EPF10K50VBI356-4

The EPF10K50VBI356-4 is an Intel FLEX-10K series field programmable gate array (FPGA) in a 356-ball LGA/BGA package designed for industrial applications. It combines a dedicated logic array and embedded array blocks to implement custom logic, on-chip memory, and system-level functions for embedded and industrial designs.

With 2,880 logic elements, approximately 20,480 bits of embedded memory, and 274 user I/O pins, this device addresses mid-density programmable logic needs where integration, reconfigurability, and a robust temperature range matter.

Key Features

• Core architecture — FLEX 10K family architecture featuring separate embedded array blocks and a general-purpose logic array for megafunction and custom logic implementation.
• Logic capacity — 2,880 logic elements and 360 LABs to implement combinational and sequential logic functions.
• Embedded memory — Approximately 20,480 bits of on-chip RAM provided by multiple embedded array blocks for data buffering and small-footprint storage.
• I/O and interconnect — 274 user I/O pins with programmable output features and flexible interconnect structure for predictable routing.
• Configuration and test — Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1 for board-level test and configuration.
• Power and supply — Operates from a 3.0 V to 3.6 V supply range suitable for 3.3 V systems.
• Package and mounting — 356-LBGA package (356-BGA, 35×35 mm) in a surface-mount form factor; FineLine BGA style maximizes board space efficiency.
• Temperature and grade — Industrial-grade device with an operating temperature range of −40 °C to 85 °C.
• Regulatory compliance — RoHS compliant.

Typical Applications

• Industrial control and automation — Implement custom control logic, sensor interfacing, and deterministic I/O handling within industrial temperature requirements.
• Embedded systems — Integrate glue logic, peripheral interfacing, and small on-chip memory for application-specific processing and system glue functions.
• Communications and networking — Provide protocol bridging, parallel-to-serial interfaces, and user-defined I/O handling for mid-density networking functions.
• Prototyping and custom logic — Rapidly evaluate and iterate hardware functions using in-circuit reconfigurability and JTAG-supported development flows.

Unique Advantages

• Balanced logic and memory: 2,880 logic elements paired with approximately 20,480 bits of embedded RAM for combined logic and buffer requirements.
• High I/O count: 274 user I/O pins enable extensive external interfacing without external expander devices.
• Industrial temperature rating: −40 °C to 85 °C operation supports deployment in industrial environments.
• Flexible configuration and test: In-circuit reconfigurability and IEEE-1149.1 JTAG boundary-scan support simplify board-level bring-up and manufacturing test.
• Space-efficient packaging: 356-ball BGA package (35×35 mm) for compact board designs while maintaining signal density.
• Standards-based development support: FLEX 10K family devices are supported by vendor development tools and automatic place-and-route flows described in the device family documentation.

Why Choose EPF10K50VBI356-4?

The EPF10K50VBI356-4 provides a mid-density, industrial-grade programmable logic option that combines dedicated embedded memory blocks with several thousand logic elements and a high I/O count. Its FLEX-10K architecture and support for in-circuit reconfiguration and JTAG make it suitable for designs that require field-updateable logic and structured board-level testability.

This device is well suited to engineers and procurement teams building industrial and embedded systems who need a compact, reconfigurable FPGA with verified RoHS compliance, a broad operating temperature range, and package options that save board space while offering high I/O density.

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