EPF10K50VBC356-3N

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 274 20480 2880 356-LBGA

Quantity 586 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O274Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VBC356-3N – FLEX-10K® Field Programmable Gate Array, 2,880 logic elements

The EPF10K50VBC356-3N is a FLEX 10K family field programmable gate array (FPGA) packaged in a 356-LBGA. It combines a logic array and embedded array blocks to implement general logic alongside dedicated megafunctions such as on-chip memory and specialized logic structures.

Designed for commercial embedded applications, this device delivers a balance of logic capacity, on-chip RAM, and flexible I/O in a space-efficient BGA package, and is suitable for system-level integration including System-on-a-Programmable-Chip (SOPC) implementations.

Key Features

  • Core — FLEX 10K architecture 2,880 logic elements and 360 logic array blocks (LABs) provide the device’s core programmable fabric for implementing combinational and sequential logic.
  • Logic capacity Up to 116,000 maximum system gates (device-specific typical gates and system gate figures are defined by the FLEX 10K family).
  • Embedded memory 20,480 total RAM bits implemented across embedded array blocks (EABs) for on-chip storage and memory-mapped megafunctions.
  • I/O capability 274 user I/O pins with per-pin features such as individual tri-state output enable, open-drain option, and programmable output slew-rate control for flexible interface design.
  • Supply and temperature Single-supply operation from 3.0 V to 3.6 V; commercial operating temperature range of 0 °C to 70 °C.
  • Package and mounting 356-LBGA package (356-BGA, 35 × 35) optimized for surface-mount PCB assembly and high pin-count routing.
  • In-system configurability and test Supports in-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE 1149.1 JTAG boundary-scan test circuitry is available without consuming device logic.
  • System-level features Integrated features from the FLEX 10K family such as FastTrack continuous routing, dedicated carry and cascade chains, low-skew clock distribution, and ClockLock/ClockBoost options help implement high-performance arithmetic and clocking structures.
  • Compliance RoHS compliant and supplied as a commercial-grade device.

Typical Applications

  • SOPC and embedded controllers — Use the embedded arrays and logic fabric to integrate memory and specialized functions into system-on-programmable-chip designs.
  • Memory-intensive logic — On-chip RAM and EABs support buffering, small data stores, and megafunctions without external memory in many applications.
  • Peripheral and bus interfacing — FLEX 10K family support for PCI Local Bus Specification (as documented for FLEX 10K devices) and flexible I/O make the device suitable for interface and bridging logic.
  • I/O-rich control and glue logic — High I/O count and per-pin control are useful for protocol translation, sensor aggregation, and board-level control tasks.

Unique Advantages

  • Balanced logic and memory — 2,880 logic elements combined with 20,480 bits of embedded RAM enable mixed compute-and-data tasks on a single device, reducing the need for external components.
  • Flexible I/O control — Per-pin tri-state enable, open-drain option, and slew-rate programmability simplify interface design and signal integrity tuning.
  • In-system reconfigurability and testability — JTAG boundary-scan and in-circuit reconfiguration options streamline development, deployment, and field updates without consuming user logic.
  • Proven system features — Dedicated carry/cascade chains, FastTrack routing, and low-skew clock trees facilitate efficient implementation of arithmetic functions and timing-sensitive designs.
  • Space-efficient packaging — 356-LBGA package supports high pin count and board area savings for dense designs.
  • Vendor toolchain support — FLEX 10K family devices are supported by Altera development systems for design entry, place-and-route, and megafunction generation (as documented for the family).

Why Choose EPF10K50VBC356-3N?

EPF10K50VBC356-3N brings a practical mix of logic, embedded memory, and I/O capability in a commercial-grade FLEX 10K device. Its 2,880 logic elements, 20,480 bits of on-chip RAM, and comprehensive system features make it a strong candidate for embedded system integration where compact packaging and in-system configurability are important.

The device is well suited to engineering teams building SOPC solutions, interface logic, and memory-backed megafunctions who need predictable routing, dedicated arithmetic chains, and on-board testability, with the development ecosystem and documentation available for the FLEX 10K family.

Request a quote or submit an inquiry to obtain pricing and availability for EPF10K50VBC356-3N.

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