mounting  144-LQFP surface-mount package (supplier device package: 144-TQFP 20×20) for PCB-mounted designs requiring a compact, industry-standard footprint.
• Commercial Temperature Range  Rated for 0 °C to 70 °C operation for commercial-grade embedded systems.
• Series-Level Functional Capabilities  Series features include embedded-array support for megafunctions, dedicated carry and cascade chains for arithmetic and high-fan-in logic, low-skew clock distribution, JTAG boundary-scan test circuitry, programmable I/O options such as open-drain and tri-state control, and clocking options for reduced delay and clock multiplication.
• Standards and Compliance  RoHS compliant per the provided product data.

Typical Applications

• SOPC and Embedded Systems  Implement system-level programmable logic blocks and megafunctions where integrated RAM and configurable logic elements simplify board-level design.
• Interface Bridging  Use the device’s 102 I/O pins and programmable I/O behavior to translate, buffer, or aggregate signals between subsystems.
• Control and Sequencing  Deploy the FPGA for glue logic, peripheral control, and deterministic state-machine implementations in commercial equipment.
• Prototyping and Development  Mid-density programmable resources and on-chip RAM make the device suitable for design iteration and validation prior to higher-volume deployments.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements paired with approximately 40,960 bits of embedded RAM offers a practical balance for mid-range embedded functions without external RAM.
• Flexible I/O in a Compact Package:  102 user I/Os in a 144-LQFP surface-mount package enable multiple peripheral connections while preserving PCB space.
• Series-Level Integration Features:  Support for dedicated carry/cascade chains, clock distribution trees, and JTAG boundary-scan simplifies common HDL implementations and board-level testing.
• Commercial-Grade Operating Range:  Specified for 0 °C to 70 °C operation and a defined supply range (2.375 V–2.625 V), making power and thermal planning straightforward for commercial designs.
• RoHS Compliant:  Environmentally compliant manufacturing supports regulatory needs for commercial products.

Why Choose EPF10K50STC144-2X?

The EPF10K50STC144-2X positions itself as a mid-density, embedded-programmable solution for designers who need a mix of logic, on-chip RAM, and flexible I/O in a standardized 144-pin LQFP package. Its combination of 2,880 logic elements, approximately 40,960 bits of RAM, and series-level FPGA features supports SOPC-style integration and common embedded functions without relying on multiple discrete components.

This device is well suited for engineers building commercial embedded equipment, prototypes, or system controllers that require configurable logic, modest embedded memory, and a clearly defined supply and temperature envelope. The Intel FLEX-10K family-level features provide a familiar development model and testing options such as JTAG boundary-scan for production validation.

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