EPF10K50VBC356-1

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA

Quantity 1,950 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O274Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VBC356-1 – FLEX-10K Field Programmable Gate Array, 356-LBGA

The EPF10K50VBC356-1 is a FLEX 10K family field programmable gate array (FPGA) optimized for system-level integration and mid-range logic designs. It combines a logic array and embedded array blocks to implement custom logic and on-chip memory for embedded and system-on-a-programmable-chip (SOPC) applications.

Key hardware characteristics include 2,880 logic elements, approximately 20,480 bits of embedded RAM, up to 116,000 maximum system gates, and 274 user I/O pins in a 356-ball BGA (35×35) surface-mount package. The device operates from a 3.0 V to 3.6 V supply and is specified for commercial temperature operation (0 °C to 70 °C).

Key Features

  • Logic Capacity  2,880 logic elements and a maximum system gate count of 116,000 provide capacity for medium-complexity logic implementations.
  • Embedded Memory  Approximately 20,480 bits of embedded RAM distributed across embedded array blocks for efficient on-chip buffering and state storage.
  • I/O Resources  274 user I/O pins support multiple external interfaces and signal-rich designs while enabling flexible board-level integration.
  • Reconfiguration and Test  In-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port and built-in IEEE 1149.1 boundary-scan support for board-level testing.
  • Clocking and Performance Options  Built-in low-skew clock distribution trees with ClockLock and ClockBoost options available within the FLEX 10K family to manage clock delay, skew, and multiplication requirements.
  • Dedicated Logic Structures  Dedicated carry and cascade chains available for efficient implementation of arithmetic and high-fan-in functions.
  • Package and Mounting  356-ball LBGA (356-BGA, 35×35) surface-mount package for compact board footprint and high pin density.
  • Power and Environmental  Operates from 3.0 V to 3.6 V and is RoHS compliant; specified for commercial-grade ambient temperatures (0 °C to 70 °C).

Typical Applications

  • Embedded Systems  Implement custom control logic, glue logic, and SOPC components where moderate logic density and embedded RAM are required.
  • Memory and Buffer Management  Use the device's embedded RAM blocks for small on-chip buffers, FIFOs, or temporary data storage in streaming or packetized systems.
  • Interface and I/O Aggregation  Consolidate multiple external signals and protocol interfaces using the device’s 274 user I/Os to simplify board-level routing and reduce external glue logic.
  • Prototyping and Custom Logic  Rapidly iterate and validate mid-complexity digital designs with in-circuit reconfigurability and boundary-scan test support.

Unique Advantages

  • Balanced Logic and Memory:  Combines 2,880 logic elements with roughly 20.5 kbits of embedded RAM to support mixed logic-plus-memory functions on a single device.
  • Strong I/O Count:  274 user I/Os enable consolidation of multiple interfaces and reduce the need for external interfacing components.
  • Field Reconfigurability:  In-circuit reconfiguration and JTAG boundary-scan support simplify updates and board-level validation.
  • Compact High-Density Package:  356-LBGA (35×35) surface-mount package delivers high pin density in a compact footprint for space-constrained PCBs.
  • Commercial Temperature and RoHS Compliance:  Designed for mainstream electronic products with a 0 °C to 70 °C operating range and RoHS compliance for regulatory alignment.
  • FLEX 10K Tooling Support:  Supported by FLEX 10K family design features such as automated place-and-route and family-level clock and interconnect optimizations, enabling faster design cycles.

Why Choose EPF10K50VBC356-1?

The EPF10K50VBC356-1 offers a practical balance of logic density, embedded memory, and I/O resources in a compact 356-LBGA package, making it well suited for embedded systems, interface consolidation, and mid-complexity custom logic implementations. Its support for in-circuit reconfiguration, JTAG boundary-scan, and family-level clock and interconnect features helps shorten development and test cycles.

This device is ideal for designers and OEMs who need a commercially graded FPGA with on-chip RAM and a substantial I/O count for consolidating board-level functions, while benefiting from FLEX 10K family design support and established tool flows.

Request a quote or submit a parts inquiry to check pricing and availability for the EPF10K50VBC356-1.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up