EPF10K50VBC356-1
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA |
|---|---|
| Quantity | 1,950 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VBC356-1 – FLEX-10K Field Programmable Gate Array, 356-LBGA
The EPF10K50VBC356-1 is a FLEX 10K family field programmable gate array (FPGA) optimized for system-level integration and mid-range logic designs. It combines a logic array and embedded array blocks to implement custom logic and on-chip memory for embedded and system-on-a-programmable-chip (SOPC) applications.
Key hardware characteristics include 2,880 logic elements, approximately 20,480 bits of embedded RAM, up to 116,000 maximum system gates, and 274 user I/O pins in a 356-ball BGA (35×35) surface-mount package. The device operates from a 3.0 V to 3.6 V supply and is specified for commercial temperature operation (0 °C to 70 °C).
Key Features
- Logic Capacity 2,880 logic elements and a maximum system gate count of 116,000 provide capacity for medium-complexity logic implementations.
- Embedded Memory Approximately 20,480 bits of embedded RAM distributed across embedded array blocks for efficient on-chip buffering and state storage.
- I/O Resources 274 user I/O pins support multiple external interfaces and signal-rich designs while enabling flexible board-level integration.
- Reconfiguration and Test In-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port and built-in IEEE 1149.1 boundary-scan support for board-level testing.
- Clocking and Performance Options Built-in low-skew clock distribution trees with ClockLock and ClockBoost options available within the FLEX 10K family to manage clock delay, skew, and multiplication requirements.
- Dedicated Logic Structures Dedicated carry and cascade chains available for efficient implementation of arithmetic and high-fan-in functions.
- Package and Mounting 356-ball LBGA (356-BGA, 35×35) surface-mount package for compact board footprint and high pin density.
- Power and Environmental Operates from 3.0 V to 3.6 V and is RoHS compliant; specified for commercial-grade ambient temperatures (0 °C to 70 °C).
Typical Applications
- Embedded Systems Implement custom control logic, glue logic, and SOPC components where moderate logic density and embedded RAM are required.
- Memory and Buffer Management Use the device's embedded RAM blocks for small on-chip buffers, FIFOs, or temporary data storage in streaming or packetized systems.
- Interface and I/O Aggregation Consolidate multiple external signals and protocol interfaces using the device’s 274 user I/Os to simplify board-level routing and reduce external glue logic.
- Prototyping and Custom Logic Rapidly iterate and validate mid-complexity digital designs with in-circuit reconfigurability and boundary-scan test support.
Unique Advantages
- Balanced Logic and Memory: Combines 2,880 logic elements with roughly 20.5 kbits of embedded RAM to support mixed logic-plus-memory functions on a single device.
- Strong I/O Count: 274 user I/Os enable consolidation of multiple interfaces and reduce the need for external interfacing components.
- Field Reconfigurability: In-circuit reconfiguration and JTAG boundary-scan support simplify updates and board-level validation.
- Compact High-Density Package: 356-LBGA (35×35) surface-mount package delivers high pin density in a compact footprint for space-constrained PCBs.
- Commercial Temperature and RoHS Compliance: Designed for mainstream electronic products with a 0 °C to 70 °C operating range and RoHS compliance for regulatory alignment.
- FLEX 10K Tooling Support: Supported by FLEX 10K family design features such as automated place-and-route and family-level clock and interconnect optimizations, enabling faster design cycles.
Why Choose EPF10K50VBC356-1?
The EPF10K50VBC356-1 offers a practical balance of logic density, embedded memory, and I/O resources in a compact 356-LBGA package, making it well suited for embedded systems, interface consolidation, and mid-complexity custom logic implementations. Its support for in-circuit reconfiguration, JTAG boundary-scan, and family-level clock and interconnect features helps shorten development and test cycles.
This device is ideal for designers and OEMs who need a commercially graded FPGA with on-chip RAM and a substantial I/O count for consolidating board-level functions, while benefiting from FLEX 10K family design support and established tool flows.
Request a quote or submit a parts inquiry to check pricing and availability for the EPF10K50VBC356-1.

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