EPF10K50VFC484-3

The EPF10K50VFC484-3 is a FLEX-10K family Field Programmable Gate Array (FPGA) in a 484-ball BGA package designed for commercial embedded logic applications. Built around a dedicated logic array and embedded memory blocks, this device targets system integration tasks that require reconfigurable logic, on-chip RAM, and a high pin count for peripheral interfacing.

With 2,880 logic elements, approximately 20,480 bits of embedded RAM, and up to 291 user I/O pins in a compact 484-BBGA package, the part delivers a balanced mix of logic capacity, embedded memory, and I/O density for mid-range FPGA designs operating from 3.0 V to 3.6 V.

Key Features

• Logic Capacity — 2,880 logic elements and 360 logic array blocks providing a maximum system gate count of 116,000 for mid-range logic integration and custom digital functions.
• Embedded Memory — 20,480 total RAM bits distributed in embedded array blocks for implementing on-chip buffers, small memories, and megafunctions.
• I/O and Interfaces — Up to 291 user I/O pins to support a wide range of peripheral connections and board-level interfaces.
• Supply and Temperature — Operates from 3.0 V to 3.6 V with a commercial operating range of 0 °C to 70 °C, suitable for typical commercial electronics environments.
• Package and Mounting — 484-BBGA package; supplier device package noted as 484-FBGA (23×23). Surface-mount mounting type enables PCB space efficiency.
• Series-level Integration Features — FLEX 10K family capabilities include in-circuit reconfigurability (ICR), JTAG boundary-scan test circuitry, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and low-skew clock distribution options such as ClockLock and ClockBoost.
• RoHS Compliant — Device complies with RoHS environmental requirements.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) Integration — Use the embedded array blocks and logic elements to implement megafunctions and consolidate discrete components into a reconfigurable system block.
• Memory-Intensive Custom Logic — On-chip RAM (20,480 bits) supports buffering, small lookup tables, and data-path storage for custom processing pipelines.
• Peripheral and Interface Bridging — High I/O count (291 pins) enables bridging between multiple buses, sensors, and peripheral devices in commercial equipment.
• Prototyping and Development — Reconfigurability and built-in JTAG support facilitate iterative design and in-circuit programming during development cycles.

Unique Advantages

• Balanced Logic and Memory — 2,880 logic elements combined with 20,480 bits of embedded RAM provide flexibility to implement both control logic and local data storage without external memory for many mid-range tasks.
• High I/O Density — 291 user I/O pins in a 484-ball BGA package enable complex board-level connectivity while preserving PCB area.
• Reconfigurability — In-circuit reconfigurability and JTAG boundary-scan support accelerate updates and testing without consuming device logic resources.
• Dedicated Arithmetic and Logic Paths — Built-in carry and cascade chains allow efficient implementation of adders, counters, and wide combinational logic using the device’s routing resources.
• Commercial-Grade Power Envelope — Designed for 3.0 V–3.6 V systems common to commercial electronics, enabling straightforward integration into existing power rails.
• Regulatory Compliance — RoHS compliance supports environmental and manufacturing requirements for commercial products.

Why Choose EPF10K50VFC484-3?

The EPF10K50VFC484-3 positions itself as a practical mid-range FPGA choice for commercial applications that require a balance of logic density, embedded memory, and a high I/O count in a compact BGA package. Its FLEX 10K family capabilities—such as in-circuit reconfigurability, dedicated arithmetic/cascade chains, and JTAG boundary-scan—help streamline development, testing, and system integration.

This device is ideal for design teams building reconfigurable logic solutions, SOPC implementations, or peripheral interface bridges where board space, moderate logic capacity, and embedded RAM are key considerations. RoHS compliance and standard commercial temperature grading provide predictable manufacturing and deployment characteristics for commercial electronic products.

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