EPF10K50VBC356-2

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA

Quantity 872 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O274Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VBC356-2 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA

The EPF10K50VBC356-2 is a FLEX 10K family FPGA from Intel designed for embedded programmable logic applications. It combines a dedicated logic array and embedded memory resources to support system-level integration and custom digital functions.

With 2,880 logic elements, 20,480 bits of embedded RAM, up to 274 user I/O pins and a 3.0–3.6 V supply range, this commercial-grade device is suited to embedded systems, interface bridging and custom logic integration where reconfigurability and on-chip memory are required.

Key Features

  • Logic Capacity  Provides 2,880 logic elements and a maximum system gate count consistent with FLEX 10K family characteristics, enabling moderate-density programmable logic implementations.
  • Embedded Memory  Includes 20,480 total RAM bits (embedded array blocks in the FLEX 10K architecture) to support buffers, FIFOs and on-chip data storage without consuming fabric logic.
  • I/O and Interfaces  Up to 274 user I/O pins allow flexible connectivity for parallel buses, control signals and peripheral interfaces; I/O features in the FLEX 10K family include programmable output slew-rate and individual tri-state control.
  • Reconfiguration and Test  Supports in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan circuitry compliant with IEEE Std. 1149.1 for board-level test and debug.
  • Clock and Interconnect  FLEX 10K architecture provides low-skew clock distribution, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and a continuous routing structure for predictable interconnect delays.
  • Power and Operating Range  Operates from 3.0 V to 3.6 V and is specified for commercial temperature operation from 0 °C to 70 °C.
  • Package and Mounting  Surface-mount 356-LBGA (356-BGA, 35 × 35 mm) package for high pin-count board designs and compact board-area efficiency.
  • Compliance  RoHS compliant, meeting common lead-free assembly requirements.

Typical Applications

  • Embedded systems  On-chip logic and embedded RAM support SOPC-style integration and control logic in embedded applications.
  • Interface bridging and protocol glue  High I/O count and programmable I/O features make the device suitable for implementing bus interface logic and protocol converters, including designs that leverage FLEX 10K series PCI support where applicable.
  • Custom logic and hardware acceleration  Use the device for mid-range combinational and sequential logic, counters, and arithmetic functions using dedicated carry and cascade chains.
  • Prototyping and in-system reconfigurable designs  In-circuit reconfigurability and JTAG support enable iterative development, board bring-up and functional verification.

Unique Advantages

  • Balanced logic and memory  2,880 logic elements paired with 20,480 bits of embedded RAM let you implement control logic and local data storage without external memory in many designs.
  • High I/O density  Up to 274 user I/O pins provide flexibility for complex interfacing and multiple peripheral connections on a single device.
  • Design-for-test and debug  IEEE 1149.1 JTAG boundary-scan support simplifies board-level test, debugging and in-system configuration.
  • Compact high-pin package  356-LBGA surface-mount package delivers a high pin count in a compact footprint to save board space while supporting dense routing.
  • RoHS compliant  Leverages lead-free compliance to meet common environmental and manufacturing requirements.

Why Choose EPF10K50VBC356-2?

EPF10K50VBC356-2 is positioned for designers who need a mid-density, reconfigurable logic device with on-chip memory and a large I/O complement in a compact BGA package. Its combination of 2,880 logic elements, 20,480 bits of RAM and 274 I/Os provides a balanced platform for embedded control, interfacing and custom logic integration within commercial-temperature systems.

As a member of the FLEX 10K family, this device benefits from family-level architecture features such as in-circuit reconfigurability, dedicated arithmetic/cascade chains and software design support for synthesis and place-and-route, helping to reduce development time and integration risk.

Request a quote or submit an inquiry to purchase EPF10K50VBC356-2 today.

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