EPF10K50VBC356-2
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA |
|---|---|
| Quantity | 872 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 116000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20480 |
Overview of EPF10K50VBC356-2 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA
The EPF10K50VBC356-2 is a FLEX 10K family FPGA from Intel designed for embedded programmable logic applications. It combines a dedicated logic array and embedded memory resources to support system-level integration and custom digital functions.
With 2,880 logic elements, 20,480 bits of embedded RAM, up to 274 user I/O pins and a 3.0–3.6 V supply range, this commercial-grade device is suited to embedded systems, interface bridging and custom logic integration where reconfigurability and on-chip memory are required.
Key Features
- Logic Capacity Provides 2,880 logic elements and a maximum system gate count consistent with FLEX 10K family characteristics, enabling moderate-density programmable logic implementations.
- Embedded Memory Includes 20,480 total RAM bits (embedded array blocks in the FLEX 10K architecture) to support buffers, FIFOs and on-chip data storage without consuming fabric logic.
- I/O and Interfaces Up to 274 user I/O pins allow flexible connectivity for parallel buses, control signals and peripheral interfaces; I/O features in the FLEX 10K family include programmable output slew-rate and individual tri-state control.
- Reconfiguration and Test Supports in-circuit reconfigurability via external configuration devices or JTAG; includes JTAG boundary-scan circuitry compliant with IEEE Std. 1149.1 for board-level test and debug.
- Clock and Interconnect FLEX 10K architecture provides low-skew clock distribution, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and a continuous routing structure for predictable interconnect delays.
- Power and Operating Range Operates from 3.0 V to 3.6 V and is specified for commercial temperature operation from 0 °C to 70 °C.
- Package and Mounting Surface-mount 356-LBGA (356-BGA, 35 × 35 mm) package for high pin-count board designs and compact board-area efficiency.
- Compliance RoHS compliant, meeting common lead-free assembly requirements.
Typical Applications
- Embedded systems On-chip logic and embedded RAM support SOPC-style integration and control logic in embedded applications.
- Interface bridging and protocol glue High I/O count and programmable I/O features make the device suitable for implementing bus interface logic and protocol converters, including designs that leverage FLEX 10K series PCI support where applicable.
- Custom logic and hardware acceleration Use the device for mid-range combinational and sequential logic, counters, and arithmetic functions using dedicated carry and cascade chains.
- Prototyping and in-system reconfigurable designs In-circuit reconfigurability and JTAG support enable iterative development, board bring-up and functional verification.
Unique Advantages
- Balanced logic and memory 2,880 logic elements paired with 20,480 bits of embedded RAM let you implement control logic and local data storage without external memory in many designs.
- High I/O density Up to 274 user I/O pins provide flexibility for complex interfacing and multiple peripheral connections on a single device.
- Design-for-test and debug IEEE 1149.1 JTAG boundary-scan support simplifies board-level test, debugging and in-system configuration.
- Compact high-pin package 356-LBGA surface-mount package delivers a high pin count in a compact footprint to save board space while supporting dense routing.
- RoHS compliant Leverages lead-free compliance to meet common environmental and manufacturing requirements.
Why Choose EPF10K50VBC356-2?
EPF10K50VBC356-2 is positioned for designers who need a mid-density, reconfigurable logic device with on-chip memory and a large I/O complement in a compact BGA package. Its combination of 2,880 logic elements, 20,480 bits of RAM and 274 I/Os provides a balanced platform for embedded control, interfacing and custom logic integration within commercial-temperature systems.
As a member of the FLEX 10K family, this device benefits from family-level architecture features such as in-circuit reconfigurability, dedicated arithmetic/cascade chains and software design support for synthesis and place-and-route, helping to reduce development time and integration risk.
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